公开(公告)号：WO2017062798A1

公开(公告)日：2017-04-13

申请号：PCT/US2016/056042

申请日：2016-10-07

Applicant: CORNING INCORPORATED

Inventor： JIN, Yuhui ,  WILHELM, Matthew Evan

IPC: C03B33/02 ,  B23K26/386 ,  C03C15/00

CPC classification number: G06K9/00013 ,  B23K26/0006 ,  B23K26/0057 ,  B23K26/382 ,  B23K26/386 ,  B23K26/389 ,  B23K26/402 ,  B23K26/53 ,  B23K2201/42 ,  B23K2203/54 ,  C03B33/0222 ,  C03C15/00 ,  C03C17/36 ,  C03C17/3649 ,  C03C17/3668 ,  C03C21/002 ,  C03C23/0025 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/22 ,  H05K3/4038 ,  H05K5/0017 ,  H05K2201/09509 ,  H05K2201/10151

Abstract: A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than (8) to (1).

Abstract translation: 提供了一种包括可镀金属的通孔和相关工艺的玻璃传感器基板。 玻璃基板具有第一主表面，第二主表面和大于0.3mm的平均厚度。 通过在预定图案中将激光引导到基板上，通过玻璃基板产生多个蚀刻路径。 通过玻璃基板的多个通孔使用氢氧化物蚀刻材料沿着蚀刻路径蚀刻。 基于氢氧化物的蚀刻材料高度优先地蚀刻沿着蚀刻路径的衬底。 多个通孔中的每一个比其直径长，例如使得玻璃基板的厚度与每个通孔的最大直径的比率大于（8）至（1）。

公开(公告)号：WO2017062798A8

公开(公告)日：2017-04-13

申请号：PCT/US2016/056042

申请日：2016-10-07

Applicant: CORNING INCORPORATED

Inventor： JIN, Yuhui ,  WILHELM, Matthew Evan

IPC: C03B33/02 ,  B23K26/386 ,  C03C15/00

Abstract: A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than (8) to (1).

Abstract translation: 提供了包括可金属化通孔和相关工艺的玻璃传感器基板。 玻璃基板具有第一主表面，第二主表面和大于0.3mm的平均厚度。 通过在衬底上以预定图案引导激光，穿过玻璃衬底产生多个蚀刻路径。 使用基于氢氧化物的蚀刻材料沿着蚀刻路径蚀刻穿过玻璃基板的多个贯通孔。 基于氢氧化物的蚀刻材料沿蚀刻路径高度优先蚀刻衬底。 例如，多个通孔中的每一个与其直径相比较长，使得玻璃基板的厚度与每个通孔的最大直径之比大于（8）至（1）。