公开(公告)号：WO2010078199A3

公开(公告)日：2010-10-14

申请号：PCT/US2009069442

申请日：2009-12-23

Applicant: INTEL CORP ,  CHOUDHURY DEBABANI ,  RUBERTO MARK

Inventor： CHOUDHURY DEBABANI ,  RUBERTO MARK

IPC: H01Q21/00 ,  H01Q23/00

CPC classification number: H01Q21/0025 ,  H01L23/49822 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01Q1/523 ,  H01Q21/062 ,  H01Q21/065 ,  H01Q21/067 ,  H01L2224/05599

Abstract: Disclosed are integration approaches for mm-wave array type architectures using multilayer substrate technologies. For instance, an apparatus may include a first substrate layer, a second substrate layer, and a third substrate layer. The first substrate layer has a first plurality of array elements, and the second substrate layer has a second plurality of array elements. The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements. The first and second substrate layers are separated by approximately a half wavelength (?/2) corresponding to the one or more RF signals.

Abstract translation: 公开了使用多层衬底技术的毫米波阵列型架构的集成方法。 例如，装置可以包括第一衬底层，第二衬底层和第三衬底层。 第一衬底层具有第一多个阵列元件，并且第二衬底层具有第二多个阵列元件。 第三衬底层具有集成电路，以与第一和第二多个阵列元件交换一个或多个射频（RF）信号。 第一和第二衬底层被分开与一个或多个RF信号相对应的大约一半波长（λ/ 2）。

公开(公告)号：WO2009114486A3

公开(公告)日：2009-12-17

申请号：PCT/US2009036582

申请日：2009-03-09

Applicant: INTEL CORP ,  CHOUDHURY DEBABANI ,  ROBERTS RICHARD D ,  KARACAOGLU ULUN

Inventor： CHOUDHURY DEBABANI ,  ROBERTS RICHARD D ,  KARACAOGLU ULUN

IPC: H04B7/04 ,  H01Q1/24 ,  H04W16/28

CPC classification number: H01Q1/246 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q3/26 ,  H01Q3/34 ,  H01Q9/0407 ,  H01Q21/065 ,  H01Q21/067 ,  H01Q21/205 ,  H01Q21/24 ,  H01Q25/00 ,  H01Q25/04 ,  H04B7/0682

Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.

Abstract translation: 本文描述了实现三维波束覆盖的无线天线阵列系统的实施例。 可以描述和要求保护其他实施例。

公开(公告)号：WO2011075265A3

公开(公告)日：2011-08-18

申请号：PCT/US2010057038

申请日：2010-11-17

Applicant: INTEL CORP ,  CHOUDHURY DEBABANI ,  ALLURI PRASAD

Inventor： CHOUDHURY DEBABANI ,  ALLURI PRASAD

IPC: H01L27/02 ,  H01L23/02 ,  H01L23/34 ,  H01L25/16

CPC classification number: H01L23/5389 ,  C09K2219/03 ,  C09K2219/11 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/18 ,  H01L24/19 ,  H01L24/48 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/18 ,  H01L2224/24195 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/3025 ,  Y10T29/49155 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including: a first layer having a first conformable material; a second layer having a second conformable material; a third layer having a third material; and one or more electronic components embedded within the stack of layers, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.

Abstract translation: 根据本公开的各个方面，公开了一种装置，其包括包括系统级封装体系结构的小尺寸移动平台，所述系统级封装体系结构被布置为层叠层，包括：第一层，具有 第一适形材料; 具有第二适形材料的第二层; 具有第三材料的第三层; 以及嵌入层叠层内的一个或多个电子部件，其中第一适形材料，第二适形材料或两者被配置为允许高频信号路由。

公开(公告)号：WO2010078215A3

公开(公告)日：2010-10-14

申请号：PCT/US2009069516

申请日：2009-12-23

Applicant: INTEL CORP ,  CHOUDHURY DEBABANI ,  PERRY RICHARD S

Inventor： CHOUDHURY DEBABANI ,  PERRY RICHARD S

IPC: H01Q21/00 ,  H01Q23/00

CPC classification number: H01Q3/26 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01Q1/02 ,  H01Q21/0025 ,  H01Q21/065 ,  H01Q23/00 ,  H01L2224/0401

Abstract: Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals.

Abstract translation: 公开了使用多层衬底技术的毫米波平面相控阵结构的集成方法。 例如，装置可以包括多个衬底层，集成电路和连接器模块。 多个衬底层包括具有一个或多个相控阵元件的第一衬底层。 集成电路与一个或多个相控阵元件交换一个或多个射频（RF）信号（例如，毫米波信号）。 连接器模块与集成电路进一步交换对应于一​​个或多个RF信号的信号。 例如，这些另外的信号可以是基带或中频（IF）信号。