公开(公告)号：WO2011053396A1

公开(公告)日：2011-05-05

申请号：PCT/US2010/042129

申请日：2010-07-15

Applicant: XILINX, INC.

Inventor： WYLAND, Christopher, P.

IPC: H01L23/66

CPC classification number: H01L23/66 ,  H01L23/64 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0251 ,  H05K1/116 ,  H05K2201/09463 ,  H05K2201/09781 ,  H05K2201/09809 ,  H01L2924/00

Abstract: Vias (106) are typically of a lower impedance than the signal lines (102, 128) connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. An embodiment avoids impedance mismatch in circuits and achieves an advance in the art by providing a via (106) with higher impedance through the addition of split ring resonators (104, 112, 120, 126) to each end of the via (106).

Abstract translation: 通道（106）通常具有比连接到它们的信号线（102,128）更低的阻抗。 导致阻抗失配的噪声和反射信号可能要求电路以远低于所需的频率运行。 一个实施例避免了电路中的阻抗不匹配，并且通过向通孔（106）的每个端部添加开环谐振器（104,112,120,126）提供具有更高阻抗的通孔（106）来实现本领域的进步。

公开(公告)号：WO2012078263A1

公开(公告)日：2012-06-14

申请号：PCT/US2011/058467

申请日：2011-10-28

Applicant: XILINX, INC.

Inventor： GHIA, Atul, V. ,  WYLAND, Christopher, P. ,  SODHA, Ketan ,  SASAKI, Paul, T. ,  TAN, Jian ,  WU, Paul, Y. ,  MAYDER, Romi

IPC: H01L23/528 ,  H01L23/522

CPC classification number: H01L23/5223 ,  H01L23/5286 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In one embodiment an integrated circuit (IC) is presented. The IC includes first and second sets of power distribution lines (204) formed in the IC. The IC includes first (210) and second (212) capacitors formed in one or more layers of the IC. A first plurality of vias (214) couple a first input of the first and second capacitors to the first set of power distribution lines, and a second plurality of vias (214) couple a second input of the first and second capacitors to the second set of power distribution lines. The first capacitor (210) and vias (214) coupled thereto having an equivalent series resistance greater than an equivalent series resistance of the second capacitor (210) and vias (214) coupled thereto.

Abstract translation: 在一个实施例中，呈现集成电路（IC）。 IC包括形成在IC中的第一组和第二组配电线（204）。 IC包括形成在IC的一个或多个层中的第一（210）和第二（212）电容器。 第一多个通孔（214）将第一和第二电容器的第一输入耦合到第一组配电线，以及第二多个通孔（214）将第一和第二电容器的第二输入端耦合到第二组 的配电线路。 耦合到其上的第一电容器（210）和通孔（214）具有大于第二电容器（210）的等效串联电阻和与其耦合的通孔（214）的等效串联电阻。