公开(公告)号：WO2010104448A1

公开(公告)日：2010-09-16

申请号：PCT/SE2010/050197

申请日：2010-02-19

Applicant: SANDVIK INTELLECTUAL PROPERTY AB ,  PRUSIC, Milinko

Inventor： PRUSIC, Milinko

IPC: B21B27/03 ,  B23P11/02

CPC classification number: B21B27/035 ,  Y10T29/49552

Abstract: The invention relates to a roller of the type that comprises, on one hand, a drive shaft (1), which has a cylindrical envelope surface (6) having a certain outer diameter and a certain length, and, on the other hand, a shorter roller ring (2), which includes an outer ring (4) of a hard material and an inner ring (3) concentric with the same and of a more ductile material, which includes a cylindrical inside having a certain inner diameter and is, on one hand, permanently united to the outer ring (4) in a metallurgical way, and, on the other hand, rotationally rigidly connected with the drive shaft (1) in order to, from the same, transfer torque to the outer ring (4). According to the invention, the rotationally rigid joint between the drive shaft (1) and the roller ring (2) solely consists of a shrink-fit joint that is established between the envelope surface of the drive shaft and the inside of the inner ring and has an interference of at least 0,01 % of the outer diameter of the drive shaft (1).

Abstract translation: 本发明涉及一种类型的滚子，其一方面包括具有一定外径和一定长度的圆柱形包络面（6）的驱动轴（1），另一方面， 较短的滚子环（2），其包括硬质材料的外圈（4）和与其同心的内圈（3）和更具延展性的材料，其包括具有一定内径的圆柱形内部， 一方面以冶金方式永久地联结到外环（4），另一方面与驱动轴（1）旋转地刚性地连接，以便从相同的传递扭矩传递到外圈（ 4）。 根据本发明，驱动轴（1）和滚轮环（2）之间的旋转刚性接头仅由在驱动轴的包络面和内圈内部之间建立的收缩配合接头构成， 具有至少0.01％的驱动轴（1）外径的干扰。

公开(公告)号：WO99024195A1

公开(公告)日：1999-05-20

申请号：PCT/DE1998/003200

申请日：1998-11-03

IPC: F16C13/00 ,  B22F5/12 ,  B22F7/00 ,  B22F7/04 ,  B22F7/06 ,  B41F13/08 ,  B22F3/11

CPC classification number: B22F7/062 ,  B22F7/006 ,  B22F2998/00 ,  B41F13/08 ,  Y10T29/49547 ,  Y10T29/49549 ,  Y10T29/49552 ,  Y10T29/49558 ,  Y10T29/49865 ,  Y10T29/49885 ,  Y10T29/49936 ,  B22F3/1125

Abstract: Processes are disclosed for manufacturing semifinished products made of tubular elements with a metallic foam core.

Abstract translation: 有指出了用于生产半成品的管状体的金属泡沫芯的过程。

公开(公告)号：WO2005038861A9

公开(公告)日：2005-06-02

申请号：PCT/US2004016045

申请日：2004-05-21

Applicant: MARSHALL PAUL N

Inventor： MARSHALL PAUL N

IPC: H01L20060101 ,  H01L23/34 ,  H01L

CPC classification number: H01L25/0652 ,  H01L2225/06527 ,  H01L2225/06589 ,  H01L2924/0002 ,  Y10T29/49258 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49377 ,  Y10T29/49552 ,  Y10T29/53113 ,  Y10T29/53117 ,  H01L2924/00

Abstract: This invention relates to a high density architecture for an integrated circuit package (10) in which a plurality of circuit communication wafers (12) are disposed in a stack with a plurality of cooling plates (14) between them, and wherein circuit communication between the communication wafers (12) is provided from wafer to wafer through the cooling plates (14). In addition, the communication wafers (12) may have integrated circuit chips (18) deposited on both sides of the wafer, and chip-to-chip communication may be provided from one surface of the wafer to another through the wafer. The resulting integrated circuit package may have any desired geometrical shape and will permit heat exchange, power and data exchange to occur in three generally mutually orthogonal directions through the package.

Abstract translation: 本发明涉及一种用于集成电路封装（10）的高密度结构，其中多个电路通信晶片（12）与多个冷却板（14）在它们之间堆叠放置，并且其中电路 通过冷却板（14）从晶片到晶片提供通信晶片（12）。 另外，通信晶片（12）可以具有沉积在晶片两侧上的集成电路芯片（18），并且可以通过晶片从晶片的一个表面向另一个晶片提供芯片间通信。 得到的集成电路封装可以具有任何期望的几何形状，并且将允许热交换，功率和数据交换以三个通常相互正交的方向穿过封装发生。

公开(公告)号：WO2004103582A1

公开(公告)日：2004-12-02

申请号：PCT/FI2004/050075

申请日：2004-05-24

Applicant: METSO PAPER, INC ,  PAASONEN, Jan

Inventor： PAASONEN, Jan

IPC: B05D7/00

CPC classification number: D21G1/02 ,  B05D3/0254 ,  B05D7/58 ,  B05D2254/02 ,  B29D99/0035 ,  B29L2031/324 ,  F16C13/00 ,  Y10T29/49544 ,  Y10T29/49552 ,  Y10T428/139

Abstract: The invention relates to a method for manufacturing a roll coating onto a roll frame (1), which coating comprises a base layer (2) on the roll frame (1) and a surface layer (3) on the base layer (2). The base layer (2) is brought to its final form after the surface layer (3) has been formed and cured or solidified. The surface layer (3) is formed on the base layer (2) and cured or solidified after the base layer (2) has been formed on the roll frame (1).

Abstract translation: 本发明涉及一种用于在辊架（1）上制造辊涂层的方法，该涂层包括在辊架（1）上的基层（2）和基层（2）上的表面层（3）。 在形成表面层（3）并固化或固化之后，使基底层（2）达到其最终形式。 表层（3）形成在基层（2）上，并且在基底层（2）已经形成在辊框架（1）上之后被固化或固化。

公开(公告)号：WO2005038861A2

公开(公告)日：2005-04-28

申请号：PCT/US2004/016045

申请日：2004-05-21

Applicant: MARSHALL, Paul, N.

Inventor： MARSHALL, Paul, N.

IPC: H01L

CPC classification number: H01L25/0652 ,  H01L2225/06527 ,  H01L2225/06589 ,  H01L2924/0002 ,  Y10T29/49258 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49377 ,  Y10T29/49552 ,  Y10T29/53113 ,  Y10T29/53117 ,  H01L2924/00

Abstract: This invention relates to a high density architecture for an integrated circuit package (10) in which a plurality of circuit communication wafers (12) are disposed in a stack with a plurality of cooling plates (14) between them, and wherein circuit communication between the communication wafers (12) is provided from wafer to wafer through the cooling plates (14). In addition, the communication wafers (12) may have integrated circuit chips (18) deposited on both sides of the wafer, and chip-to-chip communication may be provided from one surface of the wafer to another through the wafer. The resulting integrated circuit package may have any desired geometrical shape and will permit heat exchange, power and data exchange to occur in three generally mutually orthogonal directions through the package.

Abstract translation: 本发明涉及集成电路封装（10）的高密度结构，其中多个电路通信晶片（12）与多个冷却板（14）以堆叠 并且其中通过所述冷却板（14）从晶片到晶片提供所述通信晶片（12）之间的电路连通。 另外，通信晶片（12）可以具有沉积在晶片两侧上的集成电路芯片（18），并且可以通过晶片从晶片的一个表面向另一个晶片提供芯片间通信。 得到的集成电路封装可以具有任何期望的几何形状，并且将允许热交换，功率和数据交换以三个通常相互正交的方向通过封装发生。

公开(公告)号：WO1995017298A1

公开(公告)日：1995-06-29

申请号：PCT/JP1994002143

申请日：1994-12-20

Applicant: YAMAUCHI CORPORATION ,  WATANABE, Atsuo ,  NAKAYAMA, Kenjiro ,  KATO, Shunsuke

Inventor： YAMAUCHI CORPORATION

IPC: B29D31/00

CPC classification number: B29C39/40 ,  B29C39/028 ,  B29C39/10 ,  B29C70/72 ,  B29C2791/001 ,  B29L2031/324 ,  B29L2031/748 ,  D21G1/0246 ,  Y10T29/49551 ,  Y10T29/49552 ,  Y10T29/4956 ,  Y10T29/49563

Abstract: A method of manufacturing a hard roll for use in an elastic roll of a calendar roll for paper making and the like, according to the invention comprises the steps of pouring a liquid thermosetting resin material into a space between a metallic roll core and an outer die, heating from the outside a greater part of the resin material to harden the same for forming an intermediate having an outer layer of resin while cooling the roll core to leave a viscous liquid stock layer inside the intermediate. Then the intermediate is cooled from the outside of the outer die for shrinkage, and a surplus portion of the liquid stock is pushed upward as the intermediate shrinks. Then the remaining viscous liquid stock is hardened by heating the roll core. According to the method of the invention, the thermosetting resin is prevented from being cracked due to reactive shrinkage and thermal shrinkage of thermosetting resin during the manufacturing of the hard roll. Accordingly, it is possible to efficiently produce a hard roll with exceedingly fewer production steps and reduce production cost thereof, which hard roller is free from cracks on its surface during use and any change in its roll surface hardness and is excellent in durability.

Abstract translation: 根据本发明的制造用于造纸等的砑光辊的弹性辊中的硬卷的制造方法包括以下步骤：将液态热固性树脂材料注入金属辊芯和外模之间的空间 从外部加热树脂材料的大部分以使其硬化以形成具有外层树脂的中间体，同时冷却辊芯以在中间体内部留下粘性液体储备层。 然后中间体从外模的外部冷却以使其收缩，并且随着中间体收缩，液体原料的剩余部分被向上推动。 然后通过加热辊芯将剩余的粘性液体原料硬化。 根据本发明的方法，由于热硬化性树脂在硬卷制造过程中由于反应收缩和热收缩热收缩而被防止裂纹。 因此，可以有效地生产具有非常少的生产步骤的硬辊并降低其生产成本，该硬辊在使用期间在其表面上没有裂纹，并且其辊表面硬度的任何变化和耐久性优异。

公开(公告)号：WO2005038861B1

公开(公告)日：2005-12-08

申请号：PCT/US2004016045

申请日：2004-05-21

Applicant: MARSHALL PAUL N

Inventor： MARSHALL PAUL N

IPC: H01L20060101 ,  H01L23/34

CPC classification number: H01L25/0652 ,  H01L2225/06527 ,  H01L2225/06589 ,  H01L2924/0002 ,  Y10T29/49258 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49377 ,  Y10T29/49552 ,  Y10T29/53113 ,  Y10T29/53117 ,  H01L2924/00

Abstract: This invention relates to a high density architecture for an integrated circuit package (10) in which a plurality of circuit communication wafers (12) are disposed in a stack with a plurality of cooling plates (14) between them, and wherein circuit communication between the communication wafers (12) is provided from wafer to wafer through the cooling plates (14). In addition, the communication wafers (12) may have integrated circuit chips (18) deposited on both sides of the wafer, and chip-to-chip communication may be provided from one surface of the wafer to another through the wafer. The resulting integrated circuit package may have any desired geometrical shape and will permit heat exchange, power and data exchange to occur in three generally mutually orthogonal directions through the package.

公开(公告)号：WO2005038861A3

公开(公告)日：2005-10-20

申请号：PCT/US2004016045

申请日：2004-05-21

Applicant: MARSHALL PAUL N

Inventor： MARSHALL PAUL N

IPC: H01L20060101 ,  H01L23/34

CPC classification number: H01L25/0652 ,  H01L2225/06527 ,  H01L2225/06589 ,  H01L2924/0002 ,  Y10T29/49258 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49377 ,  Y10T29/49552 ,  Y10T29/53113 ,  Y10T29/53117 ,  H01L2924/00

Abstract: This invention relates to a high density architecture for an integrated circuit package (10) in which a plurality of circuit communication wafers (12) are disposed in a stack with a plurality of cooling plates (14) between them, and wherein circuit communication between the communication wafers (12) is provided from wafer to wafer through the cooling plates (14). In addition, the communication wafers (12) may have integrated circuit chips (18) deposited on both sides of the wafer, and chip-to-chip communication may be provided from one surface of the wafer to another through the wafer. The resulting integrated circuit package may have any desired geometrical shape and will permit heat exchange, power and data exchange to occur in three generally mutually orthogonal directions through the package.

Abstract translation: 本发明涉及用于集成电路封装（10）的高密度结构，其中多个电路通信晶片（12）以堆叠方式设置在它们之间的多个冷却板（14），并且其中电路连接晶片 通过冷却板（14）从晶片到晶片提供通信晶片（12）。 此外，通信晶片（12）可以具有沉积在晶片的两侧的集成电路芯片（18），并且可以从晶片的一个表面通过晶片提供芯片到芯片的通信。 所得到的集成电路封装可以具有任何期望的几何形状，并且将允许热交换，功率和数据交换在通过封装的三个通常相互正交的方向上发生。

公开(公告)号：WO2005056862A1

公开(公告)日：2005-06-23

申请号：PCT/JP2004/018587

申请日：2004-12-13

Applicant: 日立金属株式会社 ,  濱吉 繁幸 ,  野上 信悟 ,  杉山 茂禎

Inventor： 濱吉 繁幸 ,  野上 信悟 ,  杉山 茂禎

IPC: C23C2/00

CPC classification number: C04B35/593 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3225 ,  C04B2235/5445 ,  C04B2235/723 ,  C04B2235/767 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/788 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2235/963 ,  C23C2/003 ,  F16C13/00 ,  Y10T29/49552

Abstract: 　鋼板と接触する中空状胴部と、前記胴部に接合された軸部とからなる溶融金属めっき浴用ロールであって、少なくとも前記胴部が常温における熱伝導率が50 W/(m・K)以上の窒化珪素系セラミックスからなり、前記胴部の平均表面粗さRaが1～20μｍである溶融金属めっき浴用ロール。胴部と軸部の接合を焼嵌めにより行うのが好ましい。

Abstract translation: 公开了一种熔融金属电镀槽的卷，其包括与钢板接触的中空主体部分和与主体部分接合的轴部。 至少主体部分由在室温下具有不低于50W /（m.K）的热导率的氮化硅陶瓷材料构成，并且主体部分的表面粗糙度平均值（Ra）为1-20μm。 主体部分和轴部分优选通过收缩配合连接在一起。

公开(公告)号：WO2005018933A2

公开(公告)日：2005-03-03

申请号：PCT/US2004024973

申请日：2004-08-03

Applicant: PRESSTEK INC ,  THERIAULT EDWIN G ,  LOVENSTEIN JAMES V

Inventor： THERIAULT EDWIN G ,  LOVENSTEIN JAMES V

IPC: B41F27/12 ,  B41C

CPC classification number: B41F27/1262 ,  Y10T29/49552 ,  Y10T29/49865

Abstract: Printing plates are mounted onto a cylinder by first establishing a temperature difference between the plate and the cylinder; in particular, the temperature of the plate exceeds the temperature of the cylinder. The plate is then wrapped around the plate cylinder, and the temperature difference causes the plate to shrink against the cylinder.

Abstract translation: 首先在印版和圆筒之间建立温度差，将印版安装在圆筒上; 特别地，板的温度超过气缸的温度。 然后将板卷绕在印版滚筒上，并且温度差导致印版相对于圆柱体收缩。