Abstract:
The present invention relates to a method (1800) for repairing at least one defect (320) of a sample (205, 300, 1500) using a focused particle beam (227), comprising the steps of: (a) producing (1850) at least one first local, electrically conductive sacrificial layer (400, 500) on the sample (205, 300, 1500), wherein the first local, electrically conductive sacrificial layer (400, 500) has a first portion (410, 510) and at least one second portion (420, 530, 540, 550, 560), wherein the first portion (410, 510) is adjacent to the at least one defect (320) and wherein the first portion (410, 510) and the at least one second portion (420, 530, 540, 550, 560) are electrically conductively connected to one another (570, 580); and (b) producing (1860) at least one first reference mark (425, 435, 445, 455, 535, 545, 555, 565) on the at least one second portion (420, 530, 540, 550, 560) of the first local, electrically conductive sacrificial layer (400, 500) for the purposes of correcting a drift of the focused particle beam (227) in relation to the at least one defect (320) while the at least one defect (320) is being repaired.
Abstract:
An ion implanter may include an ion source, arranged to generate a continuous ion beam, a DC acceleration system, to accelerate the continuous ion beam, as well as an AC linear accelerator to receive the continuous ion beam and to output a bunched ion beam. The ion implanter may also include an energy spreading electrode assembly, to receive the bunched ion beam and to apply an RF voltage between a plurality of electrodes of the energy spreading electrode assembly, along a local direction of propagation of the bunched ion beam.
Abstract:
Directed energy beam deflections are compensated by mapping pixel coordinates of an image of a patterning field to patterning field spatial coordinates. For example, electron beam scanning is compensated by imaging calibration features defined on a reticle to produce a mapping between pixel and physical coordinates. An electron beam is scanned to produce cathodoluminescence at a plurality of scan locations in a patterning field. With the pixel coordinate mapping, an image of the cathodoluminescence is used to determine compensated scan drive values. Other directed energy beam deflections can be similarly compensated.
Abstract:
An ion implantation has an ion source and a mass analyzer configured to form and mass analyze an ion beam. A bending element is positioned downstream of the mass analyzer, and respective first and second measurement apparatuses are positioned downstream and upstream of the bending element and configured to determine a respective first and second ion beam current of the ion beam. A workpiece scanning apparatus scans the workpiece through the ion beam. A controller is configured to determine an implant current of the ion beam at the workpiece and to control the workpiece scanning apparatus to control a scan velocity of the workpiece based on the implant current. The determination of the implant current of the ion beam is based, at least in part, on the first ion beam current and second ion beam current.
Abstract:
The present invention is directed to circuits, systems, and methods to quickly to quench an arc that may form between high voltage electrodes associated with an ion source to shorten the duration of the arc and mitigate non-uniform ion implantations. In one example, an arc detection circuit for detecting an arc in an ion implantation system includes an analog-to-digital converter (ADC) and an analysis circuit. The ADC is configured to convert a sensing current indicative of a current being supplied to an electrode in the ion implantation system to a digital current signal that quantifies the sensing current. The analysis circuit is configured to analyze the digital current signal to determine if the digital current signal meets threshold parameter value and in response to the digital current signal meeting the threshold parameter value, provide an arc detection signal to a trigger control circuit that activates an arc quenching mechanism.
Abstract:
A method for detecting electron beam filament wear in an electron beam source, the method comprising the steps of: enlarging a beam spot emanating from the electron beam source on a work table to a predetermined minimum size, capturing an image of the beam spot on the work table by a camera, comparing the captured image of the beam spot with a reference image, and detecting filament wear if the captured image is deviating more than a predetermined value from the reference image.
Abstract:
A system and method involve applying an electron beam to a sample and obtaining an image of the sample with the applied electron beam. An orientation of the sample relative to the sample's zone axis is automatically determined based on a distribution of reflections in the image. The orientation of the sample is automatically adjusted to align with the sample's zone axis based on the determined orientation.
Abstract:
Charge monitor apparatus and methods are provided for determining a cumulative charge experienced by a workpiece during ion implantation. In one aspect, a charge monitor having a Langmuir probe 126 is provided, wherein a positive and negative charge rectifier 136,138 are operably coupled to the probe and configured to pass only a positive and negative charges therethrough, respectively; a positive current integrator 140 is operably coupled to the positive charge rectifier 136, wherein the positive current integrator is biased via a positive threshold voltage 142, and wherein the positive current integrator is configured to output a positive dosage 144 based, at least in part, on the positive threshold voyage; a negative current integrator 150 is operably coupled to the negative charge rectifier 138, wherein the negative current integrator is biased via a negative threshold voltage 152, and wherein the negative current integrator is configured to output a negative dosage 154 based, at least in part, on the negative threshold voltage; a positive charge counter 146 and a negative charge counter 156 are configured to respectively receive the output from the positive current integrator and negative current integrator in order to provide a respective cumulative positive charge value 148 and cumulative negative charge value 158 associated with the respective positive charge and negative charge.
Abstract:
A system to control an ion beam in an ion implanter includes a detector system to detect a plurality of beam current measurements of the ion beam at a first frequency and an analysis component to determine a variation of the ion beam based upon the plurality of beam current measurements, the variation corresponding to a beam current variation of the ion beam at a second frequency different from the first frequency. The system also includes an adjustment component to adjust the ion beam in response to an output of the analysis component to reduce the variation, wherein the analysis component and the adjustment component are configured to dynamically reduce the variation of the ion beam below a threshold value while the ion beam is generated in the ion implanter.
Abstract:
The invention relates to an apparatus and method for inspecting a sample, provided with an optical microscope to observe a region of interest on a sample and a charged particle system generating a focused charged particle beam to observe or modify the same or parts of the same region of interest, the apparatus provided with a control unit for electronically controlling said systems, adapted for recording two or more spectrally separated images of the region of interest on the sample, the control unit adapted for acquiring processing and representing the images as detected with said optical and said charged particle microscope systems, the unit further adapted for performing a registration procedure mutually correlating a region of interest in the optical images, wherein the apparatus is adapted for using a detection of a change in the optical images as caused therein by the charged particle beam for correlating said images.