公开(公告)号：WO2007123820A3

公开(公告)日：2008-01-03

申请号：PCT/US2007008564

申请日：2007-04-05

Applicant: QUALCOMM INC ,  SASAGAWA TERUO ,  KOGUT LIOR ,  TUNG MING-HAU

Inventor： SASAGAWA TERUO ,  KOGUT LIOR ,  TUNG MING-HAU

IPC: B81C1/00

CPC classification number: B81B3/0008 ,  G02B26/001

Abstract: Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. A non-planar surface is formed on one or more layers by flowing an etchant through a permeable layer. In one embodiment the non-planar surface is formed on a sacrificial layer. A movable layer formed over the non-planar surface of the sacrificial layer results in a non-planar interface between the sacrificial and movable layers. Removal of the sacrificial layer results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.

Abstract translation: 制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层，可移动层和牺牲层的各种层。 通过使蚀刻剂流过可渗透层而在一个或多个层上形成非平面表面。 在一个实施例中，非平面表面形成在牺牲层上。 形成在牺牲层的非平面表面上的可移动层导致牺牲层和可移动层之间的非平面界面。 牺牲层的去除导致释放的MEMS器件在MEMS器件致动时具有减小可移动层和固定层之间的接触面积。 减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。 这些方法可用于制造释放和未释放的干涉式调制器。

公开(公告)号：WO2007126844A3

公开(公告)日：2007-12-21

申请号：PCT/US2007007613

申请日：2007-03-27

Applicant: QUALCOMM INC ,  TUNG MING-HAU ,  AKELLA SRIRAM ,  CUMMINGS WILLIAM J ,  KOGUT LIOR

Inventor： TUNG MING-HAU ,  AKELLA SRIRAM ,  CUMMINGS WILLIAM J ,  KOGUT LIOR

IPC: B81C1/00

CPC classification number: B81B3/0008 ,  G02B26/001

Abstract: Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. Apertures are formed in one or more of the various layers so as to form a non-planar surface on the movable and/or the stationary layers. Other layers may be formed over the formed apertures. Removal of the sacrificial layer from between the resulting non-planar movable and/or stationary layers results in a released MEMS device having reduced contact area and/or a larger surface separation between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.

Abstract translation: 制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层，可移动层和牺牲层的各种层。 在各个层中的一个或多个中形成孔，以便在可移动和/或固定层上形成非平面表面。 可以在所形成的孔上形成其它层。 从所得到的非平面可移动和/或固定层之间去除牺牲层导致当MEMS器件致动时，可释放的MEMS器件具有减小的接触面积和/或可移动层和固定层之间较大的表面间隔。 减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。 这些方法可用于制造释放和未释放的干涉式调制器。

公开(公告)号：WO2008002459A2

公开(公告)日：2008-01-03

申请号：PCT/US2007014513

申请日：2007-06-21

Applicant: QUALCOMM INC ,  KOGUT LIOR ,  TUNG MING-HAU ,  ARBUCKLE BRIAN

Inventor： KOGUT LIOR ,  TUNG MING-HAU ,  ARBUCKLE BRIAN

IPC: B81B3/00

CPC classification number: B81B3/0072

Abstract: A microelectromechanical (MEMS) device includes a functional layer including a first material and a deformable layer including a second material. The second material is different from the first material. The deformable layer is mechanically coupled to the functional layer at a junction. The functional layer and the deformable layer have substantially equal internal stresses at the junction.

Abstract translation: 微机电（MEMS）装置包括包括第一材料和包括第二材料的可变形层的功能层。 第二种材料与第一种材料不同。 可变形层在结处机械耦合到功能层。 功能层和可变形层在接合处具有基本相等的内应力。

公开(公告)号：WO2009006120A8

公开(公告)日：2010-02-04

申请号：PCT/US2008068063

申请日：2008-06-24

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  CHUI CLARENCE ,  CUMMINGS WILLIAM ,  GALLY BRIAN J ,  KOGUT LIOR ,  TUNG MING-HAU ,  TUNG YEH-JIUN ,  CHIANG CHIH-WEI ,  ENDISCH DENIS

Inventor： CHUI CLARENCE ,  CUMMINGS WILLIAM ,  GALLY BRIAN J ,  KOGUT LIOR ,  TUNG MING-HAU ,  TUNG YEH-JIUN ,  CHIANG CHIH-WEI ,  ENDISCH DENIS

IPC: G02B26/00 ,  B81B3/00 ,  B81C1/00 ,  B81C99/00

CPC classification number: G02B26/001 ,  B81B3/0051 ,  B81B2201/047 ,  G02B26/023 ,  G02B26/08 ,  G02F1/01 ,  G02F1/0128 ,  G02F1/133621 ,  G02F1/29 ,  G09G3/3466 ,  G09G3/3696 ,  Y10T29/42

Abstract: A microelectromechanical (MEMS) device (1300) includes a substrate (20), a movable element (1340) over the substrate (20), and an actuation electrode (142) above the movable element (1340). The movable element (1340) includes a deformable layer (1302) and a reflective element (1314), The deformable layer (1302) is spaced from the reflective element (1314).

Abstract translation: 微机电（MEMS）装置（1300）包括衬底（20），在衬底（20）上方的可移动元件（1340）和可动元件（1340）上方的致动电极（142）。 可移动元件（1340）包括可变形层（1302）和反射元件（1314）。可变形层（1302）与反射元件（1314）间隔开。

公开(公告)号：WO2008008162A3

公开(公告)日：2008-04-03

申请号：PCT/US2007014511

申请日：2007-06-21

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  KOGUT LIOR ,  TUNG MING-HAU ,  ARBUCKLE BRIAN

Inventor： KOGUT LIOR ,  TUNG MING-HAU ,  ARBUCKLE BRIAN

IPC: B81B3/00

CPC classification number: B81B3/0072 ,  G02B26/001

Abstract: A microelectromechanical (MEMS) device includes a functional layer including a first material, a deformable layer including a second material different from the first material, and a connecting element including the first material. The connecting element is mechanically coupled to the deformable layer and the functional layer. The connecting element and the deformable layer form an interface between the first material and the second material. The interface is spaced from the functional layer.

Abstract translation: 微机电（MEMS）装置包括功能层，其包括第一材料，可变形层，其包括不同于第一材料的第二材料，以及包括第一材料的连接元件。 连接元件机械耦合到可变形层和功能层。 连接元件和可变形层在第一材料和第二材料之间形成界面。 界面与功能层间隔开。

公开(公告)号：WO2008121543A3

公开(公告)日：2008-12-18

申请号：PCT/US2008057273

申请日：2008-03-17

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  KOGUT LIOR ,  TUNG MING-HAU

Inventor： KOGUT LIOR ,  TUNG MING-HAU

IPC: B81B3/00 ,  G02B26/00

CPC classification number: B81B3/001 ,  B81B2201/047 ,  G02B26/001 ,  G02B26/0841 ,  Y10T29/49002

Abstract: A microelectromechanical system (MEMS) device includes a reflective element that includes at least one stop member. The device also includes an electrode and an aperture that extends at least partially through the electrode. The aperture has a boundary. The device has an electrically nonconductive surface within the aperture or on a portion of the boundary of the aperture. A support structure separates the reflective element from the electrode. The reflective element can be moved between a first position and a second position. The stop member is spaced from the electrically nonconductive surface when the reflective element is in the first position. A portion of the stop member is in contact with the electrically nonconductive surface when the reflective element is in the second position. The reflective element and the electrode are electrically isolated from each other when the reflective element is in the second position.

Abstract translation: 微机电系统（MEMS）装置包括包括至少一个止动构件的反射元件。 该装置还包括至少部分延伸穿过电极的电极和孔。 光圈有一个边界。 该装置在孔的内部或孔的边界的一部分上具有非导电表面。 支撑结构将反射元件与电极分开。 反射元件可以在第一位置和第二位置之间移动。 当反射元件处于第一位置时，止动件与非导电表面间隔开。 当反射元件处于第二位置时，止动构件的一部分与非导电表面接触。 当反射元件处于第二位置时，反射元件和电极彼此电隔离。

公开(公告)号：WO2007120886A3

公开(公告)日：2008-05-22

申请号：PCT/US2007009274

申请日：2007-04-12

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  SASAGAWA TERUO ,  KOGUT LIOR

Inventor： SASAGAWA TERUO ,  KOGUT LIOR

IPC: B81B3/00 ,  G02B26/00

CPC classification number: B81B3/001 ,  B81B2201/047 ,  B81C2201/0115 ,  G02B26/001

Abstract: A microelectromechanical device (MEMS) utilizing a porous electrode surface for reducing stiction is disclosed. In one embodiment, a microelectromechanical device is an interferometric modulator 80 that includes a transparent electrode 81 having a first surface 81a; and a movable reflective electrode 82 with a second surface 82a facing the first surface 81a. The movable reflective electrode 82 is movable between a relaxed and actuated (collapsed) position. An aluminum layer is provided on either the first or second surface. The aluminum layer is then anodized to provide an aluminum oxide layer 83 which has a porous surface 83a. The porous surface 83a, in the actuated position, decreases contact area between the electrodes 81 and 82, thus reducing stiction.

Abstract translation: 公开了一种利用多孔电极表面降低静摩擦力的微机电装置（MEMS）。 在一个实施例中，微机电装置是干涉式调制器80，其包括具有第一表面81a的透明电极81; 以及具有面向第一表面81a的第二表面82a的可移动反射电极82。 可移动反射电极82可在松弛和致动（折叠）位置之间移动。 在第一或第二表面上提供铝层。 然后将铝层阳极氧化以提供具有多孔表面83a的氧化铝层83。 处于致动位置的多孔表面83a减小了电极81和82之间的接触面积，从而减小了静电。

公开(公告)号：WO2007100478A3

公开(公告)日：2008-01-17

申请号：PCT/US2007003647

申请日：2007-02-12

Applicant: QUALCOMM INC ,  MIGNARD MARC ,  KOGUT LIOR

Inventor： MIGNARD MARC ,  KOGUT LIOR

IPC: G02B26/00 ,  B81B3/00 ,  G09G3/34

CPC classification number: G02B26/001 ,  B81B3/0078 ,  B81B2201/047 ,  B81B2201/054 ,  B81B2203/053 ,  G09G3/3466 ,  G09G2300/06

Abstract: A microelectromechanical (MEMS) device includes a substrate and a movable layer mechanically coupled to the substrate. The movable layer moves from a first position to a second position at a first rate and from the second position to the first position at a second rate faster than the first rate. The MEMS device further includes an adjustable cavity defined between the substrate and the movable layer and containing a fluid. The MEMS device further includes a fluid conductive element through which the fluid flows at a first flowrate from inside the cavity to outside the cavity upon movement of the movable layer from the second position to the first position and through which the fluid flows at a second flowrate slower than the first flowrate from outside the cavity to inside the cavity upon movement of the movable layer from the first position to the second position.

Abstract translation: 微机电（MEMS）装置包括基板和机械耦合到基板的可移动层。 可移动层以第一速率从第一位置移动到第二位置，并且以比第一速率快的第二速率从第二位置移动到第一位置。 MEMS器件还包括限定在衬底和可移动层之间并包含流体的可调节空腔。 MEMS装置还包括流体导电元件，当可移动层从第二位置移动到第一位置时，流体从腔体内部以第一流量流动到腔体外部，并且流体以第二流量流动 当从可移动层从第一位置移动到第二位置时，其比从空腔外部到腔体内部的第一流速慢。

公开(公告)号：WO2007126919A2

公开(公告)日：2007-11-08

申请号：PCT/US2007007719

申请日：2007-03-28

Applicant: QUALCOMM INC ,  LUO QI ,  AKELLA SRIRAM ,  KOGUT LIOR

Inventor： LUO QI ,  AKELLA SRIRAM ,  KOGUT LIOR

IPC: B81C1/00

CPC classification number: B81B3/0008 ,  G02B26/001

Abstract: Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. Voids are formed in one or more of the various layers so as to form a non-planar surface on the movable and/or the stationary layers. The voids are formed to extend through less than the entire thickness of the layer where they are being formed. Other layers may be formed over the formed voids. Removal of the sacrificial layer from between the resulting non-planar movable and/or stationary layers results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.

Abstract translation: 制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层，可移动层和牺牲层的各种层。 在各层中的一个或多个中形成空隙，以在可移动和/或固定层上形成非平面表面。 空隙形成为延伸穿过小于形成它们的层的整个厚度。 可以在所形成的空隙上形成其它层。 从所得到的非平面可移动和/或固定层之间去除牺牲层导致当MEMS器件致动时，可释放的MEMS器件具有减小的可移动层和固定层之间的接触面积。 减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。 这些方法可用于制造释放和未释放的干涉式调制器。

公开(公告)号：WO2007081547A2

公开(公告)日：2007-07-19

申请号：PCT/US2006049148

申请日：2006-12-22

Applicant: QUALCOMM INC ,  KOTHARI MANISH ,  KOGUT LIOR ,  CHUI CLARENCE

Inventor： KOTHARI MANISH ,  KOGUT LIOR ,  CHUI CLARENCE

CPC classification number: G01L5/0047 ,  G02B26/001

Abstract: The invention comprises systems and methods determining residual stress such as that found in interferometric modulators. In one example, a test unit can be configured to indicate residual stress in a film by interferometrically modulating light indicative of an average residual stress in two orthogonal directions of the substrate. The test unit can include a reflective membrane attached to the substrate where membrane is configured as a parallelogram with at least a portion of each side attached to the substrate, and an interferometric cavity formed between a portion of the membrane and a portion of the substrate, and where the membrane is configured to deform based on the residual stress of in the film and modulate light indicative of the amount of membrane deformation.

Abstract translation: 本发明包括确定残余应力的系统和方法，例如在干涉式调制器中发现的。 在一个示例中，测试单元可以被配置为通过对指示基板的两个正交方向上的平均残余应力的光进行干涉测量来指示膜中的残余应力。 测试单元可以包括附接到基底的反射膜，其中膜被构造为平行四边形，其中每侧的至少一部分附着到基底，以及形成在膜的一部分和基底的一部分之间的干涉腔， 并且其中膜被配置为基于膜中的残余应力而变形并且调制指示膜变形量的光。