公开(公告)号：WO2005050895A2

公开(公告)日：2005-06-02

申请号：PCT/US2004/038371

申请日：2004-11-16

Applicant: STRASBAUGH ,  STRASBAUGH, Alan ,  KASSIR, Salman, M.

Inventor： STRASBAUGH, Alan ,  KASSIR, Salman, M.

IPC: H04L

CPC classification number: B24B41/061 ,  B24B7/228 ,  B24B37/30 ,  H01L21/67132

Abstract: A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed from the tape and then cleaned on the front side and backside. A tool for applying tape to a chuck, as described herein, facilitates this method.

Abstract translation: 一种背磨晶片的方法，其中将背衬研磨带或衬垫施加到吸盘而不是晶片。 随着每个晶片被顺序地放置在磁带或垫上，背景，在背面上冲洗，从带上移除，然后在正面和背面清洁，将背衬研磨带或垫留在吸盘上。 如本文所述，用于将胶带施加到卡盘上的工具便于该方法。

公开(公告)号：WO2005050895A3

公开(公告)日：2005-09-22

申请号：PCT/US2004038371

申请日：2004-11-16

Applicant: STRASBAUGH ,  STRASBAUGH ALAN ,  KASSIR SALMAN M

Inventor： STRASBAUGH ALAN ,  KASSIR SALMAN M

IPC: B24B1/00 ,  B24B7/22 ,  B24B41/06 ,  H01L21/00 ,  H04L20060101

CPC classification number: B24B41/061 ,  B24B7/228 ,  B24B37/30 ,  H01L21/67132

Abstract: A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed from the tape and then cleaned on the front side and backside. A tool for applying tape to a chuck, as described herein, facilitates this method.

Abstract translation: 背面研磨晶片的方法，其中将后研磨带或垫施加到卡盘而不施加于晶片。 当将每个晶片顺序地放置在带或垫上的背景中，背面研磨胶带或垫留在卡盘上，背景在背面漂洗，从带上移除，然后在前侧和背面清洁。 如本文所述的用于将胶带施加到卡盘的工具有助于该方法。

公开(公告)号：WO2013059705A1

公开(公告)日：2013-04-25

申请号：PCT/US2012/061169

申请日：2012-10-19

Applicant: STRASBAUGH

Inventor： WALSH, Thomas A. ,  VOGTMANN, Michael R.

IPC: H01L21/304

CPC classification number: B24B37/013

Abstract: Systems and methods are provided for use in processing and/or grinding wafers or other work products. Some embodiments provide a grinding apparatus that comprise a base casting; a rotary indexer configured to rotate within the base casting; a work spindle secured with the rotary indexer; a work chuck coupled with the first work spindle, wherein the first work spindle is configured to rotate the first work chuck; a bridge casting secured relative to the base casting, wherein the bridge casting bridges across at least a portion of the rotary indexer and is supported structurally forming a closed stiffness loop; a grind spindle secured with the bridge casting; and a grind wheel cooperated with the grind spindle, wherein the bridge casting secures the grind spindle.

Abstract translation: 提供了用于处理和/或研磨晶片或其它工作产品的系统和方法。 一些实施例提供了一种包括底铸件的研磨装置; 旋转分度器，其构造成在所述底铸件内旋转; 用旋转分度器固定的工作轴; 与所述第一工作主轴联接的工件卡盘，其中所述第一工作主轴构造成使所述第一工件卡盘旋转; 相对于基础铸件固定的桥梁铸件，其中所述桥梁铸件跨过所述旋转分度器的至少一部分并且在结构上支撑地形成闭合刚度环; 用桥铸件固定的研磨主轴; 以及与研磨主轴配合的研磨轮，其中桥铸件固定研磨主轴。

公开(公告)号：WO2009088807A1

公开(公告)日：2009-07-16

申请号：PCT/US2008/088360

申请日：2008-12-26

Applicant: STRASBAUGH ,  SPIEGEL, Larry, A.

Inventor： SPIEGEL, Larry, A.

IPC: H01L21/304

CPC classification number: B24B37/30

Abstract: A flexible membrane assembly for a wafer carrier in a CMP system. The flexible membrane assemble has a flat, flexible membrane joined to a rigid cylindrical sidewall.

Abstract translation: 用于CMP系统中的晶片载体的柔性膜组件。 柔性膜组装具有连接到刚性圆柱形侧壁的平坦的柔性膜。

公开(公告)号：WO2005067663A2

公开(公告)日：2005-07-28

申请号：PCT/US2005000614

申请日：2005-01-07

Applicant: STRASBAUGH ,  DALRYMPLE ALICE M ,  HORRELL ROBERT J

Inventor： DALRYMPLE ALICE M ,  HORRELL ROBERT J

IPC: B24B37/04 ,  B24B49/12 ,  B44C1/22

CPC classification number: B24B37/013 ,  B24B49/12

Abstract: A method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an optical sensor disposed within the polishing pad. The intensity of the reflected light is measured by a light detector also disposed in the polishing pad. The intensity of the reflected light varies sinusoidally with the change in layer thickness as the layer is removed. By measuring the absolute thickness of the layer at two or more points along the sinusoidal curve, the sinusoidal curve is calibrated so that a portion of the wavelength of the curve corresponds to a change in thickness of the layer.

Abstract translation: 一种在抛光该层时测量设置在晶片上的材料层的厚度变化的方法。 光从设置在抛光垫内的光学传感器导向晶片的表面。 反射光的强度由也设置在抛光垫中的光检测器测量。 随着层的去除，反射光的强度随着层厚度的变化而正弦变化。 通过沿着正弦曲线测量两个或更多个点处的层的绝对厚度，校正正弦曲线，使得曲线的波长的一部分对应于层的厚度变化。

公开(公告)号：WO2002071445A3

公开(公告)日：2002-09-12

申请号：PCT/US2001/051387

申请日：2001-10-23

Applicant: STRASBAUGH

Inventor： HALLEY, David, G.

IPC: B24B57/02

Abstract: Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object (115) comprising a shaft (260) having a shaft axis (270) and being connected with a polishing head (250) which is coupled to a polishing pad (117). The polishing pad (117) has a smaller diameter than the object (115) to be planarized. The shaft (260) is rotatable to spin the polishing head (250) and polishing pad (117) around the shaft axis (270). A channel (766) extends along the shaft axis through the shaft (260) and the polishing head (250). A supply tube (730) is configured to deliver a polishing chemical through the channel to the polishing pad. In some embodiments, the polishing pad is an annular pad (770) having an opening for flowing the polishing chemical therethrough to a region between the polishing pad and the object (9115). A sensor (774) is provided for monitoring a level of the polishing chemical in the channel of the shaft (766). A pump (760) is provided for pumping the polishing chemical through the supply tube to the channel of the shaft. The pump (760) is controlled to vary a flow rate of the polishing chemical to the channel of the shaft in response to the monitored level of the polishing chemical in the channel.

公开(公告)号：WO02071445A2

公开(公告)日：2002-09-12

申请号：PCT/US0151387

申请日：2001-10-23

Applicant: STRASBAUGH

Inventor： HALLEY DAVID G

IPC: B24B9/06 ,  B24B37/04 ,  B24B41/06 ,  B24B49/02 ,  B24B49/12 ,  B24B53/007 ,  B24B57/02 ,  H01L

CPC classification number: B24B37/30 ,  B24B9/065 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B41/068 ,  B24B49/02 ,  B24B49/12 ,  B24B53/017 ,  B24B57/02

Abstract: Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a shaft having a shaft axis and being connected with a polishing head which is coupled to a polishing pad. The polishing pad has a smaller diameter than the object to be planarized. The shaft is rotatable to spin the polishing head and polishing pad around the shaft axis. A channel extends along the shaft axis through the shaft and the polishing head. A supply tube is configured to deliver a polishing chemical through the channel to the polishing pad. In some embodiments, the polishing pas is an annular pad having an opening for flowing the polishing chemical therethrough to a region between the polishing pad and the object. A sensor is provided for monitoring a level of the polishing chemical in the channel of the shaft. A pump is provided for pumping the polishing chemical through the supply tube to the channel of the shaft. The pump is controlled to vary a flow rate of the polishing chemical to the channel of the shaft in response to the monitored level of the polishing chemical in the channel.

Abstract translation: 本发明的具体实施方案提供了一种用于平面化物体的化学机械平面化装置，包括具有轴轴的轴并与连接到抛光垫的抛光头连接。 抛光垫具有比待平坦化的物体更小的直径。 轴可旋转以使抛光头和抛光垫绕轴轴旋转。 通道沿着轴线延伸穿过轴和抛光头。 供应管被配置成将抛光化学品通过通道输送到抛光垫。 在一些实施例中，抛光垫是具有用于使抛光化学品通过其流过抛光垫和物体之间的区域的开口的环形垫。 提供了一种传感器，用于监测轴的通道中的抛光化学品的水平。 提供泵，用于将抛光化学品通过供应管泵送到轴的通道。 控制泵响应于通道中抛光化学品的监测水平，来调节抛光化学品对轴的通道的流速。

公开(公告)号：WO2008064090A2

公开(公告)日：2008-05-29

申请号：PCT/US2007084882

申请日：2007-11-15

Applicant: STRASBAUGH ,  SARALIEV DANIEL P

Inventor： SARALIEV DANIEL P

IPC: G06F19/00

CPC classification number: B25J9/1692 ,  G05B2219/37277 ,  G05B2219/45031 ,  H01L21/68 ,  H01L21/68707

Abstract: A robot calibration system and method for robots in semiconductor wafer processing systems is disclosed. The calibration system comprises a calibration array, a dummy wafer and a control system programmed with a calibration routine. The calibration array has a plurality of inductive proximity sensors to determine parallelism of the robot relative to a station and a center-locating sensor to determine the center of the station.

Abstract translation: 公开了一种用于半导体晶片处理系统中的机器人的机器人校准系统和方法。 校准系统包括校准阵列，虚拟晶片和用校准程序编程的控制系统。 校准阵列具有多个感应式接近传感器，用于确定机器人相对于站和中心定位传感器的平行度以确定站的中心。

公开(公告)号：WO2007123663A2

公开(公告)日：2007-11-01

申请号：PCT/US2007/007887

申请日：2007-03-29

Applicant: STRASBAUGH ,  BENASSI, Robert, D.

Inventor： BENASSI, Robert, D.

IPC: H01L21/306 ,  C23F1/00

CPC classification number: B24B37/013 ,  B24B37/0056 ,  B24B37/205 ,  B24B49/12 ,  B24B49/14

Abstract: A system and method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an indwelling optical sensor, disposed within a polishing pad and data signals are wireless transmitted to a control system.

Abstract translation: 一种在抛光该层时测量设置在晶片上的材料层的厚度变化的系统和方法。 光从设置在抛光垫内的留置光学传感器引导到晶片的表面，并且数据信号被无线传输到控制系统。

公开(公告)号：WO2004109758A3

公开(公告)日：2005-11-03

申请号：PCT/US2004016515

申请日：2004-05-25

Applicant: STRASBAUGH

Inventor： STRASBAUGH ALAN

IPC: B24B37/30 ,  B24B49/16 ,  B24B7/00

CPC classification number: B24B37/30 ,  B24B49/16

Abstract: A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements (42, 43, 44, 45, 46) are disposed between the wafer carrier pressure plate (35) and a process wafer, and selectively distended to provide excess backpressure to select small areas of a wafer known to exhibit resistance to removal vis-à-vis the surrounding wafer surface. Distensible elements may be in the form of expandable pneumatic chambers or electro-mechanical elements such as solenoids, shape memory elements, electrostatic plates.

Abstract translation: 具有适于提供高分辨率背压控制的背压施加器系统的晶片载体。 多个毫米级可扩张元件（42,43,44,45,46）设置在晶片载体压板（35）和处理晶片之间，并且选择性地膨胀以提供过量的背压以选择已知的晶片的小区域 相对于周围的晶片表面显示抵抗去除。 可扩张元件可以是可膨胀气动室或诸如螺线管，形状记忆元件，静电板的机电元件的形式。