Abstract:
A test system (1) is a test system for conducting a test including a static characteristic test of a device under test, the test system (1) comprising: a plurality of static characteristic units (21, 22, 23, 25, 71, 72, 73) used for measurement of the static characteristic test; and a replacement unit (24) configured to be able to attach and detach specific units (71, 72, 73) among the plurality of static characteristic units (21, 22, 23, 25, 71, 72, 73), the specific units (71, 72, 73) selectively used according to a measurement item.
Abstract:
Aspects of the disclosure can relate to systems or devices for detecting a lifespan parameter of a power transistor of an electronic device. In an embodiment, a device can include a differential probe configured to connect to a first terminal and a second terminal of a power transistor. The device can also include a voltage detector that senses a voltage signal from the differential probe and a controller configured to determine a lifespan parameter of the power transistor based on the voltage signal. In another embodiment, the voltage detector and the controller can be included in an electronic device (e.g., a drilling tool or another downhole tool). In another embodiment, the voltage detector can be in the electronic device, where the electronic device includes an external port that provides a differential voltage signal detected by the voltage detector to an external measurement tool (e.g., oscilloscope or the like).
Abstract:
Die Erfindung betrifft ein Verfahren zum Erkennen eines zumindest teilweisen Ausfalls mindestens eines Halbleiterbauelements (252), das parallel zu anderen Halbleiterbauelementen (254, 256, 258) geschaltet ist, bei dem ein Verlauf einer Versorgung, der durch ein Messsignal repräsentiert ist, eines Treibers (300), der zum Treiben der Halbleiterbauelemente (252, 254, 256, 258) vorgesehen ist, ermittelt und ausgewertet wird und aus einer Nachverarbeitung des Verlauf ermittelt wird, ob mindestens eines der parallelgeschalteten Halbleiterbauelemente (252, 254, 256, 258) ausgefallen ist.
Abstract:
The invention regards an method for estimating the end of lifetime for a power semiconductor device, such as an IGBT power module, comprising the steps of; establishing the temperature of the power semiconductor device, determining the voltage drop over the power semiconductor device for at least one predetermined current where the current is applied when the power semiconductor device is not in operation, wherein the end of lifetime is established dependent on the change in a plurality of determined voltage drops.
Abstract:
A method to establish a degradation state of electrical connections in a power semiconductor device ( 1 ) comprising: - measuring at least two voltage drop values under two respective current values for the same temperature value. The two current values are strictly different or the measurements are made under two distinct gate levels (G) of a transistor; - saving the measured values as calibration data; - monitoring operational conditions of said power semiconductor device; - measuring at least two voltage drop values under respective same current values as preceding, and at two respective moments during which the monitored operational conditions corresponding to two respective predefined sets of criteria related to states of operation and to a common temperature; - saving the at least two values as operational data; - calculating a numerical index in a manner to estimate a degradation state of said power semiconductor device (1).
Abstract:
A synthetic test circuit (30), for performing an electrical test on a device (52) under test, comprises: a terminal (32, 34) connectable to the device (52) under test; a voltage injection circuit (40) operably connected to the terminal (32, 34), the voltage injection circuit (40) including a first voltage source (46a), the first voltage source (46a) including a chain-link converter, the chain-link converter including a plurality of modules, each module including a plurality of module switches connected with at least one energy storage device; and a controller (50) being configured to operate each module of the voltage injection circuit (40) to selectively bypass the or each corresponding energy storage device and insert the or each corresponding energy storage device into the chain-link converter so as to generate a voltage across the chain-link converter and thereby operate the voltage injection circuit (40) to inject a voltage waveform into the device under test, wherein the voltage injection circuit (40) further includes a second voltage source (46a), the second voltage source (46a) being or including a capacitive energy storage device (54), the capacitive energy storage device (54) being fixedly connected in circuit in the voltage injection circuit (40).
Abstract:
A test system and test techniques for accurate high-current parametric testing of semiconductor devices. In operation, the test system supplies a current to the semiconductor device and measures a voltage on the device. The testing system may use the measured voltage to compute an ON resistance for the high-current semiconductor device. In one technique, multiple force needles contact a pad in positions that provide equi-resistant paths to one or more sense needles contacting the same pad. In another technique, current flow through the force needles is regulated such that voltage at the pad of the device under test is representative of the ON resistance of the device and independent of contact resistance of the force needle. Another technique entails generating an alarm indication when the contact resistance of a force needle exceeds a threshold.