公开(公告)号：WO2009006120A8

公开(公告)日：2010-02-04

申请号：PCT/US2008068063

申请日：2008-06-24

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  CHUI CLARENCE ,  CUMMINGS WILLIAM ,  GALLY BRIAN J ,  KOGUT LIOR ,  TUNG MING-HAU ,  TUNG YEH-JIUN ,  CHIANG CHIH-WEI ,  ENDISCH DENIS

Inventor： CHUI CLARENCE ,  CUMMINGS WILLIAM ,  GALLY BRIAN J ,  KOGUT LIOR ,  TUNG MING-HAU ,  TUNG YEH-JIUN ,  CHIANG CHIH-WEI ,  ENDISCH DENIS

IPC: G02B26/00 ,  B81B3/00 ,  B81C1/00 ,  B81C99/00

CPC classification number: G02B26/001 ,  B81B3/0051 ,  B81B2201/047 ,  G02B26/023 ,  G02B26/08 ,  G02F1/01 ,  G02F1/0128 ,  G02F1/133621 ,  G02F1/29 ,  G09G3/3466 ,  G09G3/3696 ,  Y10T29/42

Abstract: A microelectromechanical (MEMS) device (1300) includes a substrate (20), a movable element (1340) over the substrate (20), and an actuation electrode (142) above the movable element (1340). The movable element (1340) includes a deformable layer (1302) and a reflective element (1314), The deformable layer (1302) is spaced from the reflective element (1314).

Abstract translation: 微机电（MEMS）装置（1300）包括衬底（20），在衬底（20）上方的可移动元件（1340）和可动元件（1340）上方的致动电极（142）。 可移动元件（1340）包括可变形层（1302）和反射元件（1314）。可变形层（1302）与反射元件（1314）间隔开。

公开(公告)号：WO2008008162A3

公开(公告)日：2008-04-03

申请号：PCT/US2007014511

申请日：2007-06-21

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  KOGUT LIOR ,  TUNG MING-HAU ,  ARBUCKLE BRIAN

Inventor： KOGUT LIOR ,  TUNG MING-HAU ,  ARBUCKLE BRIAN

IPC: B81B3/00

CPC classification number: B81B3/0072 ,  G02B26/001

Abstract: A microelectromechanical (MEMS) device includes a functional layer including a first material, a deformable layer including a second material different from the first material, and a connecting element including the first material. The connecting element is mechanically coupled to the deformable layer and the functional layer. The connecting element and the deformable layer form an interface between the first material and the second material. The interface is spaced from the functional layer.

Abstract translation: 微机电（MEMS）装置包括功能层，其包括第一材料，可变形层，其包括不同于第一材料的第二材料，以及包括第一材料的连接元件。 连接元件机械耦合到可变形层和功能层。 连接元件和可变形层在第一材料和第二材料之间形成界面。 界面与功能层间隔开。

公开(公告)号：WO2008121543A3

公开(公告)日：2008-12-18

申请号：PCT/US2008057273

申请日：2008-03-17

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  KOGUT LIOR ,  TUNG MING-HAU

Inventor： KOGUT LIOR ,  TUNG MING-HAU

IPC: B81B3/00 ,  G02B26/00

CPC classification number: B81B3/001 ,  B81B2201/047 ,  G02B26/001 ,  G02B26/0841 ,  Y10T29/49002

Abstract: A microelectromechanical system (MEMS) device includes a reflective element that includes at least one stop member. The device also includes an electrode and an aperture that extends at least partially through the electrode. The aperture has a boundary. The device has an electrically nonconductive surface within the aperture or on a portion of the boundary of the aperture. A support structure separates the reflective element from the electrode. The reflective element can be moved between a first position and a second position. The stop member is spaced from the electrically nonconductive surface when the reflective element is in the first position. A portion of the stop member is in contact with the electrically nonconductive surface when the reflective element is in the second position. The reflective element and the electrode are electrically isolated from each other when the reflective element is in the second position.

Abstract translation: 微机电系统（MEMS）装置包括包括至少一个止动构件的反射元件。 该装置还包括至少部分延伸穿过电极的电极和孔。 光圈有一个边界。 该装置在孔的内部或孔的边界的一部分上具有非导电表面。 支撑结构将反射元件与电极分开。 反射元件可以在第一位置和第二位置之间移动。 当反射元件处于第一位置时，止动件与非导电表面间隔开。 当反射元件处于第二位置时，止动构件的一部分与非导电表面接触。 当反射元件处于第二位置时，反射元件和电极彼此电隔离。

公开(公告)号：WO2007126844A3

公开(公告)日：2007-12-21

申请号：PCT/US2007007613

申请日：2007-03-27

Applicant: QUALCOMM INC ,  TUNG MING-HAU ,  AKELLA SRIRAM ,  CUMMINGS WILLIAM J ,  KOGUT LIOR

Inventor： TUNG MING-HAU ,  AKELLA SRIRAM ,  CUMMINGS WILLIAM J ,  KOGUT LIOR

IPC: B81C1/00

CPC classification number: B81B3/0008 ,  G02B26/001

Abstract: Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. Apertures are formed in one or more of the various layers so as to form a non-planar surface on the movable and/or the stationary layers. Other layers may be formed over the formed apertures. Removal of the sacrificial layer from between the resulting non-planar movable and/or stationary layers results in a released MEMS device having reduced contact area and/or a larger surface separation between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.

Abstract translation: 制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层，可移动层和牺牲层的各种层。 在各个层中的一个或多个中形成孔，以便在可移动和/或固定层上形成非平面表面。 可以在所形成的孔上形成其它层。 从所得到的非平面可移动和/或固定层之间去除牺牲层导致当MEMS器件致动时，可释放的MEMS器件具有减小的接触面积和/或可移动层和固定层之间较大的表面间隔。 减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。 这些方法可用于制造释放和未释放的干涉式调制器。

公开(公告)号：WO2008002459A2

公开(公告)日：2008-01-03

申请号：PCT/US2007014513

申请日：2007-06-21

Applicant: QUALCOMM INC ,  KOGUT LIOR ,  TUNG MING-HAU ,  ARBUCKLE BRIAN

Inventor： KOGUT LIOR ,  TUNG MING-HAU ,  ARBUCKLE BRIAN

IPC: B81B3/00

CPC classification number: B81B3/0072

Abstract: A microelectromechanical (MEMS) device includes a functional layer including a first material and a deformable layer including a second material. The second material is different from the first material. The deformable layer is mechanically coupled to the functional layer at a junction. The functional layer and the deformable layer have substantially equal internal stresses at the junction.

Abstract translation: 微机电（MEMS）装置包括包括第一材料和包括第二材料的可变形层的功能层。 第二种材料与第一种材料不同。 可变形层在结处机械耦合到功能层。 功能层和可变形层在接合处具有基本相等的内应力。

公开(公告)号：WO2007123820A3

公开(公告)日：2008-01-03

申请号：PCT/US2007008564

申请日：2007-04-05

Applicant: QUALCOMM INC ,  SASAGAWA TERUO ,  KOGUT LIOR ,  TUNG MING-HAU

Inventor： SASAGAWA TERUO ,  KOGUT LIOR ,  TUNG MING-HAU

IPC: B81C1/00

CPC classification number: B81B3/0008 ,  G02B26/001

Abstract: Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. A non-planar surface is formed on one or more layers by flowing an etchant through a permeable layer. In one embodiment the non-planar surface is formed on a sacrificial layer. A movable layer formed over the non-planar surface of the sacrificial layer results in a non-planar interface between the sacrificial and movable layers. Removal of the sacrificial layer results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.

Abstract translation: 制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层，可移动层和牺牲层的各种层。 通过使蚀刻剂流过可渗透层而在一个或多个层上形成非平面表面。 在一个实施例中，非平面表面形成在牺牲层上。 形成在牺牲层的非平面表面上的可移动层导致牺牲层和可移动层之间的非平面界面。 牺牲层的去除导致释放的MEMS器件在MEMS器件致动时具有减小可移动层和固定层之间的接触面积。 减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。 这些方法可用于制造释放和未释放的干涉式调制器。

公开(公告)号：WO2008054504A3

公开(公告)日：2008-08-28

申请号：PCT/US2007008910

申请日：2007-04-09

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  TUNG MING-HAU ,  CHUNG WONSUK

Inventor： TUNG MING-HAU ,  CHUNG WONSUK

IPC: G02B26/00 ,  B81C1/00

CPC classification number: G02B26/001 ,  B81B2201/047 ,  B81C1/00666 ,  B81C2201/0109

Abstract: A method of fabricating a MEMS device includes the formation of support posts having horizontal wing portions at the edges of the post. A mechanical layer is deposited over the support posts and portions of the mechanical layer overlying portions of the support post other than the horizontal wing portions are etched away. A resultant MEMS device includes a mechanical layer overlying at least a portion of the horizontal wing portions of the underlying support structures.

Abstract translation: 制造MEMS器件的方法包括形成在支柱边缘具有水平翼部分的支柱。 将机械层沉积在支柱上，并且除了水平翼部分之外的机械层覆盖支柱部分的部分被蚀刻掉。 合成的MEMS器件包括覆盖下面的支撑结构的至少一部分水平翼部分的机械层。

公开(公告)号：WO2008039229A3

公开(公告)日：2008-06-05

申请号：PCT/US2007004277

申请日：2007-02-16

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  WANG CHUN-MING ,  TUNG MING-HAU ,  GANTI SURYA PRAKASH

Inventor： WANG CHUN-MING ,  TUNG MING-HAU ,  GANTI SURYA PRAKASH

IPC: G09F13/08

CPC classification number: G02B26/001

Abstract: Methods and apparatus for providing light in an interferometric modulator device are provided. In one embodiment, a microelectromechanical system (MEMS) is provided that includes a transparent substrate and a plurality of interferometric modulators. The interferometric modulators include an optical stack coupled to the transparent substrate, a reflective layer over the optical stack, and one or more posts to support the reflective and to provide a path for light from a backlight for lighting the interferometric modulators.

Abstract translation: 提供了用于在干涉式调制器装置中提供光的方法和装置。 在一个实施例中，提供了包括透明基板和多个干涉式调制器的微机电系统（MEMS）。 所述干涉式调制器包括耦合到所述透明衬底的光学叠层，所述光学叠层上的反射层以及用于支撑所述反射体的一个或多个柱，以及为来自所述背光源的光提供用于点亮所述干涉式调制器的路径。

公开(公告)号：WO2012044629A3

公开(公告)日：2012-06-28

申请号：PCT/US2011053522

申请日：2011-09-27

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  LI KEBIN ,  TUNG MING-HAU ,  GOUSEV EVGENI P

Inventor： LI KEBIN ,  TUNG MING-HAU ,  GOUSEV EVGENI P

IPC: G02B26/00 ,  F21V8/00 ,  G02B26/02

CPC classification number: G02B26/001 ,  G02B6/0035 ,  G02B6/0055

Abstract: This disclosure provides systems, methods and apparatus, including reflective display elements that are illuminated using a light source that is situated behind the pixel elements. In one aspect, a back light guide is disposed behind the pixel elements and is configured to inject light through light-injection apertures between reflective pixel elements. The light travels through the light-injection apertures and into a front light guide. The front light guide comprises light turning features configured to turn the light propagating through the light-injection apertures so that the light is redirected onto the reflective pixel elements, thereby illuminating the reflective pixel elements.

Abstract translation: 本公开提供了系统，方法和设备，包括使用位于像素元件后面的光源照射的反射式显示元件。 在一个方面中，背光导被布置在像素元件后面并被配置为通过反射像素元件之间的光注入孔注入光。 光线通过光注入孔进入前光导。 所述前光导包括光转向特征，所述光转向特征被配置为转动传播通过所述光注入孔的光，使得所述光被重定向到所述反射像素元件上，从而照射所述反射像素元件。

公开(公告)号：WO2008100279A3

公开(公告)日：2009-01-22

申请号：PCT/US2007016353

申请日：2007-07-18

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  YAN XIAOMING ,  ARBUCKLE BRIAN ,  GOUSEV EVGENI ,  TUNG MING-HAU

Inventor： YAN XIAOMING ,  ARBUCKLE BRIAN ,  GOUSEV EVGENI ,  TUNG MING-HAU

IPC: B81C1/00

CPC classification number: G02B26/001 ,  B81B2201/047 ,  B81C1/00595 ,  B81C2201/0132

Abstract: A method for etching a target material in the presence of a structural material with improved selectivity uses a vapor phase etchant and a co-etchant. Embodiments of the method exhibit improved selectivities of from at least about 2-times to at least about 100- times compared with a similar etching process not using a co-etchant. In some embodiments, the target material comprises a metal etchable by the vapor phase etchant. Embodiments of the method are particularly useful in the manufacture of MEMS devices, for example, interferometric modulators. In some embodiments, the target material comprises a metal etchable by the vapor phase etchant, for example, molybdenum and the structural material comprises a dielectric, for example silicon dioxide.

Abstract translation: 在具有改进的选择性的结构材料存在下蚀刻靶材料的方法使用气相蚀刻剂和共蚀刻剂。 与不使用共蚀刻剂的类似蚀刻工艺相比，该方法的实施方案显示出从至少约2倍至至少约100倍的改进的选择性。 在一些实施例中，靶材料包括可由气相蚀刻剂蚀刻的金属。 该方法的实施例在MEMS器件（例如干涉式调制器）的制造中特别有用。 在一些实施例中，靶材料包括可由气相蚀刻剂（例如，钼）蚀刻的金属，并且结构材料包括电介质，例如二氧化硅。