公开(公告)号：WO2022268560A1

公开(公告)日：2022-12-29

申请号：PCT/EP2022/066044

申请日：2022-06-13

Applicant: ASML NETHERLANDS B.V. ,  ASML HOLDING N.V.

Inventor： VAN DAMME, Jean-Philippe, Xavier ,  JOHNSON, Richard, John ,  SUBRAMANIAN, Raaja Ganapathy

IPC: G03F7/20 ,  G03F7/70783 ,  G03F7/7085 ,  G03F7/70875

Abstract: Embodiments herein describe systems, methods, and devices for thermal conditioning of patterning devices at a lithographic apparatus. A patterning device cooling system for thermally conditioning a patterning device (202) of a lithographic apparatus is described, the cooling system including a thermal conditioner that thermally conditions the patterning device, and a controller that controls the thermal conditioner to determine a temperature state of the patterning device, determine a production state of the lithographic apparatus, and thermally condition the patterning device for exposures based on the temperature state and a production state of the lithographic apparatus.

公开(公告)号：WO2021228595A1

公开(公告)日：2021-11-18

申请号：PCT/EP2021/061503

申请日：2021-05-03

Applicant: ASML NETHERLANDS B.V.

Inventor： GILIJAMSE, Rogier, Sebastiaan ,  KUNNEN, Johan, Gertrudis, Cornelis ,  VAN DEN HEUVEL, Marco, Adrianus, Peter ,  ZOO, Boogyeong

IPC: G03F7/20 ,  H01L21/67 ,  H01L21/687 ,  G03F7/70533 ,  G03F7/707 ,  G03F7/70783 ,  G03F7/7085 ,  H01L21/67259 ,  H01L21/6838 ,  H01L21/68742

Abstract: A substrate support system is provided, comprising: a support part, the support part configured to support a bottom surface of a substrate on a support plane; a moveable part, the moveable part moveable between a retracted position, in which a top end of the moveable part is below the support plane, and an extended position, in which the top end of the moveable part is above the support plane, such that the top end supports the bottom surface of the substrate above the support plane in the extended position; and a measurement system configured to measure a time taken for the moveable part to move from the retracted position to the extended position, to compare the measured time with a reference time, and to generate a signal when the measured time deviates from the reference time by more than a predetermined amount.

公开(公告)号：WO2021249682A1

公开(公告)日：2021-12-16

申请号：PCT/EP2021/060040

申请日：2021-04-19

Applicant: ASML NETHERLANDS B.V.

Inventor： ROGACHEVSKIY, Andrey, Valerievich ,  KNARREN, Bastiaan, Andreas, Wilhelmus, Hubertus ,  TORUMBA, Doru, Cristian ,  GIJSBERTSEN, Arjan ,  CARESIO, Cristina ,  CENTENO, Raymund ,  KINYANJUI, Tabitha, Wangari ,  DEN BOER, Jan, Arie

IPC: G03F9/00 ,  G03F7/20 ,  G03F7/70783 ,  G03F9/7026 ,  G03F9/7034

Abstract: The present invention provides a method for calculating a corrected substrate height map of a first substrate using a height level sensor. The method comprises: sampling the first substrate by means of the height level sensor with the first substrate moving with a first velocity, wherein the first velocity is a first at least partially non-constant velocity of the first substrate with respect to the height level sensor, to generate a first height level data, generating a first height map based on the first height level data, and calculating a corrected substrate height map by subtracting a correction map from the first height map, wherein the correction map is calculated from the difference between a first velocity height map and a second velocity height map.

公开(公告)号：WO2021197747A1

公开(公告)日：2021-10-07

申请号：PCT/EP2021/055361

申请日：2021-03-03

Applicant: ASML NETHERLANDS B.V.

Inventor： VAN DER VOORT, Dennis, Dominic ,  TEN KATE, Nicolaas

IPC: G03F7/20 ,  G03F7/707 ,  G03F7/70783 ,  G03F7/70875

Abstract: The invention relates to a method for preparing a substrate for an exposure process of a lithographic manufacturing method, the method comprising imposing different local temperatures across the substrate so as to induce different thermal expansion across the substrate before the exposure process. This method is for compensating for deformation of the substrate induced when the substrate is positioned on a substrate table of a lithographic apparatus. The invention further relates to a local temperature applicator using this method and to a lithographic apparatus comprising such local temperature applicator.

公开(公告)号：WO2021144119A1

公开(公告)日：2021-07-22

申请号：PCT/EP2020/087160

申请日：2020-12-18

Applicant: ASML NETHERLANDS B.V.

Inventor： KRAMER, Gijs

IPC: G03F7/20 ,  H01L21/683 ,  B25J15/06 ,  B25J11/0095 ,  B25J15/0014 ,  B25J15/0616 ,  G03F7/70733 ,  G03F7/70783 ,  H01L21/67288 ,  H01L21/6838 ,  H01L21/68707

Abstract: The invention provides a suction clamp for clamping an object. The suction clamp comprises a base structure comprising a base and a connection area, and a first pad for receiving the object. The suction clamp further comprises a resilient member connecting the first pad to the connection area of the base structure such that the first pad is moveable relative to the base between a receiving position for receiving the object and a clamping position for clamping the object, wherein the resilient member is adapted to bias the first pad to the receiving position. The suction clamp further comprises a suction opening arranged in the base and adapted to be connected to a suction device for providing a suction force for clamping the object on the first pad.

公开(公告)号：WO2021144108A1

公开(公告)日：2021-07-22

申请号：PCT/EP2020/086442

申请日：2020-12-16

Applicant: ASML NETHERLANDS B.V.

Inventor： VAN HAL, Paulus, Albertus ,  KOEVOETS, Adrianus, Hendrik ,  SEOANE DE LA CUESTA, Beatriz

IPC: G03F7/16 ,  G03F7/20 ,  G03F7/167 ,  G03F7/707 ,  G03F7/70783 ,  G03F7/7095

Abstract: The present invention relates to a substrate with a backside surface configured to provide a friction switch when the substrate is loaded onto a substrate holder in a substrate-loading cycle, wherein said substrate backside surface comprises a molecular assembly comprising at least one high-interaction region and at least one low-interaction region. The invention further relates to methods using such a substrate and to methods for creating such a substrate.

公开(公告)号：WO2021259619A1

公开(公告)日：2021-12-30

申请号：PCT/EP2021/065079

申请日：2021-06-04

Applicant: ASML HOLDING N.V.

Inventor： UITTERDIJK, Tammo

IPC: G03F7/20 ,  H01L21/683 ,  G03F7/70691 ,  G03F7/70708 ,  G03F7/70783 ,  H01L21/67288 ,  H01L21/6831

Abstract: Systems, apparatuses, methods, and computer program products are provided for determining a free form flatness of a substrate table. An example system can include a substrate table that includes a first substrate table surface and a grounded substrate table electrical connection configured to ground the substrate table. The system can further include a substrate that includes a semiconducting layer, a thermally-grown insulating layer, a first substrate surface disposed on the insulating layer, and a substrate electrical connection configured to transmit a voltage to the semiconducting layer. The system can further include a metrology system configured to apply a voltage to the substrate electrical connection to electrostatically clamp the substrate to the substrate table, measure a flatness of the first substrate surface, and determine a free form flatness of the first substrate table surface based on the measured flatness of the first substrate surface.

公开(公告)号：WO2021148980A1

公开(公告)日：2021-07-29

申请号：PCT/IB2021/050459

申请日：2021-01-21

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： JACQUELINE, Sébastien ,  AUBRY, Yves ,  VOIRON, Frédéric

IPC: G03F7/20 ,  H01L27/02 ,  H01L23/00 ,  G03F1/38 ,  H01L29/66 ,  H01L29/94 ,  G03F1/00 ,  G03F7/70433 ,  G03F7/70783 ,  H01L23/562 ,  H01L27/0207 ,  H01L29/66181 ,  H01L29/945

Abstract: In the case of reproducing across a wafer (20) surface a first set of repetitions of an integrated circuit (10), the integrated circuit comprising structures extending in the thickness-direction of the wafer and comprising a first region (A) where the concentration of thickness-direction structures is high and a second region (B,C) where there are no thickness-direction structures or their concentration is low, and first regions (A) of the integrated circuits are aligned in rows extending in a first direction (P) across the wafer, wafer warpage can be reduced by providing compensation elements (30a) in the same wafer surface. The compensation elements (30a) each comprise a set of one or more slots, the slot depth extending in the thickness direction of the wafer, and the slot length extending in a second direction (Q) transverse to the first direction(P).

公开(公告)号：WO2021122065A1

公开(公告)日：2021-06-24

申请号：PCT/EP2020/084671

申请日：2020-12-04

Applicant: ASML NETHERLANDS B.V.

Inventor： BECKERS, Johan, Franciscus, Maria ,  DAVIES, Dylan John David ,  KOEVOETS, Adrianus, Hendrik ,  VAN HAL, Paulus, Albertus ,  SEOANE DE LA CUESTA, Beatriz ,  STEL, Bart, Willem ,  STEVENS, Lucas, Henricus, Johannes ,  TROMP, Siegfried, Alexander ,  ACHANTA, Satish ,  VAN KUILENBURG, Julien

IPC: G03F7/16 ,  G03F7/20 ,  H01L21/687 ,  G03F7/165 ,  G03F7/707 ,  G03F7/70783 ,  G03F7/7095 ,  H01L21/6875 ,  H01L21/68757

Abstract: The present invention relates to methods for reducing wafer load grid and flatness degradation of a substrate holder, such as a wafertable, of a lithographic apparatus. The present invention also relates to systems comprising lithography substrate holders, such as wafertables, with improved resistance to wafer load grid and flatness degradation, and to methods of fabricating devices, e.g. integrated circuits, using such systems. The present invention also relates to substrates, such as wafers, with backsides configured to protect substrate holders, such as wafertables, from wafer load grid and flatness degradation when used in lithography, and to methods of removing hydrophobic coatings from such substrates, such as wafers. The present invention has particular use in connection with lithographic apparatus for fabricating devices, for example integrated circuits.