Abstract:
A non-volatile semiconductor memory utilizes a sense amplifier to compare the logic state of a memory cell to that of a reference cell. Loads that supply currents to the memory cell and the reference cell form a current mirror, whose amplification factor is controllably dependent on the level of the supply voltage. This configuration renders the sensitivity of the amplifier higher with a lower supply voltage than with a higher supply voltage.
Abstract:
Methods, systems, and devices for link evaluation for a memory device are described. A memory device may receive signaling over a channel and may identify logic values encoded into the signaling based on sampling the signaling against a reference voltage. The sampling may occur at a reference time within a sampling period. To evaluate a quality (e.g., margin of error) of the channel, the memory device may adjust the reference voltage, the reference time, or both, and either the memory device or the host device may determine whether the memory device is still able to correctly identify logic values encoded into signaling over the channel. In some cases, the channel quality may be evaluated during a refresh cycle or at another opportunistic time for the memory device.
Abstract:
A memory includes an error detection circuit that identifies a faulty feature in an array of memory cells within the memory. A redundancy enable circuit functions to replace the faulty feature with a redundant feature. The error detection circuit and the redundancy enable circuit function concurrently with a read operation on the array of memory cells.
Abstract:
The present invention is related to a digital circuit testing and analysis module system comprising a memory (22). The memory (22) is addressed by numerical values defined by a group of digital signals. A respective memory location associated with a specific numerical value indicates a status of the group of digital signals. The status can for example reflect the validity of the signals in the group of signals when testing a circuit.
Abstract:
An on-chip test circuit in an integrated circuit memory device includes a test mode terminal and a test data storage circuit having an input coupled to a data terminal of the memory device and an output coupled to a memory-cell array in the memory device. The storage circuit further includes terminals adapted to receive respective read test data and write test data signals. The storage circuit stores bits of data applied on the data terminal when the write test data signal is active. The storage circuit provides on its output the bits of stored data when the read test data signal is active. An error detection circuit includes a first input coupled to the memory-cell array and a second input coupled to the output of the storage circuit. The error detection circuit develops an active error signal on an output when the data on its input is unequal. A test control circuit is coupled to the terminals of the test data storage circuit, and to the test mode terminal. When the test mode signal is active, the test control circuit operates in a first mode to transfer data on the data terminal into the storage circuit, and operates in a second mode to transfer data from the storage circuit to the memory cells in the array. The test control circuit then operates in a third mode to access data stored in the memory cells and in the storage circuit such that the error detection circuit compares the data stored in each addressed memory cell to the data initially transferred to that memory cell.
Abstract:
The present invention relates to a monolithic-integration test circuit used for checking a digital semi-conductor circuit formed on the same semi-conductor chip and comprising the following members: a plurality of elements to be checked; a checking-data model register for the intermediate storing of a checking-data model; a read- and write-circuit for writing data from the checking-data model register into the elements to be checked and for reading said data from said elements; and a comparison circuit (6) for determining whether or not a difference occurs between the written and read data in the elements to be checked. The test circuit comprises a model modification circuit (2) which can be actuated by an activation signal (3) and which modifies the checking-data model from the checking-data model register before writing the data in the elements to be checked.
Abstract:
A memory controller includes a generator circuit configured to generate a predetermined pattern of data, an address input, and a memory interface circuit. The memory interface circuit is configured to write the predetermined pattern of data to a memory at an address identified in the address input. The memory interface circuit is further configured to read a stored pattern of data from the memory at the address. The memory controller further includes an integrity checker circuit configured to compare the predetermined pattern of data and the stored pattern of data and identify an error of the memory based upon the comparison.
Abstract:
A method of detecting random telegraph noise defects in a memory includes initializing a first bit cell of the memory to a first value and reading the first value from the first bit cell. The method also includes writing a second value to the first bit cell and performing back to back read operations on a second bit cell adjacent to the first bit cell, after writing the second value. The method further includes attempting to read the second value from the first bit cell and determining whether the first bit cell is defective based on whether the second value was read from the first bit cell.
Abstract:
An integrated circuit (IC) is disclosed herein for embedded memory testing with storage borrowing. In an example aspect, an integrated circuit includes a functional logic block, a memory block, and test logic. The functional logic block includes multiple storage units and is configured to store functional data in the multiple storage units during a regular operational mode. The test logic is configured to perform a test on the memory block during a testing mode. The test logic is also configured to retain memory test result data in the multiple storage units of the functional logic block during the testing mode.
Abstract:
To test semiconductor memory, a printed-circuit board for burn-in or the semiconductor memory to be tested includes a comparator circuit to detect the coincidence between expected data and the data read from the semiconductor memory, and a counter circuit for counting the number of noncoincedences.