公开(公告)号：WO2021239984A1

公开(公告)日：2021-12-02

申请号：PCT/EP2021/064423

申请日：2021-05-28

Applicant: DANFOSS SILICON POWER GMBH

Inventor： BICAKCI, Aylin ,  BECKER, Martin ,  MÜLLER, Zeno

IPC: H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L25/07

Abstract: A method of assembling a semiconductor component is described, wherein the semiconductor component comprises a substrate and one or more components mounted on the substrate, the method comprising: placing an electrical connection structure on the substrate of the semiconductor component and/or on one or more of the one or more components of the semiconductor component; using a molding press to apply pressure to the electrical connection structure, the substrate and the one or more components of the semiconductor component; and introducing a molding compound into the molding press, thereby encapsulating the semiconductor component.

公开(公告)号：WO2020094411A1

公开(公告)日：2020-05-14

申请号：PCT/EP2019/079023

申请日：2019-10-24

Applicant: DANFOSS SILICON POWER GMBH

Inventor： MÜLLER, Zeno ,  FILIPIAK-RESSEL, Tino ,  BEER, Holger ,  PAULSEN, Lars ,  STREIBEL, Alexander

IPC: B29C45/14 ,  B29L31/34 ,  H01L21/56

Abstract: A mold tool (1) is described for molding a semiconductor power module having an electrical contact pin (2) which comprises an electrical contact portion (3) for contacting a substrate (4) with another electrical component. The pin (2) comprises a protruding portion (5) being a top-sided pin connector. The mold tool (1) comprises a first (6) and a second mold die which, when brought together for molding, form a cavity to be filled with a mold compound for encapsulating electrical components of the semiconductor power module, and a recess (7) in the first die 6 which communicates with the cavity within the second die. The recess (7) is filled with a cushion-like soft material (8) into which the top-sided pin connector is pushed thereinto and completely surrounded by the soft material so that a sealing means is formed that prevents any contamination of the electrical contact portion (3) of the pin (2) by the molding compound introduced into the cavity. Furthermore, a method of manufacturing such a semiconductor power module is described.