Abstract:
The invention relates to a two steps image capture panel for recording x-ray image information. More particularly, the invention relates to a method and an apparatus for directing the internal electric field to capture the x-ray image first on an insulating surface, avoiding charge injection noise from the insulating surface, and then re-directing the internal electrical field to transfer the image charge from the insulating surface to a conductive readout electrode with electric field sufficient for charge gain during image readout.
Abstract:
Technologies are described for semiconductor radiation detectors. The semiconductor radiation detectors may comprise a semiconductor material. The semiconductor material may include a first surface and a second surface. The first surface may be opposite from the second surface. The semiconductor material may include at least one metal component. The semiconductor material may be effective to absorb radiation and induce a current pulse in response thereto. The semiconductor radiation detector may comprise an electrode contact. The electrode contact may include a metal doped oxide deposited on the first surface of the semiconductor material. The metal doped oxide may include the metal component element of the semiconductor material.
Abstract:
Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. The electronics sub- assembly comprises electronic circuitry, embedded within a molding compound, configured to digitize analog signals yielded from the radiation detection sub- assembly and/or to otherwise process such analog signals. The electronics sub- assembly also comprises a substrate, such as a printed circuit board, configured to route signals between the electronic circuitry and a photodetector array of the radiation detection sub-assembly and/or to route signals between the electronic circuitry and digital processing components, such as an image generator, for example.
Abstract:
Adetector array includes at least one direct conversion detector pixel (114 - 114 M ) configured to detect photons of poly-chromatic ionizing radiation. The pixel includes a cathode layer (116), an anode layer (118) including an anode electrode (118 -118 M ) for each of the at least one detector pixels, a direct conversion material (120), disposed between the cathode layer and the anode layer, anda gate electrode disposed in the direct conversion material, parallelto and between the cathode and anode layers.
Abstract:
L'invention concerne un procédé de commande d'un dispositif photosensible, par exemple d'un détecteur numérique de rayons X comprenant une matrice de points photosensibles. Le dispositif photosensible comprend un conducteur colonne, des conducteurs ligne et des points photosensibles. Chaque point photosensible est relié entre le conducteur colonne et l'un des conducteurs ligne, et comprend un élément photosensible apte à convertir un flux de photons en charges électriques, et un transistor apte à transférer les charges électriques vers le conducteur colonne sur commande d'un signal reçu par le conducteur ligne correspondant. L'invention repose sur la présence d'une capacité de couplage parasite entre le drain et la source de chaque transistor à l'état bloqué. Cette capacité introduit une variation de potentiel sur le conducteur colonne avec la réception de photons. Le procédé selon l'invention comporte des étapes (21, 22, 23, 24) permettant de comparer la variation de potentiel à un seuil, une étape de lecture (25) des points photosensibles étant exécutée en cas de comparaison positive.
Abstract:
An imaging system (100) includes a radiation source (112) that emits radiation that traverses an examination region and a detector array (114) with a plurality of photon counting detector pixels (116) that detect radiation traversing the examination region and respectfully generate a signal indicative of the detected radiation. The photon counting detector pixel includes a direct conversion layer (122) having a first radiation receiving side (202) and second opposing side (206), a cathode (118) affixed to and covering all of or a substantial portion of the first side, an anode (120) affixed to a centrally located region (208) of the second side, wherein the anode includes at least two sub-anodes (120, 120i, 1202, 120N), and a metallization (124) affixed to the second side, surrounding the anode and the anode region, with a gap between the anode and the metallization. The system further includes a reconstructor (144) that reconstructs the signal to generate volumetric image data indicative of the examination region.
Abstract:
A radiation detector is disclosed. The detector comprises a detector element on which electrodes are formed. First and second electrodes are provided at a first surface of the detector element, and are arranged such that, on application of an electric field between the first and second electrodes, a first detector region is formed adjacent the first surface of the detector element. A third electrode is provided on a second surface of the detector element, and is arranged such that, on application of an electric field between the first and third electrodes, a second detection region is formed between the first and second surfaces of the detector element. The first and second detection regions are differently sized for the detection of different types of radiation. Apparatus for detecting radiation, and handheld devices comprising such apparatus, are also disclosed.
Abstract:
A radiation detector is described having a semiconductor substrate with opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, a plurality of anode electrodes located on the rear surface of said semiconductor substrate and a solder mask disposed above the anode electrodes. The solder mask has openings extending to the anode electrodes for placing solder in said openings.