FILM DEPOSITION DEVICE OF METAL FILM AND FILM DEPOSITION METHOD
    2.
    发明申请
    FILM DEPOSITION DEVICE OF METAL FILM AND FILM DEPOSITION METHOD 审中-公开
    金属薄膜的沉积装置和薄膜沉积方法

    公开(公告)号:WO2015019152A2

    公开(公告)日:2015-02-12

    申请号:PCT/IB2014/001454

    申请日:2014-08-04

    Abstract: A film deposition device (1A) of a metal film includes: a solid electrolyte membrane (13) that allows metal ions to be contained; a positive electrode (11) made of a porous body; a power supply part (14) that applies a voltage between the positive electrode and a base material; and a contact pressurization part (20) that comes into contact with the positive electrode (11) and uniformly pressurizes a film deposition region of a surface of the base material by the solid electrolyte membrane (13) via the positive electrode (11). The positive electrode (11) made of the porous body is capable of transmitting a solution containing the metal ions such that the metal ions are supplied to the solid electrolyte membrane. The power supply part (14) applies a voltage between the positive electrode and the base material so that the metal film made of the metal is deposited.

    Abstract translation: 金属膜的膜沉积装置(1A)包括:固体电解质膜(13),其允许包含金属离子; 由多孔体构成的正极(11) 在正极与基材之间施加电压的电源部(14) 以及与正极(11)接触并通过正极(11)利用固体电解质膜(13)对基材表面的成膜区域均匀地加压的接触加压部(20)。 由多孔体制成的正极(11)能够传递含有金属离子的溶液,使得金属离子被供应到固体电解质膜。 电源部分(14)在正电极和基材之间施加电压,使得由金属制成的金属膜被沉积。

    METHOD OF MANUFACTURING RARE-EARTH MAGNETS
    3.
    发明申请
    METHOD OF MANUFACTURING RARE-EARTH MAGNETS 审中-公开
    制造稀土磁铁的方法

    公开(公告)号:WO2013072728A1

    公开(公告)日:2013-05-23

    申请号:PCT/IB2012/002248

    申请日:2012-11-07

    Abstract: A method of manufacturing rare-earth magnets includes, a first step of producing a compact C by subjecting a sintered body S, which is formed of a RE-Fe-B main phase MP having a nanocrystalline structure (where RE is at least one of neodymium and praseodymium) and a grain boundary phase BP of an RE-X alloy (where X is a metal element) located around the main phase, to hot plastic processing that imparts anisotropy; and a second step of producing a rare-earth magnet RM by melting a RE-Y-Z alloy which increases the coercive force of the compact C (where Y is a transition metal element, and Z is a heavy rare-earth element), together with the grain boundary phase BP, and liquid-phase infiltrating the RE-Y-Z alloy melt from a surface of the compact C.

    Abstract translation: 制造稀土类磁铁的方法包括:通过对由具有纳米结晶结构的RE-Fe-B主相MP(其中RE为至少一种的RE-Fe-B主相MP)形成的烧结体S 钕和镨)和位于主相周围的RE-X合金(其中X是金属元素)的晶界相BP到赋予各向异性的热塑性加工; 以及通过熔化增加压块C(其中Y是过渡金属元素,Z是重稀土元素)的矫顽力的RE-YZ合金来制造稀土磁体RM的第二步骤,以及 晶界相BP和液相从压实体C的表面渗透RE-YZ合金熔体。

    PRETREATMENT METHOD FOR ELECTROLESS PLATING MATERIAL AND METHOD FOR PRODUCING MEMBER HAVING PLATED COATING
    4.
    发明申请
    PRETREATMENT METHOD FOR ELECTROLESS PLATING MATERIAL AND METHOD FOR PRODUCING MEMBER HAVING PLATED COATING 审中-公开
    电镀材料的预处理方法及其制造方法

    公开(公告)号:WO2004033754A2

    公开(公告)日:2004-04-22

    申请号:PCT/JP2003/013012

    申请日:2003-10-09

    CPC classification number: C23C18/1653 C23C18/2006 C23C18/204

    Abstract: A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the activation due to the treatment with ultraviolet rays are synergistically operated to enable the formation of a plated coating having excellent adhesive strength by a short treatment. In addition, even by a long treatment, the adhesive strength can be restrained from lowering. Consequently, a plated coating having excellent adhesion can be formed without roughening the surface of the resin material by a short pretreatment.

    Abstract translation: 使树脂材料与含有臭氧的第一溶液接触,同时照射紫外线。 由臭氧水处理引起的活化和紫外线处理引起的活化协同作用,能够通过短时间处理形成具有优异粘合强度的镀覆层。 此外,即使通过长时间处理,也可以抑制粘合强度的降低。 因此,可以通过短预处理而不使树脂材料的表面粗糙化来形成具有优异粘附性的镀覆涂层。

    METHOD OF FORMING METAL COATING
    5.
    发明申请
    METHOD OF FORMING METAL COATING 审中-公开
    形成金属涂层的方法

    公开(公告)号:WO2015121727A1

    公开(公告)日:2015-08-20

    申请号:PCT/IB2015/000119

    申请日:2015-02-09

    Abstract: A method of forming a metal coating includes: disposing a solid electrolyte membrane (13) between an anode (11) and a substrate (B) which forms a cathode; bringing a solution (L) containing metal ions into contact with an anode-side portion of the solid electrolyte membrane (13); and causing, in a state where the solid electrolyte membrane (13) is in contact with the substrate (B), a current to flow from the anode (11) to the cathode so as to form a metal coating formed of the metal on the surface of the substrate (B). The metal coating is formed by repeating a current-flowing period (T) in which a current flows from the anode (11) to the cathode and a non-current-flowing period (N) in which a Current does not flow between the anode (11) and the cathode.

    Abstract translation: 形成金属涂层的方法包括:在阳极(11)和形成阴极的基板(B)之间设置固体电解质膜(13) 使含有金属离子的溶液(L)与固体电解质膜(13)的阳极侧部分接触; 在所述固体电解质膜(13)与所述基板(B)接触的状态下,从所述阳极(11)向所述阴极流动的电流使得形成由所述金属 (B)的表面。 通过重复电流从阳极(11)流向阴极的电流流动周期(T)和电流不在阳极之间的非电流流动周期(N)形成金属涂层 (11)和阴极。

    FILM FORMATION SYSTEM AND FILM FORMATION METHOD FOR FORMING METAL FILM

    公开(公告)号:WO2015025211A3

    公开(公告)日:2015-02-26

    申请号:PCT/IB2014/001567

    申请日:2014-08-20

    Abstract: A solid electrolyte membrane (13) is arranged on a surface of an anode (11) between the anode (11) and a substrate (B) that serves as a cathode. The solid electrolyte membrane (13) is brought into contact with the substrate (B). At the same time, a metal film (F) is formed on the surface of the substrate (B) by causing metal to precipitate onto the surface of the substrate (B) from metal ions through application of voltage between the anode (11) and the substrate (B) in a first contact state where the solid electrolyte membrane (13) contacts the substrate (B). The metal ions are contained inside the solid electrolyte membrane (13).

    FILM DEPOSITION DEVICE OF METAL FILM AND METAL FILM DEPOSITION METHOD
    7.
    发明申请
    FILM DEPOSITION DEVICE OF METAL FILM AND METAL FILM DEPOSITION METHOD 审中-公开
    金属膜和金属膜沉积方法的膜沉积装置

    公开(公告)号:WO2015019154A2

    公开(公告)日:2015-02-12

    申请号:PCT/IB2014/001459

    申请日:2014-08-04

    Abstract: A film deposition device (1 A) of a metal film (F) includes a positive electrode (11), a solid electrolyte membrane (13), and a power supply part (14) that applies a voltage between the positive electrode (11) and a base material (B) to be a negative electrode. The solid electrolyte membrane (13) allows a water content to be 15% by mass or more and is capable of containing a metal ion. The power supply part (14) applies a voltage between the positive electrode and the base material in a state where the solid electrolyte membrane is disposed on a surface of the positive electrode such that metal made of metal ions contained inside the solid electrolyte membrane (13) is precipitated on a surface of the base material (B).

    Abstract translation: 金属膜(F)的膜沉积装置(1A)包括正极(11),固体电解质膜(13)和在正极(11)之间施加电压的电源部分(14) 和作为负极的基材(B)。 固体电解质膜(13)的含水量为15质量%以上,能够含有金属离子。 在固体电解质膜设置在正极的表面上的状态下,供电部(14)在正极和基材之间施加电压,使得由固体电解质膜(13)内的金属离子形成的金属 )沉淀在基材(B)的表面上。

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