公开(公告)号：WO2003060998A1

公开(公告)日：2003-07-24

申请号：PCT/US2002/039980

申请日：2002-12-16

申请人： MOTOROLA, INC.

发明人： VISWANATHAN, Lakshminarayan, ,  PIEL, Pierre-Marie, J. ,  FUNK, Garry, Duane ,  DAVIDSON, Robert, P.

IPC分类号： H01L23/14

CPC分类号： H01L23/10 ,  H01L23/053 ,  H01L23/66 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/3011

摘要： A wire bond-less electronic component is for use with a circuit external to the wire bond-less electronic component. The wire bond-less electronic component includes a support substrate (110, 410), an electronic device (130) over the support substrate, and a cover (140, 440, 540) located over the electronic device and the support substrate. The cover includes an interconnect structure (141, 441, 541) electrically coupled to the electronic device and adapted to electrically couple together the electronic device and the circuit for providing impedance transformation of an electrical signal between the electronic device and the circuit.

摘要翻译： 无接线电子元件用于无引线接合电子元件外部的电路。 无引线接合电子部件包括支撑基板（110,410），位于支撑基板上的电子器件（130）以及位于电子器件和支撑基板上的盖子（140,440,540）。 所述盖包括电连接到所述电子设备并且适于将所述电子设备和所述电路电连接在一起以在所述电子设备和所述电路之间提供电信号的阻抗变换的互连结构（141,441,541）。