Abstract:
An interposer sub-assembly (300) for holding or gripping a plurality of optical fibers in a multifiber ferrule connector including: a substrate (302) comprising a bottom surface (308), a top surface (310), and a front face (312); a pair of guide pin grooves (304a-b) on the bottom surface of said substrate, wherein the pair of guide pin grooves are capable of receiving guide pins from a ferrule connector; and a plurality of resilient fiber grooves (306) formed on the bottom surface, wherein the plurality of resilient fiber grooves are configured for receiving a plurality of optical conduits.
Abstract:
An optical assembly comprising: a substrate (101), having a first planar surface (101a), connected to an optical component (102) having a second planar surface (102a) parallel to the first surface and at least one first optical axis; a plurality of optical fiber stubs (104) having a certain diameter and disposed at least partially between the substrate and the optical component; at least one of the substrate or optical component having one or more grooves (103) on the first or second surfaces, with each groove configured to receive one of the plurality of fiber stubs so each of the fiber stubs protrudes a first distance from the first or second surface to space the first surface the first distance from the second surface; and at least one optical conduit having a second optical axis, the optical conduit being disposed on the first or second surface with the second optical axis optically aligned with the first optical axis.
Abstract:
One aspect of the invention provides a mode size converter having a first end and a second end. The mode size converter includes: a silicon waveguide having an inverse taper from the first end; and a silicon nitride waveguide having an inverse taper relative to the first end. The silicon nitride waveguide is adjacent and substantially parallel to the silicon waveguide. Another aspect of the invention provides an optical assembly including: a mode size converter as described herein; and a fiber optic optically coupled to the silicon nitride waveguide at the second end of the mode size converter.
Abstract:
Probe assembly (650) includes a modular device (670) configured to detect external signals or emit energy. The modular device (670) has a device array (676) that includes at least one of electrical contacts or optical fiber ends. The probe assembly (650) also includes a cable assembly (652) that is configured to communicatively couple the modular device (670) to a computing system (554) and transmit data signals therethrough. The cable assembly (652) includes an array connector (654) having a connector body (660) that includes a mating side (662) and channels (246) extending through the mating side (662) and the connector body (660). The cable assembly (652) includes a plurality of communication lines (656) that are disposed within corresponding channels (246) of the connector body (660). The communication lines (656) have respective end faces (415) that are positioned proximate to the mating side (662) to form a terminal array (114). The terminal array (114) is aligned with and coupled to the device array (676) of the modular device (670).
Abstract:
One aspect of the invention provides a method of fabricating a mode size converter. The method includes: exposing a photoresist-coated substrate (S506) to varying doses of light exposure to produce a profile in the photoresist of a beam mode size converter; and etching the photoresist-coated substrate (S510) to remove an equal thickness of the photoresist and substrate. The beam mode sized converter includes: a first surface having a first surface height and a first surface width; a second surface opposite the first surface, the second surface having a second surface height different than the first surface height and a second surface width different than the first surface width; and one or more boundary surfaces connecting the first surface and second surfaces.
Abstract:
One aspect of the invention provides an optoelectronics structure including: a substrate defining a trench on a first surface; and a VCSEL structure mounted vertically within the trench of the substrate such that the VCSEL structure emits a laser beam substantially parallel to the substrate. Another aspect of the invention provides an optoelectronics structure including: an fiber guiding substrate defining a trench on a first surface; a VCSEL structure mounted vertically within the trench of the fiber guiding substrate such that the VCSEL structure emits a laser beam substantially parallel to the substrate; and an optical fiber mounted on the fiber guiding substrate substantially coaxial with the laser beam emitted by the VCSEL structure.