公开(公告)号：WO2014055270A1

公开(公告)日：2014-04-10

申请号：PCT/US2013/061102

申请日：2013-09-23

Applicant: TYCO ELECTRONICS CORPORATION ,  TYCO ELECTRONICS AMP GMBH

Inventor： SACHS, Soenke ,  SCHMIDT, Helge ,  LEIDNER, Michael ,  HENSCHEL, Eva ,  FRECKMANN, Dominique Marie M. ,  MYERS, Marjorie Kay

IPC: H05K3/12

CPC classification number: H01L21/76892 ,  B23K15/0006 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/1283 ,  H05K2203/0545 ,  H05K2203/092 ,  H05K2203/1105 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A method of manufacturing an electrical component (100) includes providing a substrate (104), applying an insulating layer (110) on the substrate, applying a circuit layer (112) on the insulating layer, irradiating the insulating layer with an electron beam (114) to transform the insulating layer, and irradiating the circuit layer with an electron beam to transform the circuit layer. The substrate may be a metallic substrate that is highly thermally conductive. The insulating layer provides electrical isolation and effective heat transfer between the circuit layer and the substrate. The method may include coupling a light emitting diode module (102) or other active circuits requiring thermal management to the circuit layer resident on the electrically insulating/thermally conducting layer.

Abstract translation: 一种制造电气部件（100）的方法包括提供基板（104），在基板上施加绝缘层（110），在绝缘层上施加电路层（112），用电子束照射绝缘层 114）转换绝缘层，并用电子束照射电路层以变换电路层。 衬底可以是高导热性的金属衬底。 绝缘层在电路层和衬底之间提供电隔离和有效的热传递。 该方法可以包括将需要热管理的发光二极管模块（102）或其它有源电路耦合到驻留在电绝缘/导热层上的电路层。