公开(公告)号：WO2014055271A1

公开(公告)日：2014-04-10

申请号：PCT/US2013/061107

申请日：2013-09-23

Applicant: TYCO ELECTRONICS CORPORATION ,  TYCO ELECTRONICS AMP GMBH

Inventor： SACHS, Soenke ,  SCHMIDT, Helge ,  LEIDNER, Michael ,  HENSHEL, Eva ,  FRECKMANN, Dominique Marie M. ,  MYERS, Marjorie Kay

IPC: H05K3/12

CPC classification number: H05K3/105 ,  H05K1/02 ,  H05K3/0091 ,  H05K3/1283 ,  H05K2203/092 ,  H05K2203/111 ,  H05K2203/1157

Abstract: A method of manufacturing an electrical component (100) includes providing an electrically insulating substrate (104) having an outer surface (108), applying a coating layer on the outer surface and irradiating the coating (106) layer with an electron beam (110) to form an electrical conductor (102) on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.

Abstract translation: 一种制造电气部件（100）的方法包括提供具有外表面（108）的电绝缘基板（104），在外表面上涂覆涂层并用电子束（110）照射涂层（106） 以在基板上形成电导体（102）。 照射可以包括加热涂层以熔化涂层以形成电导体。 涂层可能具有低的粘合剂浓度和高的金属浓度。 照射可以包括蒸发基本上所有的粘合剂，留下基本上纯的金属层以形成电导体。 可以将涂层照射直到涂层的非金属材料完全除去。

公开(公告)号：WO2014055227A1

公开(公告)日：2014-04-10

申请号：PCT/US2013/059864

申请日：2013-09-16

Applicant: TYCO ELECTRONICS CORPORATION ,  TYCO ELECTRONICS AMP GMBH

Inventor： SCHMIDT, Helge ,  LEIDNER, Michael ,  MYERS, Marjorie Kay

IPC: H01R13/24 ,  H01H1/06

CPC classification number: H01R13/22 ,  H01H1/06 ,  H01H1/10 ,  H01H3/125 ,  H01H13/48 ,  H01R13/2478 ,  H01R13/2485 ,  H01R13/2492

Abstract: An electrical contact assembly (10) includes a first electrical contact (12) having a first mating element (16), and a second electrical contact (14) having a second mating element (18). The first and second electrical contacts being configured to mate together at the first and second mating elements such that the first and second mating elements engage each other at a contact interface (20). A distribution of contact pressure across the contact interface at least partially coincides with a distribution of electrical current flow across the contact interface.

Abstract translation: 电接触组件（10）包括具有第一配合元件（16）的第一电触头（12）和具有第二配合元件（18）的第二电接触件（14）。 第一和第二电触点被配置为在第一和第二配合元件处配合在一起，使得第一和第二配合元件在接触界面（20）处彼此接合。 接触界面上的接触压力的分布至少部分地与穿过接触界面的电流分布一致。

公开(公告)号：WO2014176145A1

公开(公告)日：2014-10-30

申请号：PCT/US2014/034749

申请日：2014-04-21

Applicant: TYCO ELECTRONICS CORPORATION ,  TYCO ELECTRONICS AMP GMBH

Inventor： SCHMIDT, Helge ,  MYERS, Marjorie Kay ,  KARRASCH, Christopher John

IPC: H01R43/048 ,  H01R4/18 ,  H01R4/62 ,  H01R4/08

CPC classification number: H01R13/422 ,  H01R4/08 ,  H01R4/187 ,  H01R4/62 ,  H01R43/0207 ,  H01R43/048 ,  Y10T29/49185 ,  Y10T29/53213

Abstract: A method is provided for crimping an electrical terminal (10) to an electrical wire having electrical conductors (30). The method includes positioning the electrical wire (28) and the electrical terminal (10) between opposing crimp tooling members of a crimp tool. The method also includes pressing a crimp barrel (20) of the electrical terminal (10) against the electrical conductors (30) of the electrical wire (28) using the crimp tooling members such that the electrical conductors (30) are mechanically and electrically connected to the crimp barrel (20). The crimp barrel (20) is pressed against the electrical conductors (30) such that at least some contact portions (131) of metallic surfaces (126) of at least some of the electrical conductors (30) melt and form hot weld bonds (130) with one or more contact portions (131) of the metallic surface (126) of one or more adjacent electrical conductors (30).

Abstract translation: 提供一种用于将电端子（10）压接到具有电导体（30）的电线的方法。 该方法包括将电线（28）和电端子（10）定位在压接工具的相对的压接工具之间。 该方法还包括使用压接工具将电气端子（10）的压接筒（20）压靠电线（28）的电导体（30），使得电导体（30）机械地和电气连接 到压接桶（20）。 压接筒（20）被压在电导体（30）上，使得至少一些电导体（30）的金属表面（126）的至少一些接触部分（131）熔化并形成热焊接接头（130 ）与一个或多个相邻电导体（30）的金属表面（126）的一个或多个接触部分（131）接合。

公开(公告)号：WO2014055270A1

公开(公告)日：2014-04-10

申请号：PCT/US2013/061102

申请日：2013-09-23

Applicant: TYCO ELECTRONICS CORPORATION ,  TYCO ELECTRONICS AMP GMBH

Inventor： SACHS, Soenke ,  SCHMIDT, Helge ,  LEIDNER, Michael ,  HENSCHEL, Eva ,  FRECKMANN, Dominique Marie M. ,  MYERS, Marjorie Kay

IPC: H05K3/12

CPC classification number: H01L21/76892 ,  B23K15/0006 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/1283 ,  H05K2203/0545 ,  H05K2203/092 ,  H05K2203/1105 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A method of manufacturing an electrical component (100) includes providing a substrate (104), applying an insulating layer (110) on the substrate, applying a circuit layer (112) on the insulating layer, irradiating the insulating layer with an electron beam (114) to transform the insulating layer, and irradiating the circuit layer with an electron beam to transform the circuit layer. The substrate may be a metallic substrate that is highly thermally conductive. The insulating layer provides electrical isolation and effective heat transfer between the circuit layer and the substrate. The method may include coupling a light emitting diode module (102) or other active circuits requiring thermal management to the circuit layer resident on the electrically insulating/thermally conducting layer.

Abstract translation: 一种制造电气部件（100）的方法包括提供基板（104），在基板上施加绝缘层（110），在绝缘层上施加电路层（112），用电子束照射绝缘层 114）转换绝缘层，并用电子束照射电路层以变换电路层。 衬底可以是高导热性的金属衬底。 绝缘层在电路层和衬底之间提供电隔离和有效的热传递。 该方法可以包括将需要热管理的发光二极管模块（102）或其它有源电路耦合到驻留在电绝缘/导热层上的电路层。

公开(公告)号：WO2015041843A1

公开(公告)日：2015-03-26

申请号：PCT/US2014/053802

申请日：2014-09-03

Applicant: TYCO ELECTRONICS CORPORATION ,  TYCO ELECTRONICS AMP GMBH

Inventor： MYERS, Marjorie Kay ,  SCHMIDT, Helge

IPC: B32B15/01 ,  H01R13/03

CPC classification number: H01B1/02 ,  B32B15/01 ,  B32B15/018 ,  H01B13/0036 ,  H01R13/03 ,  Y10T428/12875

Abstract: An electrical component (10) includes an interior layer (20) that includes an exterior surface (28). The electrical component (10) includes an intermediate layer (22) that includes at least one platinum group metal (PGM). The intermediate layer extends on the exterior surface of the interior layer. The intermediate layer has an exterior PGM surface (30). The electrical component includes a silver layer (24) that includes silver. The silver layer extends on the exterior PGM surface such that the intermediate layer extends between the interior layer and the silver layer.

Abstract translation: 电气部件（10）包括包括外表面（28）的内层（20）。 电气部件（10）包括包含至少一种铂族金属（PGM）的中间层（22）。 中间层在内层的外表面上延伸。 中间层具有外部PGM表面（30）。 电气部件包括包含银的银层（24）。 银层在外部PGM表面上延伸，使得中间层在内层和银层之间延伸。

公开(公告)号：WO2016137914A1

公开(公告)日：2016-09-01

申请号：PCT/US2016/019014

申请日：2016-02-23

Applicant: TYCO ELECTRONICS CORPORATION ,  TE CONNECTIVITY GERMANY GMBH

Inventor： SCHMIDT, Helge ,  MYERS, Marjorie Kay ,  SARRAF, David Bruce ,  COLLEGE, David Alan

IPC: H01B1/02

CPC classification number: H01B7/0009 ,  H01B1/023 ,  H01B13/0036 ,  H01R43/28

Abstract: An electrical wire (100) includes a bundle of electrical conductors (102) that has an end segment (110) that extends to an end (108) of the bundle. Each electrical conductor in the bundle engages at least one other electrical conductor. The electrical wire also includes conductive particles (106) disposed between and engaging at least some of the electrical conductors in the bundle along the end segment. The conductive particles are configured to provide an electrical connection between the corresponding electrical conductors engaged by the conductive particles.

Abstract translation: 电线（100）包括一束电导体（102），其具有延伸到束的端部（108）的端部段（110）。 束中的每个电导体与至少一个其它电导体接合。 电线还包括设置在沿着端段的束中的至少一些电导体之间并且与其接合的导电颗粒（106）。 导电颗粒被配置为在由导电颗粒接合的对应电导体之间提供电连接。

公开(公告)号：WO2016137911A1

公开(公告)日：2016-09-01

申请号：PCT/US2016/019009

申请日：2016-02-23

Applicant: TYCO ELECTRONICS CORPORATION ,  TE CONNECTIVITY GERMANY GMBH

Inventor： SCHMIDT, Helge ,  MYERS, Marjorie Kay ,  COLLEGE, David Alan

IPC: H01R4/18 ,  H01R43/048 ,  H01R4/62

CPC classification number: H01R43/048 ,  H01R4/183 ,  H01R4/184 ,  H01R4/188 ,  H01R4/62

Abstract: A crimping device (100) includes an anvil (114) and a crimp tooling member (116). The anvil is configured to receive a terminal (102) on a top surface (112) thereof. The crimp tooling member has a forming profile (118) recessed from a bottom side (132) of the crimp tooling member. The forming profile is configured to engage a crimp barrel (110) of the terminal as the crimp tooling member moves towards the anvil during a crimping operation to crimp the crimp barrel into mechanical and electrical engagement with an electrical wire (104) disposed within the crimp barrel. The forming profile defines at least one pocket (170) along a top-forming surface (136) of the forming profile that extends between two side walls (134) of the forming profile. Each pocket is configured to form a corresponding protrusion (196) in the crimp barrel of the terminal during the crimping operation.

Abstract translation: 压接装置（100）包括砧（114）和压接工具（116）。 砧构造成在其顶表面（112）上接收端子（102）。 压接加工构件具有从压接工具构件的底侧（132）凹陷的成形轮廓（118）。 当压接操作期间压接工具构件向砧移动时，成形轮廓被构造成接合端子的压接筒（110），以将卷边筒压接成与设置在卷边内的电线（104）机械和电接合 桶。 成形轮廓限定了沿成形轮廓的顶部形成表面（136）的至少一个凹槽（170），其在成形轮廓的两个侧壁（134）之间延伸。 每个口袋构造成在压接操作期间在端子的压接筒中形成相应的突起（196）。