公开(公告)号：WO2010022824A3

公开(公告)日：2010-05-14

申请号：PCT/EP2009005299

申请日：2009-07-21

Applicant: RENA GMBH ,  REUSTLE PETER ,  GUTEKUNST MATHIAS

Inventor： REUSTLE PETER ,  GUTEKUNST MATHIAS

IPC: H01L21/00 ,  C25D7/12 ,  C25D17/02 ,  H01L21/60

CPC classification number: C25D5/08 ,  C25D5/006 ,  C25D17/001 ,  C25D17/008 ,  C25D17/06 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/76897

Abstract: The invention relates to the wet processing and electroplating of one side and/or the edge of a flat product (1) used as a substrate in production systems containing process chambers (4), through which treatment liquid flows (8), wetting the product (1) that is positioned at the upper opening (3) of the process chamber (4). According to prior art, process chambers (4) of this type are suitable for one type of product (1) with particular dimensions. The invention provides the flexibility required in practice with respect to products (1) of different sizes. To achieve this, the process chamber (4) is designed in at least two parts with a lower part (5) and at least two upper parts (6) that can be preferably automatically interchanged. The separation point (7) of both parts is designed in a positive manner and can be automatically detached. Upper parts (6) that are adapted specifically to the product are placed on the fixed lower part (5) in order to produce the product, thus permitting the entire process chamber (4) to be optimised for the production of the designated type of product (1).

Abstract translation: 本发明涉及一种湿处理和页面和/或扁平好（1）作为在生产与处理液的处理腔室（4）基片的边缘的电镀（8）流过，而在上部开口（3） 湿定位在处理腔室（4）好（1）。 这样的处理腔室（4）根据本领域的用于与仅一个非常具体的尺寸一种类型的材料（1）的状态是合适的。 相对于不同尺寸的物品（1）是由本发明实现的灵活性的实践所需的。 为此，所述处理腔室（4）的至少两个部分的底部部分（5）和至少两个作为优选自动互换的不同上部（6）被执行。 两个部分的分离点（7）被带正电和自动释放的完成。 Gutspezifisch配备顶部（6）被装配到生产的各个产品（1）的所述固定的（下部5），由此整个处理腔室（4）用于生产适当类型的孔（1）是最佳的。

公开(公告)号：WO2010022825A3

公开(公告)日：2010-05-14

申请号：PCT/EP2009005301

申请日：2009-07-21

Applicant: RENA GMBH ,  REUSTLE PETER ,  GUTEKUNST MATHIAS

Inventor： REUSTLE PETER ,  GUTEKUNST MATHIAS

IPC: C25D17/12 ,  C25D17/00 ,  C25D17/02 ,  H01L31/18 ,  H05K3/24

CPC classification number: C25D17/007 ,  C25D5/08 ,  C25D17/001 ,  C25D17/002 ,  C25D17/008 ,  C25D17/02 ,  C25D17/12 ,  C25D21/10

Abstract: The invention relates to the electroplating of substrates for use as e.g. wafers, solar cells or hybrids in process chambers or cups having soluble or insoluble anodes and an electrolyte (8), which is conducted through the process chamber in a circuit. The invention also relates to the stripping of contacts that are metallised during the electroplating process. Two electrolytic operating conditions are produced in the process chamber, i.e. electroplating and stripping. The invention optimises these two operating conditions using one modular unit (2), substantially consisting of an anode carrier (3) and at least one liquid-permeable material (5) as the diffuser (5). For the electroplating process, a homogeneous stream of the electrolyte (8) is required in the process chamber in the vicinity of the product (1) to be electroplated. This is achieved by a corresponding adjustment of the static pressure below the diffuser (5) and as a result of the permeability characteristics of the latter with regard to the electrolyte. The volumetric flow of electrolyte (8) is increased during the stripping of the product supports which act as the electrical contact. The flow passes through the clearance zone (4) and then predominantly directly through the diffuser (5) that lies above the clearance zone (4). As a result, different flow speeds are present over the cross-section of the process chamber. This causes turbulence with wave formation on the surface of the electrolyte. Without the presence of a product, the electrolyte washes over the product supports, rapidly stripping the contacts completely with a high flow density.

Abstract translation: 本发明涉及基板如这样的单方面电镀。 B.晶片，太阳能电池或处理室杂种或杯与可溶性或不溶性阳极和电解质（8）在通过所述处理室中的电路传送。 本发明还涉及到触点，它们在电镀金属化的分离。 在处理室中，有两个操作电解条件，即电镀和脱离。 本发明通过（2）基本上由阳极支撑组成的结构单元的手段优化这两个运行状态（3）和至少一个液体可渗透的操作装置（5）和扩散器（5）。 对于在材料附近在处理室电镀待镀（1）电解质的均匀流（8）是必要的。 这是根据本发明由所述扩散器（5）正下方的静电压力的适当的设定和由渗透性达到电解质方面的特性。 当Gutauflagen，其同时用于电接触的脱离，电解质（8）的体积流量增大。 然后，这由扩散流动通过自由空间（4），并从那里直接主要（5），其延伸经过自由空间（4）。 这导致在该处理腔室中，如看到在横截面中，不同的流率。 那里它们引起湍流与在电解质表面上的波形成。 如果没有通过的关于Gutauflagen一个完整的冲洗，导致快速和完整的接点非常高电流密度的去金属化好是可能完成的。