DEVICE FOR MICROWAVE TREATMENT
    1.
    发明申请
    DEVICE FOR MICROWAVE TREATMENT 审中-公开
    用于微波治疗的装置

    公开(公告)号:WO2012143048A1

    公开(公告)日:2012-10-26

    申请号:PCT/EP2011/056331

    申请日:2011-04-20

    CPC classification number: F26B3/347 F26B15/18 F26B17/04 H05B6/76

    Abstract: The present invention relates to a device (1) for microwave treatment of a material, wherein the device defines a treatment space (3) for receiving the material to be treated by the microwaves (14). The device comprises at least one microwave-generating unit (10) arranged outside the treatment space and adapted to provide microwaves (14) into the treatment space for treating the material, a microwave absorbent (21), and a housing (20) made of a non-microwave transparent material, in which housing the microwave absorbent (21) is arranged. The housing (20) is provided with a plurality of openings (29) for microwaves (15) to pass through to the microwave absorbent (21).

    Abstract translation: 本发明涉及用于微波处理材料的装置(1),其中该装置限定用于接收由微波(14)处理的材料的处理空间(3)。 所述装置包括至少一个微波发生单元(10),其布置在处理空间的外部并且适于将微波(14)提供到用于处理材料的处理空间中,微波吸收剂(21)和壳体(20) 其中布置有微波吸收剂(21)的非微波透明材料。 壳体(20)设置有用于微波(15)的多个开口(29),以通过微波吸收剂(21)。

    METHOD AND APPARATUS FOR ALIGNMENT OPTIMIZATION WITH RESPECT TO PLURALITY OF LAYERS
    2.
    发明申请
    METHOD AND APPARATUS FOR ALIGNMENT OPTIMIZATION WITH RESPECT TO PLURALITY OF LAYERS 审中-公开
    用于对齐多层次的对齐优化的方法和装置

    公开(公告)号:WO2011113682A1

    公开(公告)日:2011-09-22

    申请号:PCT/EP2011/052869

    申请日:2011-02-25

    CPC classification number: G03F9/7003 G03F7/70383 H05K3/4679

    Abstract: A method of patterning a plurality of layers (L1, L2, L3, L4) of a work piece (2404) in a series of writing cycles in one or a plurality of write machines, the workpiece being deviced to have a number of N layers (L1, L2, L3, L4) and layers of the workpiece having one or a plurality of boundary condition (s) for pattern position, the method comprising the steps of: determining the boundary conditions of layers 1 to N, calculating deviations due to the boundary conditions and calculating a compensation for the deviation of the first transformation added with the assigned part of the deviation due to the boundary conditions.

    Abstract translation: 一种在一个或多个写入机器中以一系列写入循环图形化工件(2404)的多个层(L1,L2,L3,L4)的方法,工件被设计成具有多个N层 (L1,L2,L3,L4)和具有用于图案位置的一个或多个边界条件的工件的层,该方法包括以下步骤:确定层1至N的边界条件,计算由于 边界条件,并计算由于边界条件而导致的偏移部分偏差所加入的第一变换偏差的补偿。

    METHOD AND APPARATUS FOR PERFORMING PATTERN ALIGNMENT
    4.
    发明申请
    METHOD AND APPARATUS FOR PERFORMING PATTERN ALIGNMENT 审中-公开
    用于执行图案对齐的方法和装置

    公开(公告)号:WO2011104374A1

    公开(公告)日:2011-09-01

    申请号:PCT/EP2011/052866

    申请日:2011-02-25

    CPC classification number: G03F9/7003 G03F7/70383 H05K3/4679

    Abstract: A method for patterning a workpiece in a direct write machine in the manufacturing of a multilayer stack, wherein a first circuit pattern (1304) comprising patterns for connection points is transformed according to determined fitting tolerances to fit to connection points of a second circuit pattern (1306) and to circuit pattern(s) of specific features such as random placed dies, or group of dies, on or in the workpiece. The second layer may be a previously formed layer or a layer to be formed on the same workpiece or on a different workpiece for the stack. Pattern data associated with selected die is transformed into adjusted circuit pattern data using the transformation defined by the transformed positions such that the circuit pattern is fitted to the selected die(s).

    Abstract translation: 一种用于在制造多层堆叠中的直接写入机器中对工件进行图案化的方法,其中包括用于连接点的图案的第一电路图案(1304)根据确定的配合公差被变换以适合于第二电路图案的连接点 1306)以及在工件上或工件中的特定特征(例如随机放置的模具或一组模具)的电路图案。 第二层可以是预先形成的层或要形成在相同工件上的层或者用于堆叠的不同工件上的层。 与所选择的管芯相关联的模式数据使用由变换的位置定义的变换被转换成调整的电路图案数据,使得电路图案被安装到所选择的管芯。

    METHOD AND APPARATUS FOR PERFORMING PATTERN ALIGNMENT
    5.
    发明申请
    METHOD AND APPARATUS FOR PERFORMING PATTERN ALIGNMENT 审中-公开
    用于执行图案对齐的方法和装置

    公开(公告)号:WO2011104372A1

    公开(公告)日:2011-09-01

    申请号:PCT/EP2011/052864

    申请日:2011-02-25

    CPC classification number: G03F9/7003 G03F7/70383 H05K3/4679

    Abstract: A method for patterning a workpiece provided with dies in a direct write machine, wherein measurement data of positions of the dies in terms of location and orientation together with the workpiece location and orientation relative the writer coordinate system is used to determine a transformation of the measured positions into transformed positions defined in the coordinate system of the direct write machine. Pattern data associated with a selected die, or group of dies, is transformed into adjusted circuit pattern data dependent both on the original pattern data and the transformed positions, wherein the adjusted circuit pattern data represents the circuit pattern of the plurality of dies, or group of dies, such that the adjusted circuit pattern is fitted to a plurality of sub-areas of the workpiece area, and wherein each sub-area is associated with a die, or group of dies, among the plurality of dies distributed on the workpiece. A pattern is then written on the workpiece according to the adjusted circuit pattern data.

    Abstract translation: 一种用于在直接写入机器中设置有模具的工件图案化的方法,其中使用位置和取向上的模具的位置的测量数据以及相对于作者坐标系的工件位置和取向,以确定所测量的 位置转换成在直写机的坐标系中定义的转换位置。 与所选择的管芯或管芯组相关联的图案数据被转换为依赖于原始图案数据和变换位置的经调整的电路图案数据,其中经调整的电路图案数据表示多个管芯或组 使得调整后的电路图案装配到工件区域的多个子区域,并且其中每个子区域与分布在工件上的多个模具中的模具或一组模具相关联。 然后根据经调整的电路图案数据将图案写入工件。

    METHOD AND APPARATUS FOR PERFORMING PATTERN ALIGNMENT
    6.
    发明申请
    METHOD AND APPARATUS FOR PERFORMING PATTERN ALIGNMENT 审中-公开
    用于执行图案对齐的方法和装置

    公开(公告)号:WO2011104375A1

    公开(公告)日:2011-09-01

    申请号:PCT/EP2011/052867

    申请日:2011-02-25

    CPC classification number: G03F9/7003 G03F7/70383 H05K3/4679

    Abstract: A method for patterning a second layer of a work piece in a direct write machine in the manufacturing of a multilayer system-in-package stack. The work piece having a first layer with a plurality of electrical components in the form of dies (1502) arbitrarily placed. Each component having connection points where some need to be connected between the components. A first pattern wherein different zones (1510) comprising connection points of dies distributed in the first layer are associated with different requirements on alignment. The method comprising the steps of: a. Detecting sacred zones in first pattern that have a high requirement on alignment to selected features of the system-in-package stack or to the placed components; b. Detecting stretch zones (1510) of the first pattern that are allowed to have a lower requirement on alignment to other features of the system-in-package stack; c. Transforming the first pattern by calculating adjusted first pattern data comprising transformation of the original circuit pattern such that: i. connection points in adjacent sacred zones are aligned within a pre-settable alignment deviation parameter; and such that ii. deviations between the positions of corresponding connection points in the sacred zones are compensated for in the pattern for connection points of the stretch zones; d. writing a pattern on the layer of the work piece according to the adjusted pattern data. The first pattern may also be simultaneously matched to a second pattern.

    Abstract translation: 一种用于在制造多层系统级封装叠层中的直接写入机中构图工件的第二层的方法。 该工件具有第一层,该第一层具有任意放置的模具(1502)形式的多个电气部件。 每个组件具有连接点,其中一些需要在组件之间连接。 第一模式,其中包括分布在第一层中的模具的连接点的不同区域(1510)与对准的不同要求相关联。 该方法包括以下步骤:a。 检测对于系统级封装堆叠或所放置组件的选定特征的对准要求高的第一模式中的神圣区域; 湾 检测第一图案的拉伸区域(1510),其被允许对与系统级封装堆叠体的其它特征进行对准的较低要求; C。 通过计算包括原始电路图案的变换的经调整的第一图案数据来变换第一图案,使得:i。 相邻神圣区域中的连接点在可预设的对准偏差参数内对齐; 并且ii。 在拉伸区域的连接点的图案中补偿神圣区域中的相应连接点的位置之间的偏差; 天。 根据调整的图案数据在工件的层上写入图案。 第一图案也可以与第二图案同时匹配。

    BACKSIDE IMMERSION LITHOGRAPHY
    7.
    发明申请
    BACKSIDE IMMERSION LITHOGRAPHY 审中-公开
    后置倾斜图

    公开(公告)号:WO2007131769A1

    公开(公告)日:2007-11-22

    申请号:PCT/EP2007/004304

    申请日:2007-05-15

    CPC classification number: G03F7/70341 G03F1/54 G03F1/76

    Abstract: The present disclosure relates to formation of latent images in a radiation sensitive layer applied to a substrate (210) that is transparent to or transmissive of radiation at the exposing wavelength. In particular, it relates to so-called backside lithography, in which the final lens (101) of an exposing system is positioned to project electromagnetic radiation through a first side of the transparent substrate (110) and expose a radiation sensitive layer (214) that overlays a second side of the transparent substrate that is opposite the first side. Five alternative embodiments for further treatment to form a radiation opaque layer corresponding to the latent image (the image or its inverse) are described. These methods and corresponding devices are useful for producing masks (sometimes called reticles), for producing latent images in semiconductor devices and for forming features of semiconductor devices using masks.

    Abstract translation: 本公开涉及在施加到对曝光波长的透射透射或透射的衬底(210)的辐射敏感层中的潜像的形成。 特别地,本发明涉及所谓的背面光刻技术,其中曝光系统的最终透镜(101)定位成将电磁辐射投影穿过透明基板(110)的第一侧并暴露辐射敏感层(214) 覆盖透明基板的与第一侧相对的第二面。 描述了用于进一步处理以形成对应于潜像(辐射不透明层)的替代实施例(图像或其倒数)。 这些方法和相应的装置可用于制造掩模(有时称为掩模版),用于在半导体器件中产生潜像并使用掩模形成半导体器件的特征。

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