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公开(公告)号：WO2011028551A2
公开(公告)日：2011-03-10
申请号：PCT/US2010/046555
申请日：2010-08-24
Applicant: KEMET ELECTRONICS CORPORATION , BULTITUDE, John , MCCONNELL, John
Inventor： BULTITUDE, John , MCCONNELL, John
CPC classification number: H01G4/30 , H01G2/16 , H01G4/40 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T29/49002
Abstract: A capacitor combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor results in a resistive failure when the fuse opens during an overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs.
Abstract translation: 描述了与电阻器和/或保险丝组合的电容器。 这种安全电容器在短路时可以通过电阻快速放电。 当电容器在过电流状态下断开时，与电容器串联的熔丝存在电阻故障。 此外，与电容器并联的电阻器的存在允许当发生故障时能量迅速消散。
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公开(公告)号：WO2021146284A8
公开(公告)日：2021-07-22
申请号：PCT/US2021/013238
申请日：2021-01-13
Applicant: KEMET ELECTRONICS CORPORATION
Inventor： BULTITUDE, John , BLAIS, Peter Alexandre , BURK, James A. , MILLER, Galen W. , HAYES, Hunter , TEMPLETON, Allen , JONES, Lonnie G. , LAPS, Mark, R.
IPC: H01G4/38 , H01L23/488 , H01L23/498 , H05K1/18 , H05K7/14 , H01G4/224 , H01G4/228 , H01G4/30 , H01L25/072 , H01L29/1608 , H01L29/2003 , H05K1/0204 , H05K1/0259 , H05K1/0272 , H05K1/145 , H05K1/181 , H05K2201/10015 , H05K2201/10166 , H05K2201/10545 , H05K3/328
Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.
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公开(公告)号：WO2013009661A2
公开(公告)日：2013-01-17
申请号：PCT/US2012/045876
申请日：2012-07-07
Applicant: KEMET ELECTRONICS CORPORATION , BULTITUDE, John , JONES, Lonnie G. , BELL, Jeffrey W.
Inventor： BULTITUDE, John , JONES, Lonnie G. , BELL, Jeffrey W.
CPC classification number: H01G2/14 , H01C1/14 , H01C7/12 , H01G4/005 , H01G4/30 , H01T2/02 , H01T4/08 , H01T4/16
Abstract: An improved overvoltage protection component is provided. The overvoltage protection component has a first internal electrode contained within a dielectric material. The first internal electrode is electrically connected to a first termination and a second internal electrode contained within the ceramic dielectric material is electrically connected to a second termination.
Abstract translation:
提供改进的过电压保护组件。 过电压保护部件具有包含在电介质材料内的第一内部电极。 第一内部电极电连接到第一端子，并且包含在陶瓷电介质材料内的第二内部电极电连接到第二端子。
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公开(公告)号：WO2022055841A1
公开(公告)日：2022-03-17
申请号：PCT/US2021/049221
申请日：2021-09-07
Applicant: KEMET ELECTRONICS CORPORATION
Inventor： BULTITUDE, John , REED, Nathan, A. , TEMPLETON, Allen , MAGEE, James, R. , DAVIS, James , GURAV, Abhijit , HAYES, Hunter , GUO, Hanzheng
Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.
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公开(公告)号：WO2021216421A1
公开(公告)日：2021-10-28
申请号：PCT/US2021/027916
申请日：2021-04-19
Applicant: KEMET ELECTRONICS CORPORATION
Inventor： LAPS, Mark R. , BULTITUDE, John , LESSNER, Philip M. , JONES, Lonnie G. , TEMPLETON, Allen , REED, Nathan A.
Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.
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Patent Agency Ranking
公开(公告)号：WO2021146270A2
公开(公告)日：2021-07-22
申请号：PCT/US2021/013217
申请日：2021-01-13
Applicant: KEMET ELECTRONICS CORPORATION
Inventor： BULTITUDE, John , BLAIS, Peter, Alexandre , BURK, James, A. , MILLER, Galen, W. , HAYES, Hunter , TEMPLETON, Allen , JONES, Lonnie, G. , LAPS, Mark, R.
IPC: H01L23/495 , H05K1/11 , H05K3/46 , H01G4/30 , H01G4/224 , H01G4/228 , H01G4/38 , H01L25/072 , H01L29/1608 , H01L29/2003 , H05K1/0272 , H05K1/145 , H05K1/181 , H05K2201/10015 , H05K2201/10166 , H05K2201/10545 , H05K3/328
Abstract: Provided is a high-density multi-component package comprising a first module interconnect pad and a second module interconnect pad. At least two electronic components are mounted to and between the first module interconnect pad and the second module interconnect pad wherein a first electronic component is vertically oriented relative to the first module interconnect pad. A second electronic component is vertically oriented relative to the second module interconnect pad.
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公开(公告)号：WO2019051346A1
公开(公告)日：2019-03-14
申请号：PCT/US2018/050142
申请日：2018-09-10
Applicant: KEMET ELECTRONICS CORPORATION
Inventor： BURK, James, A. , BULTITUDE, John , MILLER, Galen, W. , MCCONNELL, John, E.
IPC: H01L21/822 , H01L21/8224 , H01G4/232 , H01G4/38
Abstract: An improved high density multi-component package is provided. The package comprising at least two electronic components. Each electronic component comprises a first external termination and a second external termination. At least one electrical connection is between adjacent first external terminations of adjacent electronic components. At least one mechanical connection is between adjacent electronic components. At least two adjacent electronic components are connected serially.
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公开(公告)号：WO2013163416A1
公开(公告)日：2013-10-31
申请号：PCT/US2013/038200
申请日：2013-04-25
Applicant: KEMET ELECTRONICS CORPORATION
Inventor： MCCONNELL, John, E. , WEBSTER, Alan, P. , BULTITUDE, John , GURAV, Abhijit
CPC classification number: H05K1/0271 , H01C1/014 , H01C1/14 , H01C7/18 , H01G2/06 , H01G4/232 , H01G4/38 , H05K1/181 , H05K1/182 , H05K3/30 , H05K3/301 , H05K2201/049 , H05K2201/10015 , H05K2201/10454 , Y10T29/49121
Abstract: An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
Abstract translation: 描述了一种改进的离散电子设备和制造改进的分立电子设备的方法。 分立的电子设备具有带终端和引线框的电子无源部件。 补偿兼容部件在终端和引线框架之间。 补偿柔性部件具有复合芯和复合芯上的第一导体。 第一个导线与端子电接触。 第二导体也在复合芯上，其中第二导体与引线框架电接触。
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9.发明申请METHOD OF IMPROVING ELECTROMECHANICAL INTEGRITY OF CATHODE COATING TO CATHODE TERMINATION INTERFACES IN SOLID ELECTROLYTIC CAPACITORS 审中-公开阴极涂层电化学完整性对固体电解电容器阴极终止界面的改进方法
公开(公告)号：WO2011150263A2
公开(公告)日：2011-12-01
申请号：PCT/US2011/038216
申请日：2011-05-26
Applicant: KEMET ELECTRONICS CORPORATION , CHACKO, Antony P. , MCCONNELL, John E. , LESSNER, Philip M. , HAHN, Randolph S. , BULTITUDE, John
Inventor： CHACKO, Antony P. , MCCONNELL, John E. , LESSNER, Philip M. , HAHN, Randolph S. , BULTITUDE, John
CPC classification number: H01G9/012 , H01G9/0425 , H01G9/15 , Y02E60/13 , Y10T29/43
Abstract: A solid electrolytic capacitor with an anode and a dielectric on the anode. A cathode is on the dielectric and a conductive coating on said dielectric. A cathode lead is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable material and polymer solder.
Abstract translation: 在阳极上具有阳极和电介质的固体电解电容器。 电介质上的阴极和所述电介质上的导电涂层。 阴极引线通过选自瞬态液相可烧结材料和聚合物焊料的粘合剂电连接到导电涂层。
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公开(公告)号：WO2021146284A1
公开(公告)日：2021-07-22
申请号：PCT/US2021/013238
申请日：2021-01-13
Applicant: KEMET ELECTRONICS CORPORATION
Inventor： BULTITUDE, John , BLAIS, Peter Alexandre , BURK, James A. , MILLER, Galen W. , HAYES, Hunter , TEMPLETON, Allen , JONES, Lonnie G. , LAPS, Mark, R.
IPC: H01G4/38 , H01L23/488 , H01L23/498 , H05K1/18 , H05K7/14 , H01G4/30 , H01L25/072 , H01L29/1608 , H01L29/2003 , H05K1/0272 , H05K1/145 , H05K1/181 , H05K2201/10015 , H05K2201/10166 , H05K2201/10545 , H05K3/328
Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.
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