公开(公告)号：WO0244820A3

公开(公告)日：2003-01-30

申请号：PCT/US0144616

申请日：2001-11-28

Applicant: TIMBRE TECH INC ,  DODDI SRINIVAS

Inventor： DODDI SRINIVAS

IPC: G01N33/00 ,  G05B20060101 ,  G05B15/02 ,  G05B19/00 ,  G06F9/45 ,  G06F17/00 ,  G06F17/18 ,  G06F17/50

CPC classification number: G06Q50/04 ,  Y02P90/30

Abstract: An improved profileometry data collection and analysis system employing software that performs clustering analysis on library data stored in memory that represent semiconductor chip wafer profiles, for use in matching real-time data signals from data collected by profileometry instruments. To better perform a match in real-time between the incoming real-time data signals and the profile library data into clusters, and to extract representative cluster data points of the clusters. The representative of the clusters are stored in primary memory (e.g. RAM), while the data forming the clusters are stored in secondary memory (e.g., a hard drive). A real-time data signal is then first compared to the representative cluster data points, and when a match is made with a particular representative cluster data point, the cluster associated with the representative cluster data point is loaded from secondary memory into primary memory. Next a further search is made wiht the incoming real-time data signal to find the closest match to the data in the cluster.

Abstract translation: 改进的轮廓测量数据收集和分析系统采用对存储在存储器中的库数据执行聚类分析的代表半导体芯片晶片轮廓的软件，用于从通过轮廓测量仪器收集的数据匹配实时数据信号。 更好地在传入的实时数据信号和简档库数据之间实时进行匹配，使其成簇，并提取集群的代表性集群数据点。 簇的代表存储在主存储器（例如RAM）中，而形成簇的数据被存储在辅助存储器（例如，硬盘驱动器）中。 然后首先将实时数据信号与代表性的集群数据点进行比较，并且当与特定的代表性集群数据点进行匹配时，与代表性集群数据点相关联的集群从辅助存储器加载到主存储器中。 接下来，进一步搜索传入的实时数据信号以找到与集群中的数据最接近的匹配。

公开(公告)号：WO2004013568A8

公开(公告)日：2004-10-21

申请号：PCT/US0324916

申请日：2003-08-06

Applicant: TIMBRE TECH INC ,  DREGE EMMANUEL ,  BAO JUNWEI ,  DODDI SRINIVAS ,  VUONG VI

Inventor： DREGE EMMANUEL ,  BAO JUNWEI ,  DODDI SRINIVAS ,  VUONG VI

IPC: G01N21/956 ,  G06F19/00

CPC classification number: G03F7/70516 ,  G01N21/956 ,  G03F7/70625

Abstract: To generate sets of coefficients for use in optical metrology of semiconductor structures, at least three optical metrology signals for a set of parameters are obtained. The optical metrology signals are indicative of light diffracted from a semiconductor structure, and a value of at least one parameter of the set of parameters is varied to produce each signal. Functional relationships between the at least three optical metrology signals are obtained, the functional relationships including at least three coefficient values. At least three sets of coefficients from the at least three coefficient values of the functional relationships are determined.

Abstract translation: 为了产生用于半导体结构的光学测量的系数集合，获得用于一组参数的至少三个光学测量信号。 光学测量信号指示从半导体结构衍射的光，并且改变该组参数中的至少一个参数的值以产生每个信号。 获得至少三个光学测量信号之间的功能关系，所述功能关系包括至少三个系数值。 确定来自功能关系的至少三个系数值的至少三组系数。

公开(公告)号：WO2007112022A3

公开(公告)日：2008-10-16

申请号：PCT/US2007007292

申请日：2007-03-20

Applicant: TIMBRE TECH INC ,  JIN WEN ,  DODDI SRINIVAS ,  LI SHIFANG

Inventor： JIN WEN ,  DODDI SRINIVAS ,  LI SHIFANG

IPC: G01B11/14

CPC classification number: G01B11/24

Abstract: The number of diffraction orders to use in generating simulated diffraction signals for a two-dimensional structure in optical metrology is selected by generating a first simulated diffraction signal using a first number of diffraction orders and a hypothetical profile of the two-dimensional structure. A second simulated diffraction signal is generated using a second number of diffraction orders using the same hypothetical profile used to generate the first simulated diffraction signal, where the first and second numbers of diffraction orders are different. The first and second simulated diffraction signals are compared. Based on the comparison of the first and second simulated diffraction signals, a determination is made as to whether to select the first or second number of diffraction orders.

Abstract translation: 通过使用第一数量的衍射级和二维结构的假设曲线生成第一模拟衍射信号来选择用于在光学测量中产生用于二维结构的模拟衍射信号的衍射级数。 使用第二数量的衍射级使用用于产生第一和第二数量的衍射级不同的第一模拟衍射信号的相同假想轮廓来产生第二模拟衍射信号。 比较第一和第二模拟衍射信号。 基于第一和第二模拟衍射信号的比较，确定是否选择第一或第二数量的衍射级。

公开(公告)号：WO03068889A8

公开(公告)日：2003-11-13

申请号：PCT/US0303955

申请日：2003-02-10

Applicant: TIMBRE TECH INC ,  BAO JUNWEI ,  DODDI SRINIVAS ,  JAKATDAR NICKHIL ,  VOUNG VI

Inventor： BAO JUNWEI ,  DODDI SRINIVAS ,  JAKATDAR NICKHIL ,  VOUNG VI

IPC: G01B11/24 ,  G01N21/47 ,  G01N21/956 ,  G06F19/00 ,  G01B11/08

CPC classification number: G01B11/24 ,  G01N21/4788 ,  G03F7/70625

Abstract: The present invention includes a method and system (53) for determining the profile of a structure (59) in an integrated circuit from a measured signal, the signal measured off the structure with a metrology device (40), selecting a best match of the measured signal in a profile data space, the profile data space having data points with a specified extent of non-linearity, and performing a refinement procedure to determine refined profile parameters. One embodiment includes a refinement procedure comprising finding a polyhedron in a function domain of cost functions of the profile library signals and profile parameters and minimizing the total cost function using the weighted average method. Other embodiments include profile parameter refinement procedures using sensitivity analysis, a clustering approach, regression-based methods, localized fine-resolution refinement library method, iterative library refinement method, and other cost optimization or refinement algorithms, procedures, and methods. Refinement of profile parameters may be invoked automatically or invoked based on predetermined criteria such as exceeding an error metric between the measured signal versus the best match profile library.

Abstract translation: 本发明包括一种用于根据测量信号确定集成电路中的结构（59）的轮廓的方法和系统（53），该测量信号用度量装置（40）测量结构的信号，选择最佳匹配 在简档数据空间中测量的信号，具有指定非线性范围的数据点的简档数据空间，以及执行细化过程以确定精确的简档参数。 一个实施例包括细化程序，包括在简档库信号和简档参数的成本函数的功能域中找到多面体，并且使用加权平均方法最小化总成本函数。 其他实施例包括使用灵敏度分析的简档参数细化程序，聚类方法，基于回归的方法，局部精细分辨率细化库方法，迭代库细化方法以及其他成本优化或细化算法，程序和方法。 简档参数的细化可以基于预定标准自动调用或调用，例如超过测量信号与最佳匹配简档库之间的误差度量。

公开(公告)号：WO2005003911A2

公开(公告)日：2005-01-13

申请号：PCT/US2004020682

申请日：2004-06-25

Applicant: TIMBRE TECH INC ,  DODDI SRINIVAS ,  DREGE EMMANUEL ,  JAKATDAR NICKHIL ,  BAO JUNWEI

Inventor： DODDI SRINIVAS ,  DREGE EMMANUEL ,  JAKATDAR NICKHIL ,  BAO JUNWEI

IPC: G01B11/24 ,  G01Q30/02 ,  G01Q60/00 ,  G01Q80/00 ,  G01Q90/00 ,  G06F20060101 ,  G06F15/18 ,  G06F19/00 ,  G06N3/08 ,  G06F

CPC classification number: G01B11/24 ,  G06N99/005

Abstract: A structure formed on a semiconductor wafer is examined by obtaining a first diffraction signal measured using a metrology device. A second diffraction signal is generated using a machine learning system, where the machine learning system receives as an input one or more parameters that characterize a profile of the structure to generate the second diffraction signal. The first and second diffraction signals are compared. When the first and second diffraction signals match within a matching criterion, a feature of the structure is determined based on the one or more parameters or the profile used by the machine learning system to generate the second diffraction signal.

Abstract translation: 通过获得使用测量装置测量的第一衍射信号来检查在半导体晶片上形成的结构。 使用机器学习系统产生第二衍射信号，其中机器学习系统接收表征该结构的轮廓以生成第二衍射信号的一个或多个参数作为输入。 比较第一和第二衍射信号。 当第一和第二衍射信号在匹配标准内匹配时，基于机器学习系统用于生成第二衍射信号的一个或多个参数或轮廓来确定结构的特征。

公开(公告)号：WO2004013568A3

公开(公告)日：2004-06-17

申请号：PCT/US0324916

申请日：2003-08-06

Applicant: TIMBRE TECH INC ,  DREGE EMMANUEL ,  BAO JUNWEI ,  DODDI SRINIVAS ,  VUONG VI

Inventor： DREGE EMMANUEL ,  BAO JUNWEI ,  DODDI SRINIVAS ,  VUONG VI

IPC: G01N21/956 ,  G06F19/00

CPC classification number: G03F7/70516 ,  G01N21/956 ,  G03F7/70625

Abstract: To generate sets of coefficients for use in optical metrology of semiconductor structures, at least three optical metrology signals for a set of parameters are obtained. The optical metrology signals are indicative of light diffracted from a semiconductor structure, and a value of at least one parameter of the set of parameters is varied to produce each signal. Functional relationships between the at least three optical metrology signals are obtained, the functional relationships including at least three coefficient values. At least three sets of coefficients from the at least three coefficient values of the functional relationships are determined.

Abstract translation: 为了生成用于半导体结构的光学计量的系数组，获得用于一组参数的至少三个光学计量信号。 光学计量信号指示从半导体结构衍射的光，并且该组参数中的至少一个参数的值被改变以产生每个信号。 获得所述至少三个光学度量信号之间的函数关系，所述函数关系包括至少三个系数值。 确定来自功能关系的至少三个系数值的至少三组系数。

公开(公告)号：WO2004013723A2

公开(公告)日：2004-02-12

申请号：PCT/US0323281

申请日：2003-07-25

Applicant: TIMBRE TECH INC ,  VOUNG VI ,  DREGE EMMANUEL ,  BAO JUNWEI ,  DODDI SRINIVAS ,  NIU XINHUI ,  JAKATDAR NICKHIL

Inventor： VOUNG VI ,  DREGE EMMANUEL ,  BAO JUNWEI ,  DODDI SRINIVAS ,  NIU XINHUI ,  JAKATDAR NICKHIL

IPC: G01B11/06 ,  G01B11/00 ,  G01B11/02 ,  G01B11/04 ,  G01B11/08 ,  G01B11/14 ,  G01B11/22 ,  G01B11/28 ,  G01N21/00 ,  G01N21/41 ,  G06F20060101 ,  G06F15/00 ,  G06F19/00 ,  H01L21/66 ,  G06F

CPC classification number: G03F7/70616 ,  G03F7/705 ,  G03F7/70625

Abstract: A profile model for use in optical metrology of structures in a wafer is selected, the profile model having a set of geometric parameters associated with the dimensions of the structure. A set of optimization parameters is selected for the profile model using one or more input diffraction signals and one or more parameter selection criteria. The selected profile model and the set of optimization parameters are tested against one or more termination criteria. The process of selecting a profile model, selecting a set of optimization parameters, and testing the selected profile model and set of optimization parameters is performed until the one or more termination criteria are met.

Abstract translation: 选择用于晶片中结构的光学测量的轮廓模型，轮廓模型具有与结构的尺寸相关联的一组几何参数。 使用一个或多个输入衍射信号和一个或多个参数选择标准为轮廓模型选择一组优化参数。 根据一个或多个终止标准测试所选择的简档模型和优化参数集合。 执行选择简档模型，选择一组优化参数以及测试所选简档模型和优化参数集合的过程，直到满足一个或多个终止标准。

公开(公告)号：WO0248746A2

公开(公告)日：2002-06-20

申请号：PCT/US0148482

申请日：2001-12-13

Applicant: TIMBRE TECH INC

Inventor： DODDI SRINIVAS ,  NICKHIL JAKATDAR ,  XINHUI NIU

IPC: G01M11/00 ,  G02B5/18 ,  G06F17/30 ,  G01W

CPC classification number: G02B5/18 ,  G03F7/70625 ,  Y10S706/934

Abstract: Invention teaches a method and system for characterizing grating profile data. One embodiment is a method for characterizing grating profile data by clustering the grating profile data space and associating profile space data to each cluster. Another aspect of the present invention is a system for classifying grating profile comprising a cluster generator for generating clusters of grating profiles, for associating profile shape data to each cluster, and for linking the associated profile shape data to the grating profiles belonging to each cluster. The present invention includes a method and a system for evaluating input grating profile by comparing the profile data from the closest matching grating profile by comparing data from the closest matching grating profile library instance with a set of acceptable ranges of profile data for the application; flagging the input grating profile if the profile data is outside the set of acceptable ranges; and presenting the profile data and flags associated with the input grating profile. The system is scalable and may operate in a distributed manner utilizing networks.

Abstract translation: 发明教导了用于表征光栅轮廓数据的方法和系统。 一个实施例是通过聚集光栅轮廓数据空间并将轮廓空间数据与每个簇相关联来表征光栅轮廓数据的方法。 本发明的另一方面是用于对光栅轮廓进行分类的系统，该系统包括用于产生光栅轮廓簇的簇发生器，用于将轮廓形状数据与每个簇相关联，以及将相关轮廓形状数据链接到属于每个簇的光栅轮廓。 本发明包括一种方法和系统，用于通过比较来自最接近的匹配光栅轮廓的轮廓数据来比较来自最接近的匹配光栅轮廓库实例的数据与应用的轮廓数据的可接受范围的集合来评估输入光栅轮廓; 如果轮廓数据在可接受的范围之外，则标记输入光栅轮廓; 并呈现与输入光栅轮廓相关联的轮廓数据和标记。 该系统是可扩展的，并且可以利用网络以分布式方式运行。