OPTICAL ENCODER SYSTEM
    1.
    发明申请
    OPTICAL ENCODER SYSTEM 审中-公开
    光学编码器系统

    公开(公告)号:WO2015147756A1

    公开(公告)日:2015-10-01

    申请号:PCT/SG2015/050041

    申请日:2015-03-18

    IPC分类号: G01D5/34 G01D5/26

    摘要: Optical encoding systems include a generalized cylindrical code scale having one or more regions with different light reflective properties. In an example process, a code scale can be created by coating an elongated generalized cylinder with one or more different layers of materials having different light reflective properties. Portions of these layers can be removed selectively in order to expose a particular overlying material and create a particular pattern of features having different optical characteristics (e.g., absorbing, specularly reflecting, diffusely reflecting).

    摘要翻译: 光学编码系统包括具有一个或多个具有不同光反射特性的区域的广义圆柱形代码量表。 在示例性过程中,可以通过用具有不同光反射性质的一种或多种不同材料层涂覆细长的通用圆柱体来创建代码量表。 可以选择性地去除这些层的一些部分以暴露特定的上覆材料并产生具有不同光学特性(例如,吸收,镜面反射,漫反射)的特征图案。

    OPTICAL DEVICES AND OPTO-ELECTRONIC MODULES AND METHODS FOR MANUFACTURING THE SAME
    3.
    发明申请
    OPTICAL DEVICES AND OPTO-ELECTRONIC MODULES AND METHODS FOR MANUFACTURING THE SAME 审中-公开
    光学装置和光电模块及其制造方法

    公开(公告)号:WO2013091830A1

    公开(公告)日:2013-06-27

    申请号:PCT/EP2012/005224

    申请日:2012-12-18

    IPC分类号: H01L27/146 H01L27/148

    摘要: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of • a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and • b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

    摘要翻译: 光学装置包括包括至少一个光学结构(1)的第一基板(S1),该至少一个光学结构(1)包括主要部分(2)和至少部分地围绕所述主要部分的环绕部分(3)。 该装置还包括施加到所述周围部分上的不透明材料(5,5a,5b)。 所述光电模块包括包含在所述第一衬底中的多个这些光学器件。 制造光学器件的方法包括以下步骤。 a)提供包括至少一个光学结构的第一基板,所述至少一个光学结构包括主要部分和至少部分地围绕所述主要部分的环绕部分; 和。 b)将不透明材料施加到至少所述周围部分上。 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。

    FLASH MODULE WITH SHIELDING FOR USE IN MOBILE PHONES AND OTHER DEVICES
    4.
    发明申请
    FLASH MODULE WITH SHIELDING FOR USE IN MOBILE PHONES AND OTHER DEVICES 审中-公开
    具有屏蔽功能的移动电话和其他设备的闪光模组

    公开(公告)号:WO2014189464A1

    公开(公告)日:2014-11-27

    申请号:PCT/SG2014/000212

    申请日:2014-05-15

    IPC分类号: G03B15/03 F21V8/00 G02B6/00

    摘要: A flash module comprises an optics portion that includes a base plate, a light guide on a first side of the base plate, and a lens element on a second side of the base plate. A casing is attached to the optics portion and defines an interior region in which the lens element is located. An active light emitting component is mounted within the casing. Sidewalls of the light guide are coated with first and second layers of different materials. The second layer is a coating over the first layer and is substantially non-transparent to light emitted by the active light emitting component. The first layer can provide a predetermined aesthetic appearance and can be selected, for example, to match the color of the exterior surface of a device in which the flash module is to be integrated.

    摘要翻译: 闪光模块包括光学部分,其包括基板,在基板的第一侧上的导光体和在基板的第二侧上的透镜元件。 壳体附接到光学部件并且限定透镜元件所在的内部区域。 主动发光部件安装在壳体内。 导光板的侧壁涂有第一层和第二层不同的材料。 第二层是在第一层上的涂层,并且对于由有源发光部件发射的光基本上不透明。 第一层可以提供预定的美学外观,并且可以选择,例如,以匹配闪光模块将被集成在其中的装置的外表面的颜色。

    OPTOELECTRONIC MODULES AND OPTOELECTRONIC MOLDING TOOLS AND PROCESSES FOR MANUFACTURING THE SAME

    公开(公告)号:WO2018101889A1

    公开(公告)日:2018-06-07

    申请号:PCT/SG2017/050590

    申请日:2017-11-30

    摘要: This disclosure describes optoelectronic modules, methods for manufacturing pluralities of discrete optoelectronic modules, and optoelectronic molding tools. The methods include coating a substrate wafer and a plurality of optoelectronic components with a photosensitive material, and further include exposing select portions of the photosensitive material to electromagnetic radiation. The exposed portions delineate at least in part the dimensions of the optical channels, wherein the optical channels are associated with at least one optoelectronic component. In some instances, optical elements are incorporated into the optical channels. In some instances, the exposed portions are the optical channels. In some instances, the exposed portions are spacers between the optical channels.

    OPTICAL ELEMENT STACK ASSEMBLIES
    7.
    发明申请
    OPTICAL ELEMENT STACK ASSEMBLIES 审中-公开
    光学元件组件

    公开(公告)号:WO2017082820A1

    公开(公告)日:2017-05-18

    申请号:PCT/SG2016/050545

    申请日:2016-11-04

    摘要: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬ structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure. The optical element stack assembly further includes a spacer laterally surrounding, and moulded to, the first and second sub-assemblies.

    摘要翻译: 光学堆叠组件及其制造技术。 光学堆叠组件包括第一和第二子组件,其中的每一个包括基底和固定到相应基底的子结构。 每个子结构包括相应的第一边缘特征和从该子结构的基板突出的相应的第二边缘特征,每个第二边缘特征侧向地比第一边缘更靠近相应子结构的外周布置 具有相同子结构的特征。 第一子结构的第一边缘特征与第二子结构的第一边缘特征直接接触, 结构,而第一子结构的第二边缘特征和第二子结构的第二边缘特征通过粘合剂彼此附接。 第一或第二子结构中的至少一个包括在子结构的与该子结构的第一和第二边缘特征相同的一侧上的光学元件。 光学元件叠层组件还包括侧向围绕第一和第二子组件的并且模制到第一和第二子组件的隔离件。