MATERIALS AND METHODS FOR THERMAL AND ELECTRICAL CONDUCTIVITY
    1.
    发明申请
    MATERIALS AND METHODS FOR THERMAL AND ELECTRICAL CONDUCTIVITY 审中-公开
    材料与电导率的方法

    公开(公告)号:WO2011057105A3

    公开(公告)日:2011-08-04

    申请号:PCT/US2010055677

    申请日:2010-11-05

    Abstract: A method of implementing a carbon nanotube thermal interface material onto a heat sink that includes growing carbon nanotubes on said heat sink by chemical vapor deposition and compressing the carbon nanotubes onto metallic surfaces to increase a contact surface area between the carbon nanotubes and the metallic surfaces. The increase in the contact surface area is the area of the carbon nanotubes that is in contact with the metallic surfaces.

    Abstract translation: 一种在散热器上实施碳纳米管热界面材料的方法,其包括通过化学气相沉积在所述散热器上生长碳纳米管并将碳纳米管压缩到金属表面上以增加碳纳米管与金属表面之间的接触表面积。 接触表面积的增加是与金属表面接触的碳纳米管的面积。

    CARBON NANOTUBE BASED FIELD EMISSION DEVICES AND METHODS
    2.
    发明申请
    CARBON NANOTUBE BASED FIELD EMISSION DEVICES AND METHODS 审中-公开
    基于碳纳米管的场发射装置和方法

    公开(公告)号:WO2011035246A3

    公开(公告)日:2011-05-19

    申请号:PCT/US2010049499

    申请日:2010-09-20

    Abstract: A method of fabricating a cathodic portion of a field emission display includes the steps of producing an array of substantially parallel carbon nanotubes attached at one end to a substantially planar substrate. Then, embedding the nanotubes in a polymer matrix that extends to a plane of attachment of the nanotubes to the planar substrate, wherein the polymer matrix allows an end of the nanotubes distal from the ends attached to the planar substrate, uncovered by the polymer matrix in order to allow electrical contact with each other and with an attached conductor. Next, detaching the array from the planar substrate, thus producing a surface having the formerly attached ends of the nanotubes substantially in a plane, and then attaching the conductor to the array of nanotube ends, uncovered by the polymer matrix and distal to the plane.

    Abstract translation: 制造场致发射显示器的阴极部分的方法包括以下步骤:在一端附接到基本平坦的基底上产生基本平行的碳纳米管阵列。 然后,将纳米管嵌入到延伸到纳米管与平面基底的连接平面的聚合物基质中,其中聚合物基质允许纳米管的端部远离附着于平面基底的末端,未被聚合物基体覆盖 以允许彼此电连接和连接的导体电接触。 接下来,将阵列从平面基板分离,从而产生具有先前连接的纳米管的端部的表面基本上在一个平面内的表面,然后将导体附着到未被聚合物基体覆盖并且远离该平面的纳米管末端阵列上。

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