公开(公告)号：WO2003081974A2

公开(公告)日：2003-10-02

申请号：PCT/JP2003/003533

申请日：2003-03-24

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HAJI, Hiroshi ,  HIRAKAWA, Toshiro

IPC: H05K13/00

CPC classification number: H01L21/6715 ,  H01L21/67144 ,  H01L21/681 ,  H01L24/75 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

Abstract: The present invention provides an electronic component mounting apparatus, wherein a high speed operation can be provided by simplifying the structure of a mounting head and wherein the working efficiency can be improved by eliminating the use of the mounting head for a coating process. In the electronic component mounting apparatus, a flux is coated on chips supplied to an electronic component feeding unit while bump formation faces are directed upward. The chips are mounted on a substrate. A holding head receives the chips extracted from an adhesive sheet by a mounting head and is inverted relative to a stage on which a flux is spread. As a result, the bumps of the chips are covered with the flux and are flattened, and after the holding head is returned to the original stage, the chips on the stage are extracted and mounted on the substrate by the mounting head.

Abstract translation: 本发明提供一种电子部件安装装置，其中通过简化安装头的结构可以提供高速操作，并且其中可以通过消除使用用于涂覆过程的安装头来提高工作效率。 在电子部件安装装置中，将焊剂涂布在供给电子部件供给部的芯片上，同时将凸起形成面朝向上方。 芯片安装在基板上。 保持头通过安装头接收从粘合片提取的碎片，并且相对于其上扩散有焊剂的台倒置。 结果，芯片的凸起被焊剂覆盖并被压平，并且在保持头返回到原始台之后，台架上的芯片被提取并通过安装头安装在基板上。

公开(公告)号：WO2003081974A3

公开(公告)日：2003-10-02

申请号：PCT/JP2003/003533

申请日：2003-03-24

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： HAJI, Hiroshi ,  HIRAKAWA, Toshiro

IPC: H01L21/00

Abstract: The present invention provides an electronic component mounting apparatus, wherein a high speed operation can be provided by simplifying the structure of a mounting head and wherein the working efficiency can be improved by eliminating the use of the mounting head for a coating process. In the electronic component mounting apparatus, a flux is coated on chips supplied to an electronic component feeding unit while bump formation faces are directed upward. The chips are mounted on a substrate. A holding head receives the chips extracted from an adhesive sheet by a mounting head and is inverted relative to a stage on which a flux is spread. As a result, the bumps of the chips are covered with the flux and are flattened, and after the holding head is returned to the original stage, the chips on the stage are extracted and mounted on the substrate by the mounting head.

公开(公告)号：WO2004077910A1

公开(公告)日：2004-09-10

申请号：PCT/JP2004/002086

申请日：2004-02-23

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  NODA, Kazuhiko ,  MUKOJIMA, Hitoshi ,  NARIKIYO, Yasuhiro ,  HIRAKAWA, Toshiro ,  KANAKI, Hiromi ,  NISHIMURA, Akira ,  UCHIDA, Osamu ,  ISHIKAWA, Takatoshi

Inventor： NODA, Kazuhiko ,  MUKOJIMA, Hitoshi ,  NARIKIYO, Yasuhiro ,  HIRAKAWA, Toshiro ,  KANAKI, Hiromi ,  NISHIMURA, Akira ,  UCHIDA, Osamu ,  ISHIKAWA, Takatoshi

IPC: H05K13/04

CPC classification number: H05K13/0452 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head (16), provided on rotary chip takeout and transfer mechanism (15), removes a chip (6) from a feeder (2) and flips it. A placement head (14) receives the flipped chip (6) and places it onto a board (10). An image of the chip (6) at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head (16) transfers the chip (6) to the placement head (14) at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip (6) and the placement head (14) are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head (16) is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

Abstract translation: 公开了一种电子元件贴装机和电子部件配置方法。 在旋转芯片取出和传送机构（15）上提供的取出和转印头（16）从进料器（2）中移除芯片（6）并翻转。 放置头（14）接收翻转的芯片（6）并将其放置在板（10）上。 在取出和传送操作期间捕获在预定心识别位置处的芯片（6）的图像，在此期间，取出和转印头（16）在接收时将芯片（6）传送到放置头（14） 位置，以便识别位置。 基于该位置识别结果，通过控制放置头驱动机构来定位芯片（6）和放置头（14）。 此外，取出转印头（16）旋转到不妨碍用于放置定位的电子部件的图像捕获的位置。