公开(公告)号：WO2023086509A1

公开(公告)日：2023-05-19

申请号：PCT/US2022/049601

申请日：2022-11-10

Applicant: LAM RESEARCH CORPORATION

Inventor： AN, Liwei ,  CHANDRASEKHARAN, Ramesh ,  BELOSTOTSKIY, Sergey Georgiyevich ,  HONG, Tu ,  JI, Chunhai ,  BAKER, Noah Elliot

IPC: H01L21/67 ,  H01L21/683

Abstract: A system for monitoring health of a pedestal of a processing chamber comprises a memory storing instructions and a processor. The processor is configured to execute the instructions to sense one or more currents through one or more electrodes arranged in the pedestal; generate one or more metrics based on the one or more currents; and determine a health of the pedestal based on the one or more metrics.

公开(公告)号：WO2021126848A1

公开(公告)日：2021-06-24

申请号：PCT/US2020/065115

申请日：2020-12-15

Applicant: LAM RESEARCH CORPORATION

Inventor： CHANDRASEKHARAN, Ramesh ,  LAVOIE, Adrien ,  ROBERTS, Michael Philip

IPC: H01L21/67 ,  C23C16/44 ,  C23C16/455 ,  H01J37/32

Abstract: A purge baffle for a substrate support includes an annular ring configured to surround an outer perimeter around the substrate support in a volume below the substrate support and a first portion. The first portion includes a plenum defined below the first portion and outside of the annular ring in the volume below the substrate support and a plurality of openings that provide respective flow paths from a region above the first portion into the plenum. At least a first opening of the plurality of openings has a first conductance and at least a second opening of the plurality of openings has a second conductance that is different than the first conductance.

公开(公告)号：WO2020257147A1

公开(公告)日：2020-12-24

申请号：PCT/US2020/037858

申请日：2020-06-16

Applicant: LAM RESEARCH CORPORATION

Inventor： CHANDRASEKHARAN, Ramesh ,  ROBERTS, Michael Philip ,  KONKOLA, Paul ,  SMITH, Michael G.R. ,  WILLIAMS, Brian Joseph ,  KUMAR, Ravi ,  AGARWAL, Pulkit ,  LAVOIE, Adrien

IPC: C23C16/458 ,  C23C16/44 ,  C23C16/455 ,  H01L21/687

Abstract: A method for evacuating a volume below a substrate in a substrate processing system includes arranging the substrate on a lift mechanism of a substrate support to define the volume below the substrate between the substrate and an upper surface of the substrate support. An evacuation step is initiated to evacuate the volume below the substrate. The evacuation step includes pumping down the volume below the substrate at least one of through and around the lift mechanism. The lift mechanism is lowered during the evacuation step to position the substrate on the upper surface of the substrate support and the evacuation step is terminated.

公开(公告)号：WO2020010153A1

公开(公告)日：2020-01-09

申请号：PCT/US2019/040416

申请日：2019-07-02

Applicant: LAM RESEARCH CORPORATION

Inventor： SUNDARAM, Sairam ,  DURBIN, Aaron ,  CHANDRASEKHARAN, Ramesh

IPC: C23C16/458 ,  C23C16/46 ,  C23C16/455 ,  H05B1/02

Abstract: A temperature-controlled substrate support for a substrate processing system includes a substrate support located in the processing chamber. The substrate support includes N zones and N resistive heaters, respectively, where N is an integer greater than one. A temperature sensor is located in one of the N zones. A controller is configured to calculate N resistances of the N resistive heaters during operation and to adjust power to N-1 of the N resistive heaters during operation of the substrate processing system in response to the temperature measured in the one of the N zones by the temperature sensor, the N resistances of the N resistive heaters, and N-1 resistance ratios.

公开(公告)号：WO2022232014A1

公开(公告)日：2022-11-03

申请号：PCT/US2022/026124

申请日：2022-04-25

Applicant: LAM RESEARCH CORPORATION

Inventor： CHANDRASEKHARAN, Ramesh ,  THILAGARAJ, Mohan ,  LEESER, Karl Frederick

IPC: H01L21/67 ,  C23C16/458 ,  C23C16/46

Abstract: A controller to control a temperature of a first substrate support in a substrate processing system includes a resistance calculation module to calculate a first resistance of a first heater element of a plurality of heater elements of the first substrate support, a temperature calculation module to calculate a first temperature of the first heater element based on the calculated first resistance, and a filter module to filter a first signal that corresponds to the calculated first resistance. The temperature calculation module selectively causes the filter module to filter the first signal in response to a determination of whether at least one condition associated with operation of the substrate processing system is met.

公开(公告)号：WO2020247966A1

公开(公告)日：2020-12-10

申请号：PCT/US2020/070072

申请日：2020-05-22

Applicant: LAM RESEARCH CORPORATION

Inventor： ROBERTS, Michael Philip ,  WILLIAMS, Brian ,  JUAREZ, Francisco J. ,  BATZER, Rachel E. ,  CHANDRASEKHARAN, Ramesh ,  PHILLIPS, Richard ,  NUOYA, Yang ,  WOMACK, Joseph L. ,  LI, Ming ,  QIAN, Jun ,  HONG, Tu ,  MULLENAUX, Sky

IPC: C23C16/54 ,  C23C16/455 ,  C23C16/52

Abstract: Methods and apparatuses are provided herein for independently adjusting flowpath conductance. One multi-station processing apparatus may include a processing chamber, a plurality of process stations in the processing chamber that each include a showerhead having a gas inlet, and a gas delivery system including a junction point and a plurality of flowpaths, in which each flowpath includes a flow element, includes a temperature control unit that is thermally connected with the flow element and that is controllable to change the temperature of that flow element, and fluidically connects one corresponding gas inlet of a process station to the junction point such that each process station of the plurality of process stations is fluidically connected to the junction point by a different flowpath.

公开(公告)号：WO2020163147A1

公开(公告)日：2020-08-13

申请号：PCT/US2020/015843

申请日：2020-01-30

Applicant: LAM RESEARCH CORPORATION

Inventor： LAVOIE, Adrien ,  ROBERTS, Michael Philip ,  BALDASSERONI, Chloe ,  PHILLIPS, Richard ,  CHANDRASEKHARAN, Ramesh

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/505

Abstract: A system to deposit a film on a substrate using atomic layer deposition includes a pedestal arranged in a processing chamber to support the substrate on a top surface of the pedestal when depositing the film on the substrate. A first annular recess in the pedestal extends downwardly from the top surface of the pedestal and radially inwardly from an outer edge of the pedestal towards an outer edge of the substrate. The first annular recess has an inner diameter that is greater than a diameter of the substrate. An annular ring is made of a dielectric material and is arranged around the substrate in the first annular recess. A second annular recess in the pedestal is located under the annular ring. The second annular recess has a height and extends radially inwardly from the outer edge of the pedestal towards the outer edge of the substrate.

公开(公告)号：WO2020068546A3

公开(公告)日：2020-04-02

申请号：PCT/US2019/051886

申请日：2019-09-19

Applicant: LAM RESEARCH CORPORATION

Inventor： CHANDRASEKHARAN, Ramesh

IPC: H01L21/67

Abstract: A system for heating components of a substrate processing system includes a controller and a plurality of heaters arranged at a plurality of locations along a path of fluid flow from a source of fluid to a destination in the substrate processing system. The controller is configured to group the plurality of heaters into a plurality of groups of heaters. Each group of heaters comprises at least one of the plurality of heaters. The controller is further configured to determine a temperature gradient to be maintained across the plurality of groups of heaters. The controller is further configured to select a group of heaters from the plurality of groups of heaters and control power supplied to the selected group of heaters to maintain the temperature gradient across the plurality of groups of heaters.

公开(公告)号：WO2022251867A1

公开(公告)日：2022-12-01

申请号：PCT/US2022/072603

申请日：2022-05-26

Applicant: LAM RESEARCH CORPORATION

Inventor： MILLER, Aaron Blake ,  DURBIN, Aaron ,  CHANDRASEKHARAN, Ramesh ,  STRENG, Bradley Taylor

IPC: H01L21/687

Abstract: Apparatuses not only capable of reducing unwanted radiative heat loss from a pedestal of a substrate processing system, but also capable of reducing radiative heat transfer to other components within a chamber of the substrate processing system.

公开(公告)号：WO2020167944A1

公开(公告)日：2020-08-20

申请号：PCT/US2020/017922

申请日：2020-02-12

Applicant: LAM RESEARCH CORPORATION

Inventor： CHANDRASEKHARAN, Ramesh ,  ROBERTS, Michael Philip ,  AGARWAL, Pulkit ,  LAVOIE, Adrien ,  KUMAR, Ravi ,  YANG, Nuoya ,  SOE, Chan Myae Myae ,  SAURABH, Ashish

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/033 ,  C23C16/458

Abstract: A substrate processing system is provided and includes a substrate support, a memory, and calibration, operating parameter, and solving modules. The substrate support supports a substrate and includes temperature control elements. The memory stores, for the temperature control elements, temperature calibration values and sensitivity calibration values. The calibration module, during calibration of the temperature control elements, performs a first calibration process to determine the temperature calibration values or a second calibration process to determine the sensitivity calibration values. The sensitivity calibration values relate at least one of trim amounts or deposition amounts to temperature changes. The operating parameter module determines operating parameters for the temperature control elements based on the temperature and sensitivity calibration values. The solving module, subsequent to the calibration of the temperature control elements, controls operation of the temperature control elements during at least one of a trim or deposition step based on the operating parameters.