摘要:
A purge tower assembly for a substrate container. The assembly may include a purge interface body, including a base portion and a top portion, for mounting to a bottom plate of a substrate container. The base portion may include a substantially tubular base sidewall and the top portion may have a top sidewall positioned on the top edge of the base portion. The top portion may include an inlet nozzle for mounting through a rearward inlet in the bottom plate. The inlet nozzle may have a substantially tubular sidewall extending upwardly from the top sidewall and defining an interior of the inlet nozzle. The base portion and the top sidewall may define an offset conduit portion disposed connected to the base portion and the inlet nozzle, the base portion and the inlet nozzle in fluid communication via the offset conduit portion.
摘要:
The present invention relates to a wafer storage container, more particularly, relates to a wafer storage container wherein the space of the wafer storage container is divided into the spaces, namely a storage room, a gas injection room, and a gas exhausting room, which are independent and separate from each other, so when the wafer storage container is transported to the load port and being coupled therewith, the purge gas is injected/exhausted through the separating walls inside the storage room, thereby efficiently removing the remaining fumes on the surface of the wafer.
摘要:
A semiconductor wafer carrier assembly includes a carrier, the carrier defining a wafer storage area adapted to support one or more semiconductor wafers. The carrier has a door for access to the wafer storage area, the door defining an interior. The assembly also includes a getter module, the getter module including a housing, getter material disposed within the housing, the getter material adapted to decrease concentration of contaminants within the wafer storage area of the carrier, and at least one connection feature adapted to readily removably secure the getter module to the interior of the door.
摘要:
A substrate container includes a container portion having an open side or bottom, and a door to sealingly close the open side or bottom, one of the door and the container portion defining access structure. The substrate container additionally includes a check-valve assembly, the check-valve assembly being retained with respect to the access structure to provide fluid communication with an interior of the substrate container. The check-valve assembly includes a grommet, the grommet being formed of an elastomeric material. A valve seat is disposed within the grommet, the valve seat being integrally formed with the grommet according to one aspect, and being formed of a separate piece according to another aspect. An elastomeric valve member, specifically an elastomeric umbrella valve member according to one aspect, is disposed within the grommet and held to engage the valve seat, thereby restricting fluid flow through the check-valve assembly with respect to the interior of the substrate container.
摘要:
기존의 로드포트에 퍼지 기능을 부여할 수 있으며 또한 다양한 종류의 웨이퍼 캐리어에 대응가능한 퍼지 모듈 및 이러한 퍼지 모듈이 부착된 로드포트가 제공된다. 이러한 퍼지 모듈은 지그(JIG), 가스 제어 박스 및 파이프들을 포함한다. 상기 지그는 로드포트(LOADPORT)의 스테이지 상부에 탈착가능하도록 장착되고, 웨이퍼 캐리어 내부에 가스를 주입하는 가스 주입구 및 웨이퍼 캐리어 내부의 가스를 배출하기 위한 가스 배출구를 포함한다. 상기 가스 제어 박스는 상기 로드포트에 장착되어, 주입되는 가스 및 배출되는 가스를 제어한다. 상기 파이프들은 상기 지그 및 상기 가스 제어 박스를 연결한다.
摘要:
A diffuser tower assembly having a diffuser with a flared end and a fitting with an offset portion and nipple sized for the flared end. The assembly may be configured for providing low coverage purging. Diffuser tower assemblies may be in the form of a kit for retrofitting existing front opening wafer containers. The inlet fitting may include structure that enhances purge characteristics near the base of the porous media diffuser for enhanced sweeping of the floor of the substrate container. Embodiments of the disclosure generate an uneven flow distribution that provides a non-uniform flow distribution at the opening. In an embodiment, where the opening is in a substantially vertical orientation, the non- uniform flow distribution is tailored to deliver a greater flow rate to the bottom half of the opening than to the top of the opening.
摘要:
A containment for one or more substrates has an enclosure that defines a contained volumetric area and included therein is a block or plate getter unit that has an enhanced performance provided by increased surface area formed on the plate or block by a series of grooves or other repeating surface structure pattern. Such patterning provides increased surface area on the block or plate and thus increased exposure of active elements to the contained volumetric region. In an embodiment, structure on one side of the block or plate has mirror image surface or a complementary surface on the opposing side. With such a structure, rigidity of the block or plate is preserved, weight is minimized, and exposed surface area is maximized. The enclosure may have specific pockets or may utilize a conventional substrate slot for the block or plate getter. The plate or block getter may be configured to fit within a conventional slot or a dedicated pocket in a wafer container or other substrate container.
摘要:
Die vorliegende Erfindung betrifft eine Prozessbox zum Prozessieren eines beschichteten Substrats, mit den folgenden Merkmalen: ein gasdicht verschließbares Gehäuse, das einen Hohlraum formt; das Gehäuse umfasst wenigstens einen Gehäuseabschnitt, der so ausgebildet ist, dass das Substrat durch auf den Gehäuseabschnitt auftreffende elektromagnetische Heizstrahlung wärmebehandelbar ist; das Gehäuse weist wenigstens einen mit einer Kühleinrichtung zu dessen Kühlung koppelbaren Gehäuseabschnitt und wenigstens einen nicht kühlbaren Gehäuseabschnitt auf; der Hohlraum ist durch wenigstens eine Trennwand in einen Prozessraum zum Aufnehmen des Substrats und einen Zwischenraum unterteilt, wobei die Trennwand über eine oder mehrere Öffnungen verfügt und zwischen dem Substrat und dem temperierbaren Gehäuseabschnitt angeordnet ist; das Gehäuse ist mit wenigstens einer in den Hohlraum mündenden, verschließbaren Gasdurchführung zum Evakuieren und Einleiten von Prozessgas in den Hohlraum versehen. Des Weiteren betrifft sie Anordnungen und ein Verfahren zum Prozessieren eines beschichteten Substrats, bei dem wenigstens ein Gehäuseabschnitt der Prozessbox während und/oder nach der Wärmebehandlung gekühlt und eine Diffusion eines während der Wärmebehandlung erzeugten gasförmigen Stoffs zum temperierten Gehäuseabschnitt durch eine mit einer oder mehreren Öffnungen versehene Trennwand, welche zwischen dem beschichteten Substrat und dem temperierten Gehäuseabschnitt angeordnet ist, gehemmt wird.