公开(公告)号：WO02071445A2

公开(公告)日：2002-09-12

申请号：PCT/US0151387

申请日：2001-10-23

Applicant: STRASBAUGH

Inventor： HALLEY DAVID G

IPC: B24B9/06 ,  B24B37/04 ,  B24B41/06 ,  B24B49/02 ,  B24B49/12 ,  B24B53/007 ,  B24B57/02 ,  H01L

CPC classification number: B24B37/30 ,  B24B9/065 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B41/068 ,  B24B49/02 ,  B24B49/12 ,  B24B53/017 ,  B24B57/02

Abstract: Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a shaft having a shaft axis and being connected with a polishing head which is coupled to a polishing pad. The polishing pad has a smaller diameter than the object to be planarized. The shaft is rotatable to spin the polishing head and polishing pad around the shaft axis. A channel extends along the shaft axis through the shaft and the polishing head. A supply tube is configured to deliver a polishing chemical through the channel to the polishing pad. In some embodiments, the polishing pas is an annular pad having an opening for flowing the polishing chemical therethrough to a region between the polishing pad and the object. A sensor is provided for monitoring a level of the polishing chemical in the channel of the shaft. A pump is provided for pumping the polishing chemical through the supply tube to the channel of the shaft. The pump is controlled to vary a flow rate of the polishing chemical to the channel of the shaft in response to the monitored level of the polishing chemical in the channel.

Abstract translation: 本发明的具体实施方案提供了一种用于平面化物体的化学机械平面化装置，包括具有轴轴的轴并与连接到抛光垫的抛光头连接。 抛光垫具有比待平坦化的物体更小的直径。 轴可旋转以使抛光头和抛光垫绕轴轴旋转。 通道沿着轴线延伸穿过轴和抛光头。 供应管被配置成将抛光化学品通过通道输送到抛光垫。 在一些实施例中，抛光垫是具有用于使抛光化学品通过其流过抛光垫和物体之间的区域的开口的环形垫。 提供了一种传感器，用于监测轴的通道中的抛光化学品的水平。 提供泵，用于将抛光化学品通过供应管泵送到轴的通道。 控制泵响应于通道中抛光化学品的监测水平，来调节抛光化学品对轴的通道的流速。

公开(公告)号：WO02053320A3

公开(公告)日：2002-09-12

申请号：PCT/US0150769

申请日：2001-10-23

Applicant: STRASBAUGH

Inventor： HALLEY DAVID G

IPC: B24B9/06 ,  B24B37/013 ,  B24B37/04 ,  B24B37/30 ,  B24B49/02 ,  B24B49/12 ,  B24B53/007 ,  B24B53/017 ,  B24B57/02 ,  H01L21/687 ,  B24B5/00

CPC classification number: B24B37/30 ,  B24B9/065 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B49/02 ,  B24B49/12 ,  B24B53/017 ,  B24B57/02 ,  H01L21/68728

Abstract: The present invention provides an improved planarization apparatus for chemical mechanical planarization. In an exemplary embodiment, the invention provides an apparatus having a back support (118) operatively coupled to the edge support, the bac support having at least one surface for supporting a back side of the object during planarization. The surface for supporting the back side provides a substantially friction free interface between the surface and the back side of the object to allow the object to move across the surface of the back support. In some embodiments, an edge support (120) is movably coupled to an edge of an object for supporting and positioning the object during planarization.

Abstract translation: 本发明提供一种用于化学机械平面化的改进的平面化装置。 在一个示例性实施例中，本发明提供一种具有可操作地耦合到边缘支撑件的后支撑件（118）的装置，所述支架具有至少一个用于在平坦化期间支撑物体的背面的表面。 用于支撑背面的表面在物体的表面和背面之间提供基本上无摩擦的界面，以允许物体移动穿过背部支撑件的表面。 在一些实施例中，边缘支撑件（120）可移动地联接到物体的边缘，用于在平坦化期间支撑和定位物体。

公开(公告)号：WO02053320A9

公开(公告)日：2004-03-04

申请号：PCT/US0150769

申请日：2001-10-23

Applicant: STRASBAUGH

Inventor： HALLEY DAVID G

IPC: B24B9/06 ,  B24B37/013 ,  B24B37/04 ,  B24B37/30 ,  B24B49/02 ,  B24B49/12 ,  B24B53/007 ,  B24B53/017 ,  B24B57/02 ,  H01L21/687 ,  B24B5/00

CPC classification number: B24B37/30 ,  B24B9/065 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B49/02 ,  B24B49/12 ,  B24B53/017 ,  B24B57/02 ,  H01L21/68728

Abstract: The present invention provides an improved planarization apparatus for chemical mechanical planarization. In an exemplary embodiment, the invention provides an apparatus having a back support (118) operatively coupled to the edge support, the bac support having at least one surface for supporting a back side of the object during planarization. The surface for supporting the back side provides a substantially friction free interface between the surface and the back side of the object to allow the object to move across the surface of the back support. In some embodiments, an edge support (120) is movably coupled to an edge of an object for supporting and positioning the object during planarization.

Abstract translation: 本发明提供一种用于化学机械平面化的改进的平面化装置。 在一个示例性实施例中，本发明提供一种具有可操作地耦合到边缘支撑件的后支撑件（118）的装置，所述支架具有至少一个用于在平坦化期间支撑物体的背面的表面。 用于支撑背面的表面在物体的表面和背面之间提供基本上无摩擦的界面，以允许物体移动穿过背部支撑件的表面。 在一些实施例中，边缘支撑件（120）可移动地联接到物体的边缘，以在平坦化期间支撑和定位物体。

公开(公告)号：WO02060643A9

公开(公告)日：2003-09-12

申请号：PCT/US0151079

申请日：2001-10-23

Applicant: STRASBAUGH

Inventor： HALLEY DAVID G

IPC: B24B9/06 ,  B24B37/04 ,  B24B41/04 ,  B24B47/10 ,  B24B49/02 ,  B24B49/12 ,  B24B53/007 ,  B24B57/02 ,  H01L21/304 ,  H01L21/687 ,  B24B7/22 ,  B24B1/00

CPC classification number: B24B9/065 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/30 ,  B24B41/04 ,  B24B47/10 ,  B24B49/02 ,  B24B49/12 ,  B24B53/017 ,  B24B57/02 ,  H01L21/68728

Abstract: The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object (115) comprises a pad (117) having a polishing surface to be placed on the target surface of the object (115) to be polished. A pad drive member (116) is connected to the pad to move the pad relative to the object to chenge a position of the polishing surface of the pad on the target surface of the object. A drive support (251) is movably coupled with the pad drive member (116) to support the pad drive member (116) for rotation relative to the drive support around a pivot point (252) which is disposed substantially on the target surface of the object (115) during polishing.

Abstract translation: 本发明提供了用于化学机械平面化和其它类型抛光的改进的平面化或抛光装置，例如金属抛光和光学抛光。 在一个示例性实施例中，用于抛光物体（115）的装置包括具有待抛光的物体（115）的目标表面上的抛光表面的焊盘（117）。 衬垫驱动构件（116）连接到衬垫以使衬垫相对于物体移动以使衬垫的抛光表面的位置在目标表面上沉降。 驱动支撑件（251）可与垫驱动构件（116）可移动地联接，以支撑垫驱动构件（116），用于相对于围绕枢转点（252）的驱动支撑件旋转，该枢转点基本上设置在 物体（115）。

公开(公告)号：WO02060643A3

公开(公告)日：2002-10-03

申请号：PCT/US0151079

申请日：2001-10-23

Applicant: STRASBAUGH

Inventor： HALLEY DAVID G

IPC: B24B9/06 ,  B24B37/04 ,  B24B41/04 ,  B24B47/10 ,  B24B49/02 ,  B24B49/12 ,  B24B53/007 ,  B24B57/02 ,  H01L21/304 ,  H01L21/687 ,  B24B7/22 ,  B24B1/00

CPC classification number: B24B9/065 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/30 ,  B24B41/04 ,  B24B47/10 ,  B24B49/02 ,  B24B49/12 ,  B24B53/017 ,  B24B57/02 ,  H01L21/68728

Abstract: The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object (115) comprises a pad (117) having a polishing surface to be placed on the target surface of the object (115) to be polished. A pad drive member (116) is connected to the pad to move the pad relative to the object to chenge a position of the polishing surface of the pad on the target surface of the object. A drive support (251) is movably coupled with the pad drive member (116) to support the pad drive member (116) for rotation relative to the drive support around a pivot point (252) which is disposed substantially on the target surface of the object (115) during polishing.

Abstract translation: 本发明提供了用于化学机械平坦化和其他类型的抛光如金属抛光和光学抛光的改进的平坦化或抛光装置。 在示例性实施例中，用于抛光物体（115）的设备包括具有抛光表面的抛光垫（117），抛光表面将被放置在待抛光的物体（115）的目标表面上。 衬垫驱动构件（116）连接到衬垫以相对于物体移动衬垫，以平整衬垫的抛光表面在物体的目标表面上的位置。 驱动器支撑件（251）与垫驱动构件（116）可移动地联接以支撑垫驱动构件（116）以相对于驱动器支撑件围绕枢轴点（252）旋转，该枢轴点基本上设置在 物体（115）在抛光期间。