公开(公告)号：WO2010110626A3

公开(公告)日：2010-12-09

申请号：PCT/KR2010001876

申请日：2010-03-26

Applicant: LS CABLE LTD ,  KIM YOON-JIN ,  KO CHANG-MO ,  CHO HO-SOUK

Inventor： KIM YOON-JIN ,  KO CHANG-MO ,  CHO HO-SOUK

IPC: H01B1/22 ,  B82B3/00 ,  H01J17/49

CPC classification number: H05K1/097 ,  H01B1/02 ,  H01B1/22 ,  H01B1/24 ,  H05K2201/0218 ,  H05K2201/0245

Abstract: Disclosed is a composition for a conductive paste containing micrometer-thick silver microplates (or plate-shaped silver micro particles) surface-modified with metal nano particles. The composition can be sintered at a relatively low temperature between 150 to 300 °C. For this purpose, it needs not more than 65 % silver nano particles per the weight of the composition. The plate-shaped silver micro particles may be replaced with plate-shaped copper micro particles coated with silver. The composition for a conductive paste may comprise solely the metal- modified silver microplates as a conductive material, and further comprise metal nano particles. According to another aspect, the composition may further comprise carbon nanotubes in addition to the metal nano particles. As additional conductive materials, micrometer-size flake-shaped copper and/or silver particles may be further included.

Abstract translation: 公开了一种用金属纳米颗粒表面改性的微米厚银微孔板（或板状银微粒子）的导电糊剂组合物。 组合物可以在150-300℃之间的较低温度下烧结。 为此，每个组合物的重量不需要超过65％的银纳米颗粒。 板状银微粒可以用镀银的铜板微粒子代替。 用于导电浆料的组合物可以仅包含金属改性的银微孔板作为导电材料，并且还包含金属纳米颗粒。 根据另一方面，除了金属纳米颗粒之外，组合物还可包含碳纳米管。 作为另外的导电材料，可以进一步包括微米尺寸的片状铜和/或银颗粒。

公开(公告)号：WO2010079884A3

公开(公告)日：2010-08-26

申请号：PCT/KR2009006517

申请日：2009-11-06

Applicant: LS CABLE LTD ,  CHO HO-SOUK ,  KO CHANG-MO ,  KIM YOON-JIN

Inventor： CHO HO-SOUK ,  KO CHANG-MO ,  KIM YOON-JIN

IPC: C09D11/00

CPC classification number: C09D11/037 ,  C09D11/52 ,  H05K1/097

Abstract: Disclosed is a method for producing a conductive silver ink that has conductivity of a suitable level for a wiring material and uniform dispersion of silver particles, and can be sintered at low temperature. The method ensures excellent dispersion of silver particles by directly dispersing a silver ion complex in an organic solvent prior to reducing the silver ion complex into silver particles. The method includes reacting silver ions with branched chain carboxylic acid having 6 to 14 carbon atoms or its salt to form a silver ion complex; dispersing the silver ion complex in an organic solvent to prepare a silver ion complex-dispersed mixture; and adding a reducing agent to the silver ion complex-dispersed mixture to reduce the silver ions.

Abstract translation: 公开了一种导电性银墨水的制造方法，该导电性银墨水具有适合的布线材料的电导率和银粒子的均匀分散性，并且可以在低温下烧结。 该方法通过在将银离子络合物还原成银颗粒之前将银离子络合物直接分散在有机溶剂中来确保银颗粒的优异分散。 该方法包括使银离子与具有6至14个碳原子的支链羧酸或其盐反应以形成银离子络合物; 将银离子配合物分散在有机溶剂中以制备银离子络合物分散混合物; 并向银离子络合物分散混合物中加入还原剂以还原银离子。

公开(公告)号：WO2010067965A3

公开(公告)日：2010-08-05

申请号：PCT/KR2009006482

申请日：2009-11-05

Applicant: LS CABLE LTD ,  KO CHANG-MO ,  CHO HO-SOUK

Inventor： KO CHANG-MO ,  CHO HO-SOUK

IPC: H01B1/02

CPC classification number: H01B1/22 ,  C09D11/037 ,  C09D11/52 ,  H05K1/097 ,  H05K2201/0218 ,  H05K2201/0245 ,  H05K2201/0272

Abstract: Disclosed is an electroconductive silver nanoparticle ink containing an electroconductive silver nanoparticle composition, comprising a dispersion and silver-coated plate-shaped copper flakes and silver nanoparticles put in the dispersion.

Abstract translation: 本发明公开了含有导电银纳米粒子组合物的导电银纳米粒子油墨，其包含分散体和放置在分散体中的银涂覆的板状铜片和银纳米粒子。

公开(公告)号：WO2010101418A3

公开(公告)日：2010-12-09

申请号：PCT/KR2010001339

申请日：2010-03-03

Applicant: LS CABLE LTD ,  KIM YOON-JIN ,  KO CHANG-MO ,  CHO HO-SOUK

Inventor： KIM YOON-JIN ,  KO CHANG-MO ,  CHO HO-SOUK

IPC: H01B1/22 ,  H05K1/11

CPC classification number: H01B1/02 ,  C08K3/041 ,  C08K3/08 ,  C08K9/02 ,  C09D7/62 ,  C09D7/67 ,  C09D7/70 ,  C09D11/037 ,  C09D11/36 ,  C09D11/52 ,  H05K1/097 ,  H05K2201/0245 ,  H05K2201/026

Abstract: Disclosed is a composition for a conductive paste containing micrometer- size plate-shaped metal particles having a thickness of 200 nm or less. The composition comprises silver nano particles having an average particle size between 1 nm to 100 nm; and plate-shaped metal particles. Preferably, the micrometer-size plate-shaped metal particles have an average thickness of 200 nm or less. Preferably, the micrometer- size plate-shaped metal particles have horizontal and vertical sides of 1 to 20 µm size on average. The composition may further comprise metal nano particles such as copper, palladium and so on. And, the composition may further comprise carbon nanotubes, and the surface of the carbon nanotubes may be coated with metal nano particles. The use of such composition can reduce a sintering temperature to a low temperature of 150 °C or lower and decrease the thickness of a circuit wire for achieving the same resistance.

Abstract translation: 本发明公开了一种含有厚度为200nm以下的微米尺寸的板状金属粒子的导电性糊剂用组合物。 该组合物包含平均粒径在1nm至100nm之间的银纳米粒子; 和板状金属颗粒。 优选地，微米尺寸的板状金属颗粒具有200nm或更小的平均厚度。 优选地，微米尺寸的板状金属颗粒平均具有1至20μm尺寸的水平和垂直边。 该组合物可以进一步包含金属纳米颗粒如铜，钯等。 并且，组合物可以进一步包含碳纳米管，并且碳纳米管的表面可以涂覆有金属纳米颗粒。 使用这种组合物可以将烧结温度降低到150℃或更低的低温并减小用于实现相同电阻的电路线的厚度。