Abstract:
The present invention generally relates to a MEMS device in which silicon residues from the adhesion promoter material are reduced or even eliminated from the cavity floor. The adhesion promoter is typically used to adhere sacrificial material to material above the substrate. The adhesion promoter is the removed along with then sacrificial material. However, the adhesion promoter leaves silicon based residues within the cavity upon removal. The inventors have discovered that the adhesion promoter can be removed from the cavity area prior to depositing the sacrificial material. The adhesion promoter which remains over the remainder of the substrate is sufficient to adhere the sacrificial material to the substrate without fear of the sacrificial material delaminating. Because no adhesion promoter is used in the cavity area of the device, no silicon residues will be present within the cavity after the switching element of the MEMS device is freed.
Abstract:
In certain embodiments, a device is provided including a substrate (102) and a plurality of supports (104) over the substrate. The device further includes a mechanical layer (106) having a movable portion and a stationary portion. The stationary portion being disposed over the supports. The device further includes a reflective surface (108) positioned over the substrate and mechanically coupled to the movable portion (112). The device of certain embodiments further includes at least one movable stop element (110) displaced from and mechanically coupled to the movable portion. In certain embodiments, the at least a portion of the stop element may be positioned over the stationary portion.
Abstract:
A micro-electrical-mechanical system (MEMS) transducer comprises a layer of dielectric material having an electrode formed in the layer of dielectric material.A region of the layer of the dielectric material is adapted to provide a leakage path which, in use, removes unwanted charge from the layer of dielectric material.
Abstract:
Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. A non-planar surface is formed on one or more layers by flowing an etchant through a permeable layer. In one embodiment the non-planar surface is formed on a sacrificial layer. A movable layer formed over the non-planar surface of the sacrificial layer results in a non-planar interface between the sacrificial and movable layers. Removal of the sacrificial layer results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.
Abstract:
An electronic device, such as a filter of phase shifter, for example, includes a substrate, and a MEMS capacitor on the substrate and having a plurality of selectable capacitance values. The MEMS capacitor includes a lower capacitor electrode on the substrate, and a movable bridge comprising end portions connected to the substrate laterally adjacent the lower capacitor electrode. The movable bridge may also include a conductive medial portion between the end portions defining an upper capacitor electrode suspended above the lower capacitor electrode and being movable between an upper position and a lower position by an electrostatic force generated between the capacitor electrodes. Moreover, the movable bridge may further include at least one trovel limiting portion between the end portions for engaging adjacent sustrate portions to keep the upper capacitor electrode in a predetermined spaced relation from the lower capacitor electrode when in the lower position.
Abstract:
An electronic device, such as a filter of phase shifter, for example, includes a substrate, and a MEMS capacitor on the substrate and having a plurality of selectable capacitance values. The MEMS capacitor includes a lower capacitor electrode on the substrate, and a movable bridge comprising end portions connected to the substrate laterally adjacent the lower capacitor electrode. The movable bridge may also include a conductive medial portion between the end portions defining an upper capacitor electrode suspended above the lower capacitor electrode and being movable between an upper position and a lower position by an electrostatic force generated between the capacitor electrodes. Moreover, the movable bridge may further include at least one trovel limiting portion between the end portions for engaging adjacent sustrate portions to keep the upper capacitor electrode in a predetermined spaced relation from the lower capacitor electrode when in the lower position.
Abstract:
The invention concerns micromechanical components (4'; 40) with reduced static friction having in general a size less than 1 mm, devices comprising said components, the manufacture and use of said components, as well as a method for treating the surfaces of micromechanical components (4'; 40). Said method consists in modifying by a surface treatment faulty electronic regions of the semiconductor material used. The inventive components are used for example in acceleration sensors.
Abstract:
[Problem] The objective is to cause a substrate on which a shutter is provided and a substrate that opposes it to be electrically continuous. [Means of Solution] On a first substrate 10, a shutter 28 that controls the passing or blocking of light, a driver 52 for driving the shutter 28, and a protruding part 62 having a plurality of side faces 66 rising from the first substrate 10 so as to circumscribe a prescribed space are respectively provided so as to contain a laminate structure of a first conducting film 54 and an insulating film 16. The outermost layer of the respective plurality of side faces 66 is made of the insulating film 16 that covers the first conducting film 54, and has an aperture 68 which exposes part of the first conducting film 54. Conducting particles 70 are arranged in the prescribed space circumscribed by the plurality of side faces 66, and on the side nearest the first substrate 10, contact the first conducting film 54 exposed from the aperture 68 in the plurality of side faces 66, and on the side nearest the second substrate 12, contact a second conducting film 22.