公开(公告)号：WO2021146284A1

公开(公告)日：2021-07-22

申请号：PCT/US2021/013238

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter Alexandre ,  BURK, James A. ,  MILLER, Galen W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie G. ,  LAPS, Mark, R.

IPC: H01G4/38 ,  H01L23/488 ,  H01L23/498 ,  H05K1/18 ,  H05K7/14 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

公开(公告)号：WO2022223674A2

公开(公告)日：2022-10-27

申请号：PCT/EP2022/060515

申请日：2022-04-21

Applicant: SMA SOLAR TECHNOLOGY AG

Inventor： BRAUN, Gerrit ,  HUEGUES, Roland

IPC: H05K1/14 ,  H05K1/18 ,  H01L23/13 ,  H01L23/373 ,  H01L23/538 ,  H01L25/16 ,  H01L25/18 ,  H05K1/02 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/5385 ,  H01L23/5389 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/185 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10166 ,  H05K2201/209

Abstract: Es wird eine Leistungshalbleiteranordnung (10, 20, 30) mit einer ersten Leiterplatte (14), einer zweiten Leiterplatte (16) und einem Leistungshalbleiter (12) beschrieben, wobei die erste Leiterplatte (14) mit der zweiten Leiterplatte (16) elektrisch leitend verbunden ist und der Leistungshalbleiter (12) mit der zweiten Leiterplatte (16) elektrisch leitend verbunden ist, und wobei die erste Leiterplatte (14) mit der zweiten Leiterplatte (16) mechanisch über eine leitfähige Kurzdistanzverbindung (18) verbunden ist. Eine Wechselrichterbrücke weist eine solche Leistungshalbleiteranordnung (10, 20, 30), ein Wechselrichter eine solche Wechselrichterbrücke auf.

公开(公告)号：WO2021146284A8

公开(公告)日：2021-07-22

申请号：PCT/US2021/013238

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter Alexandre ,  BURK, James A. ,  MILLER, Galen W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie G. ,  LAPS, Mark, R.

IPC: H01G4/38 ,  H01L23/488 ,  H01L23/498 ,  H05K1/18 ,  H05K7/14 ,  H01G4/224 ,  H01G4/228 ,  H01G4/30 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0204 ,  H05K1/0259 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

公开(公告)号：WO2022261356A2

公开(公告)日：2022-12-15

申请号：PCT/US2022/032877

申请日：2022-06-09

Applicant: HUBBELL INCORPORATED

Inventor： GELLIS, David, Samuel

IPC: H01F27/28 ,  H05K1/14 ,  H01R13/6485 ,  H01R13/70 ,  H01R27/02 ,  H02J7/0042 ,  H02M3/335 ,  H05K1/165 ,  H05K1/18 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10189

Abstract: A wiring device including a first printed circuit board (PCB) that includes a first, direct current (DC) output port and a second DC output port. The wiring device further includes a second PCB electrically connected with the first PCB, the second PCB including a. planar transformer integrated with a surface of the second PCB and configured to output power at one or more DC voltage levels, a switch connected to the planar transformer, and. a microcontroller. The microcontroller includes an electronic processor and is configured to control delivery of power from the planar transformer to at least one of the first DC output port and the second DC output port using the switch. The switch may have a Gallium Nitride (GaN) chemistry or a Silicon Carbide (SiC) chemistry.

公开(公告)号：WO2021146270A2

公开(公告)日：2021-07-22

申请号：PCT/US2021/013217

申请日：2021-01-13

Applicant: KEMET ELECTRONICS CORPORATION

Inventor： BULTITUDE, John ,  BLAIS, Peter, Alexandre ,  BURK, James, A. ,  MILLER, Galen, W. ,  HAYES, Hunter ,  TEMPLETON, Allen ,  JONES, Lonnie, G. ,  LAPS, Mark, R.

IPC: H01L23/495 ,  H05K1/11 ,  H05K3/46 ,  H01G4/30 ,  H01G4/224 ,  H01G4/228 ,  H01G4/38 ,  H01L25/072 ,  H01L29/1608 ,  H01L29/2003 ,  H05K1/0272 ,  H05K1/145 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K3/328

Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.

公开(公告)号：WO2021126917A1

公开(公告)日：2021-06-24

申请号：PCT/US2020/065231

申请日：2020-12-16

Applicant: PULSE BIOSCIENCES, INC.

Inventor： HUANG, Chaofeng ,  SCHAADT, Gregory ,  KRIEG, Kenneth

IPC: H03K3/57 ,  A61N1/0472 ,  A61N1/36034 ,  H01F2027/2833 ,  H01F27/24 ,  H01F27/2823 ,  H03K3/353 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10545

Abstract: Described herein are apparatuses and methods for applying high voltage, sub-microsecond (e.g., nanosecond range) pulsed output to a biological material, e.g., tissues, cells, etc., using a high voltage (e.g., MOSFET) gate driver circuit having a high voltage isolation and a low inductance. In particular, described herein are multi-core pulse transformers comprising independent transformer cores arranged in parallel, in some variations they may be on opposite sides of a substrate. The transformer cores may have coaxial primary and secondary windings. Also describe are pulse generators including multi-core pulse transformers arranged in parallel (e.g., on opposite sides of a PCB) to reduce MOSFET driver gate inductance.