公开(公告)号：WO0017724A9

公开(公告)日：2001-04-05

申请号：PCT/US9920932

申请日：1999-09-13

Applicant: GEN SCANNING INC

Inventor： CAHILL STEVEN P ,  HUNTER BRADLEY L

IPC: G01B11/00 ,  G01B21/00 ,  G01S17/06 ,  G05D3/00 ,  G12B5/00 ,  H01L21/027 ,  H01L21/68 ,  H02K41/03 ,  G05F1/00 ,  H02K41/00

CPC classification number: H02K41/031 ,  H02K7/08 ,  H02K7/14 ,  H02K16/00 ,  H02K2201/18

Abstract: A high-speed precision positioning apparatus has a stage (102) supported by a platen (104). The stage is driven by a plurality of drive motors (112a, 112b, 112c, 112d) that are co-planar with the stage and arranged symmetrically around the stage. The drive motors apply drive forces directly to the stage without any mechnical contact to the stage. The drive forces impart planar motion to the stage in at least three degrees of freedom of motion. In the remaining three degrees of freedom the motion is constrained by a plurality of fluid bearings (144a, 144b, 144c, 144d) that operate between the stage and the platen. The drive motors are configured as magnets, attached to the stage, moving in a gap formed in-between top and bottom stationary coils. Integral force cancellation is implemented by a force cancellation system that applies cancellation forces to the stage. The cancellation forces, which are co-planar with a center of gravity of the stage and any components that move with the stage, cancel forces generated by planar motion of the stage. Interferometric encoders are used as position detectors.

Abstract translation: 高速精密定位装置具有由压盘（104）支撑的台（102）。 该台由与舞台共同平行并且围绕舞台对称布置的多个驱动马达（112a，112b，112c，112d）驱动。 驱动电机将驱动力直接施加到舞台上，而不会与舞台机械接触。 驱动力以至少三个自由度赋予平台运动。 在剩余的三个自由度中，运动由在台架和压板之间操作的多个流体轴承（144a，144b，144c，144d）约束。 驱动电动机被配置为附接到平台的磁体，在形成在顶部和底部固定线圈之间的间隙中移动。 积分力消除由力消除系统实现，该系统将抵消力施加到舞台。 与舞台的重心和与舞台一起移动的任何组件共平行的消除力消除了舞台的平面运动产生的力。 干涉测量编码器用作位置检测器。

公开(公告)号：WO0188639A3

公开(公告)日：2002-06-13

申请号：PCT/US0115554

申请日：2001-05-15

Applicant: GEN SCANNING INC ,  HUNTER BRADLEY L ,  CULLEN CHRISTOPHER P

Inventor： HUNTER BRADLEY L ,  CULLEN CHRISTOPHER P

IPC: G05B13/02 ,  G06Q10/00 ,  B23K26/08

CPC classification number: G06Q10/04 ,  G05B13/024

Abstract: Method and subsystem are provided for generating a trajectory to be followed by a motor-driven stage when processing microstructures at a laser-processing site utilizing an estimated change in temperature of motors caused when the motors drive the stage according to a number of possible trajectories. The method includes receiving reference data which represent locations of microstructures to be processed at the site, determining a plurality of possible trajectories based on the data, and estimating a change of temperature of motors caused when the motors drive the stage based on each of the possible trajectories. The method also includes determining a substantially optimum trajectory from the possible trajectories wherein positioning accuracy of the stage is maximized by following the substantially optimum trajectory.

Abstract translation: 提供了方法和子系统，用于当利用根据多个可能的轨迹驱动电机时引起的电动机温度的估计变化来在激光处理部位处理微结构时，产生随后的电动机驱动级的轨迹。 该方法包括接收表示在现场处理的微结构的位置的参考数据，基于该数据确定多个可能的轨迹，以及估计当电动机基于每个可能的驱动阶段引起的电动机的温度变化 轨迹。 该方法还包括从可能的轨迹确定基本上最佳的轨迹，其中阶段的定位精度通过遵循基本上最佳的轨迹而被最大化。

公开(公告)号：WO0188638A3

公开(公告)日：2002-06-13

申请号：PCT/US0115553

申请日：2001-05-15

Applicant: GEN SCANNING INC ,  HUNTER BRADLEY L ,  ANDREI PAUL

Inventor： HUNTER BRADLEY L ,  ANDREI PAUL

IPC: G05B13/02 ,  G06Q10/00 ,  B23K26/08

CPC classification number: G06Q10/04 ,  G05B13/024

Abstract: Method and subsystem are provided for determining a sequence in which microstructures are to be processed at a laser-processing site by taking into account microstructures located near travel limits of a motor-driven stage. The method includes receiving reference data which represent locations of microstructures to be processed at the site and coalescing adjacent groups of microstructures into clusters of microstructures including edge clusters which contain the microstructures located near the travel limits of the motor-driven stage which moves the microstructures relative to a laser beam at the site. The method also includes dividing a cluster fragment from each edge cluster. The cluster fragments contain the microstructures located near the travel limits. The method then includes sorting the clusters and cluster fragments to obtain data which represent a substantially optimum sequence in which the microstructures are to be processed to increase throughput at the site.

Abstract translation: 提供了方法和子系统，用于通过考虑位于电机驱动级的行程极限附近的微结构来确定在激光加工部位处理微结构的序列。 该方法包括接收参考数据，该参考数据表示在该位置处要处理的微结构的位置，并将相邻的微结构组聚结成微观结构的簇，包括边缘簇，其包含位于电动机驱动级的行进极限附近的微结构，所述微结构移动微结构相对 到现场的激光束。 该方法还包括从每个边缘集群划分集群片段。 簇碎片包含位于行程极限附近的微结构。 该方法然后包括对簇和簇片段进行排序以获得代表基本上最佳序列的数据，其中微结构将被处理以增加位点处的产量。

公开(公告)号：WO0187534A2

公开(公告)日：2001-11-22

申请号：PCT/US0115552

申请日：2001-05-15

Applicant: GEN SCANNING INC ,  HUNTER BRADLEY L ,  CAHILL STEVEN P ,  EHRMANN JONATHAN S ,  PLOTKIN MICHAEL

Inventor： HUNTER BRADLEY L ,  CAHILL STEVEN P ,  EHRMANN JONATHAN S ,  PLOTKIN MICHAEL

IPC: B23K26/04 ,  B23K26/08 ,  B23K101/40 ,  G03F7/20 ,  H01L21/82 ,  B23K26/00

CPC classification number: B23K26/046 ,  B23K26/02 ,  B23K26/04 ,  B23K26/043 ,  B23K26/0853 ,  B23K2201/40 ,  G03F7/70041 ,  G03F7/70725

Abstract: A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis. The system also includes a first controller for controlling the x-y stage based on reference data which represents 3-D locations of microstrucutures to be processed within the site, a second controller, and a first voice coil coupled to the second controller for positioning the first air bearing sled along the optical axis also based on the reference data. The reference data is generated by the system which includes a modulator for reducing power of the material-processing laser beam to obtain a probe laser beam to measure height of the semiconductor wafer at a plurality of locations about the site to obtain reference height data. A computer computes a reference surface based on the reference height data. A trajectory planner generates trajectories for the wafer and the waist of the laser beam based on the reference surface. The x-y stage and the first air bearing sled controllably move the wafer and the focusing lens subsystem, respectively, to precisely position the waist of the laser beam so that the waist substantially coincides with the 3-D locations of the microstructures within the site. The system also includes a spot size lens subsystem for controlling size of the waist of the laser beam, a second air bearing sled for moving the spot size lens subsystem along the optical axis, a third controller for controlling the second air bearing sled, and a second voice coil coupled to the third controller for positioning the second air bearing sled along the optical axis.

Abstract translation: 提供了一种用于精确定位材料处理激光束的腰部以动态地补偿位于激光加工部位内间隔开的多个物体上的微结构的局部高度变化的高速方法和系统。 在优选实施例中，微结构是形成在半导体晶片的多个存储芯片上的多条导线。 该系统包括聚焦透镜子系统，用于沿着基本上垂直于平面的光轴聚焦激光束，用于在平面中移动晶片的x-y级，以及用于沿着光轴移动聚焦透镜子系统的第一空气轴承滑座。 该系统还包括第一控制器，用于基于参考数据来控制xy阶段，所述参考数据表示在站点内处理的微结构的3-D位置，第二控制器和耦合到第二控制器的第一音圈，用于将第一空气 沿着光轴的轴承座也基于参考数据。 参考数据由包括用于降低材料处理激光束的功率的调制器的系统产生，以获得探针激光束，以测量位于该位置的多个位置处的半导体晶片的高度，以获得参考高度数据。 计算机根据参考高度数据计算参考曲面。 轨迹计划器基于参考表面产生晶片和激光束的腰部的轨迹。 x-y台和第一空气轴承滑轨分别可控地移动晶片和聚焦透镜子系统，以精确地定位激光束的腰部，使得腰部基本上与位置内的微结构的3-D位置重合。 该系统还包括用于控制激光束腰部尺寸的光斑尺寸透镜子系统，用于沿光轴移动光斑尺寸透镜子系统的第二空气轴承滑动件，用于控制第二空气轴承滑轨的第三控制器，以及 第二音圈耦合到第三控制器，用于沿着光轴定位第二空气轴承滑轨。