公开(公告)号：WO2021146284A8

公开(公告)日：2021-07-22

申请号：PCT/US2021/013238

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter Alexandre ,  BURK, James A. ,  MILLER, Galen W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie G. ,  LAPS, Mark, R.

IPC: H01G4/38 ,  H01L23/488 ,  H01L23/498 ,  H05K1/18 ,  H05K7/14 ,  H01G4/224 ,  H01G4/228 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0204 ,  H05K1/0259 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

公开(公告)号：WO2021146284A1

公开(公告)日：2021-07-22

申请号：PCT/US2021/013238

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter Alexandre ,  BURK, James A. ,  MILLER, Galen W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie G. ,  LAPS, Mark, R.

IPC: H01G4/38 ,  H01L23/488 ,  H01L23/498 ,  H05K1/18 ,  H05K7/14 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.