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Patent Agency Ranking
公开(公告)号：WO2020263748A1
公开(公告)日：2020-12-30
申请号：PCT/US2020/038960
申请日：2020-06-22
Applicant: CREE, INC.
Inventor： ANDREWS, Peter, Scott , BLAKELY, Colin , REIHERZER, Jesse , PUN, Arthur, F.
Abstract: Solid-state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. LED packages are disclosed that include an LED chip with multiple discrete active layer portions mounted on a submount. The LED packages may further include wavelength conversion elements and light-altering materials. The multiple discrete active layer portions may be electrically connected in series, parallel, or in individually addressable arrangements. The LED chip with the multiple discrete active layer portions may provide the LED package with improved brightness, improved alignment, simplified manufacturing, and reduced costs.
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公开(公告)号：WO2019203950A1
公开(公告)日：2019-10-24
申请号：PCT/US2019/021393
申请日：2019-03-08
Applicant: CREE, INC.
Inventor： DAMBORSKY, Kyle , MILLER, Derek , VU, Jack , ANDREWS, Peter, Scott , CABALU, Jasper , BLAKELY, Colin , REIHERZER, Jesse
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly packaged LEDs with light-altering materials are disclosed. A light-altering material is provided in particular configurations within an LED package to redirect light from an LED chip within the LED package and contribute to a desired emission pattern of the LED package. The light-altering material may also block light from the LED chip from escaping in a non-desirable direction, such as large or wide angle emissions. The light-altering material may be arranged on a lumiphoric material adjacent to the LED chip in various configurations. The LED package may include an encapsulant on the light-altering material and the lumiphoric material.
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公开(公告)号：WO2021067821A1
公开(公告)日：2021-04-08
申请号：PCT/US2020/054088
申请日：2020-10-02
Applicant: CREE, INC.
Inventor： FRANCIS, Aaron , DAMBORSKY, Kyle , WILCOX, Robert , CABALU, Jasper , BLAKELY, Colin
IPC: H01L25/075 , H01L33/50 , F21K99/00
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages (10) are disclosed herein with arrangements of LED chips (28-1, 28-2) and corresponding lumiphoric regions (42-1, 42-2) that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages (10) are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.
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公开(公告)号：WO2020205229A1
公开(公告)日：2020-10-08
申请号：PCT/US2020/023140
申请日：2020-03-17
Applicant: CREE, INC.
Inventor： HUSSELL, Christopher P. , DZYUBENKO, Boris , BLAKELY, Colin
Abstract: Active control of LEDs, LED packages, and related LED displays by way of pulse wide modulation (PWM) is disclosed. Effective PWM frequencies for LEDs are increased by segmenting duty cycles in which LEDs are electrically activated within individual PWM periods. Segmented duty cycles may be provided by transforming or re-ordering a sequence in which control signals are provided to LEDs. As such, LEDs may be electrically activated and deactivated multiple times within each PWM period. Active electrical elements that are incorporated into one or more LED packages of an LED display may be capable of segmenting the duty cycle within each LED package. Active electrical elements may also be capable of receiving reset signals from a data stream to either initiate a reset action or pass the reset signals along to other active electrical elements of a display.
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公开(公告)号：WO2017059028A1
公开(公告)日：2017-04-06
申请号：PCT/US2016/054372
申请日：2016-09-29
Applicant: CREE, INC.
Inventor： BERGMANN, Michael John , DONOFRIO, Matthew , ANDREWS, Peter Scott , BLAKELY, Colin , GOULD, Troy , VU, Jack
CPC classification number: H01L33/60 , H01L25/0753 , H01L25/167 , H01L33/06 , H01L33/10 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/382 , H01L33/387 , H01L33/405 , H01L33/44 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/14 , H01L2224/16225 , H01L2933/0041
Abstract: Flip chip LEDs (200) incorporate multi-layer reflectors and light- transmissive substrates (205) patterned (207) along internal surface (204) adjacent to semiconductor layers (211, 212). The multi¬ layer reflector includes metal layer (232) and dielectric layer (230) containing conductive vias (231). Portions of the multi-layer reflector may wrap around LED mesa (219) including active region (215), while being covered with passivation material (240). Patterned substrate together with multi-layer reflector enable reduction of optical losses. A light-transmissive fillet material proximate to edges of the LED chip may enable adequate coverage with lumiphoric material. The chip may be elevated with increased thickness of solder material and/or contacts, and may reduce luminous losses when reflective materials are present on a submount. Methods for coating chips with lumiphoric material include one or more of: angled spray coating, fillet formation prior to spray coating, stencil island coating, and releasable tape coating.
Abstract translation: 倒装芯片LED（200）包括多层反射器和透光性衬底（205），其与邻近半导体层（211,212）的内表面（204）构图（207）。 多层反射器包括金属层（232）和包含导电通孔（231）的电介质层（230）。 多层反射器的一部分可以包围有活性区域（215）的LED台面（219），同时被钝化材料（240）覆盖。 图案化的基板与多层反射器一起可以减少光学损耗。 靠近LED芯片的边缘的透光圆角材料可以使得能够利用液体材料进行足够的覆盖。 当焊料材料和/或触点的厚度增加时，芯片可以升高，并且当反射材料存在于底座上时可以减少发光损失。 用荧光材料涂覆芯片的方法包括以下一种或多种：成角度的喷涂，喷涂前的圆角形成，模板岛涂层和可剥离的带涂层。
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