公开(公告)号：WO2022268500A1

公开(公告)日：2022-12-29

申请号：PCT/EP2022/065478

申请日：2022-06-08

Applicant: SIGNIFY HOLDING B.V.

Inventor： VAN BOMMEL, Ties

IPC: F21K9/232 ,  F21V23/04 ,  F21K9/68 ,  H01L25/075 ,  H01L33/58 ,  F21Y113/13 ,  F21Y115/10 ,  F21Y103/10 ,  F21Y2103/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/504 ,  H01L33/60

Abstract: A light emitting diode, LED, filament arrangement (100) arranged to emit LED filament arrangement light, comprising first and second LED filaments (110a, 110b) arranged to emit first and second LED filament light, respectively, wherein the first and second LED filaments elongate along a first axis, A, and comprise first and second arrays (120a, 120b) of a plurality of first and second LEDs (130a, 130b), a carrier (210) arranged to support the first and second LED filaments, at least one structure (160) arranged to at least partially redirect the first and second LED filament light, wherein the at least one structure is arranged adjacent at least one of the first and second LED filaments, and a controller (180) configured to individually control the operation of the first and second arrays of the plurality of first and second LEDs, respectively.

公开(公告)号：WO2023041266A1

公开(公告)日：2023-03-23

申请号：PCT/EP2022/072588

申请日：2022-08-11

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WIESMANN, Christopher ,  WANKERL, Heribert ,  KREINER, Laura ,  BUTENDEICH, Rainer ,  SOBCZYK, Sandra

IPC: H01L33/44 ,  H01L33/50 ,  H01L33/46 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L33/504

Abstract: Es wird ein strahlungsemittierendes Halbleiterbauteil (1) angegeben mit - einem strahlungsemittierenden Halbleiterchip (2), der dazu ausgebildet ist, elektromagnetische Strahlung mit einer ersten Peakwellenlänge (P1) auszusenden, - einem Konversionselement (3), das dazu ausgebildet ist, elektromagnetische Strahlung mit einer zweiten Peakwellenlänge (P2) auszusenden, und - einem dielektrischen Schichtenstapel (4), der auf dem strahlungsemittierenden Halbleiterchip (2) und dem Konversionselement (3) angeordnet ist, wobei - ein Transmissionsgrad des dielektrischen Schichtenstapels (4) für Strahlung mit der ersten Peakwellenlänge (P1) und für Strahlung mit der zweiten Peakwellenlänge (P2) in einem ersten Winkelbereich größer als ein Schwellenwert (TS) ist, - der Transmissionsgrad des dielektrischen Schichtenstapels (4) für Strahlung mit der ersten Peakwellenlänge (P1) und für Strahlung mit der zweiten Peakwellenlänge (P2) in einem zweiten Winkelbereich kleiner als der Schwellenwert (TS) ist. Des Weiteren werden ein Verfahren zur Auswahl eines dielektrischen Schichtenstapels und ein Verfahren zur Auswahl eines Konversionsmaterials eines Konversionselements für ein strahlungsemittierendes Halbleiterbauteil angegeben.

公开(公告)号：WO2022047010A1

公开(公告)日：2022-03-03

申请号：PCT/US2021/047722

申请日：2021-08-26

Applicant: APPLIED MATERIALS, INC.

Inventor： LUO, Yingdong ,  XU, Lisong ,  GANAPATHIAPPAN, Sivapackia ,  NG, Hou T. ,  KWAK, Byung Sung ,  ZHU, Mingwei ,  PATIBANDLA, Nag B.

IPC: H01L33/50 ,  H01L33/48 ,  H01L25/075 ,  H01L25/0753 ,  H01L27/156 ,  H01L2933/0041 ,  H01L33/005 ,  H01L33/06 ,  H01L33/504

Abstract: A light-emitting device includes a plurality of light-emitting diodes, a first cured composition over a first subset of the light-emitting diodes, and a second cured composition over a second subset of light-emitting diodes. The first cured composition includes a first photopolymer and a blue photoluminescent material that is an organic, organometallic, or polymeric material, embedded in the first photopolymer. The second cured composition includes a second photopolymer and a nanomaterial embedded in the second photopolymer. The nanomaterial is selected to emit red or green light in response.

公开(公告)号：WO2022002785A1

公开(公告)日：2022-01-06

申请号：PCT/EP2021/067479

申请日：2021-06-25

Applicant: AMS INTERNATIONAL AG

Inventor： ROENTGEN, Peter ,  ROSSI, Markus

IPC: H01L33/50 ,  H01S5/04 ,  H01L33/502 ,  H01L33/504 ,  H01L33/507

Abstract: A light source formed from semiconductor and comprising a stack of quantum wells supported by a substrate and configured to emit light at a plurality of wavelengths. The light source further comprises a first optical pump provided at one end of the stack and a second optical pump provided at an opposite end of the stack.

公开(公告)号：WO2021141353A1

公开(公告)日：2021-07-15

申请号：PCT/KR2021/000072

申请日：2021-01-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： AOKI, Dai

IPC: H01L33/50 ,  H01L33/04 ,  H01L27/156 ,  H01L33/504 ,  H01L33/60

Abstract: Disclosed herein is a light emitting device and a display apparatus capable of improving design freedom. A package is provided with light extraction regions LR, LG, and LB and a partition region D provided on an outside of the light extraction regions LR, LG, and LB. The package includes an LED provided in the light extraction regions LR, LG, and LB and configured to emit light of a predetermined wavelength range and wavelength conversion layers 13R, 13G and 13B provided in the light extraction regions LR, LG, and LB and configured to convert the wavelength of light emitted from the LED. The package includes a wall portion provided in the partition region D and a first laminated portion provided in the partition region D and including a material different from a material forming the wall portion.

公开(公告)号：WO2023023319A2

公开(公告)日：2023-02-23

申请号：PCT/US2022/040878

申请日：2022-08-19

Applicant: MAGNA ROHINNI AUTOMOTIVE, LLC

Inventor： BAILEY, Edward

IPC: H01L33/52 ,  H01L33/56 ,  H01L33/58 ,  H01L33/50 ,  H01L25/13 ,  H01L2933/0041 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505

Abstract: A wavelength conversion device includes an LED chip. A PCB solder mask defines an opening at least partially encompassing the LED chip. A lens is optically coupled with the LED chip and includes phosphor particles, emulsifier particles, and lens shaping particles each immersed within the lens. In various instances, the wavelength conversion device may be operably coupled with a vehicle to form various light effects.

公开(公告)号：WO2022256846A1

公开(公告)日：2022-12-08

申请号：PCT/US2022/072764

申请日：2022-06-04

Applicant: INTEMATIX CORPORATION

Inventor： WANG, Gang ,  LI, Yi-Qun

IPC: H01L33/50 ,  H01L25/075 ,  C09K11/616 ,  C09K11/646 ,  C09K11/77064 ,  C09K2211/182 ,  C09K2211/183 ,  C09K2211/186 ,  C09K2219/03 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/26 ,  H01L33/502 ,  H01L33/504

Abstract: A white light emitting device comprises: an LED that generates excitation light of wavelength from 420 nm to 480 nm; and photoluminescence materials that generate light with a peak emission wavelength from 500 nm to 650 nm comprising a broadband phosphor, and a manganese-activated narrowband red fluoride phosphor with a peak emission wavelength from 628 nm to 640 nm and a full width at half maximum of less than 30 nm. The device generates white light with a selected color temperature from 2200K to 6500K, a General Color Rendering Index, CRI Ra, of at least 80, and a Duv (Delta u, v) from 0.0060 to 0.0170 for the selected color temperature and wherein the device has an LER (Luminous Efficacy of Radiation) of at least 320 lm/Wopt.

公开(公告)号：WO2022084209A2

公开(公告)日：2022-04-28

申请号：PCT/EP2021/078730

申请日：2021-10-18

Applicant: MERCK PATENT GMBH

Inventor： HIRAYAMA, Yuki ,  KISHIMOTO, Tadashi ,  GOTO, Tomohisa ,  SATO, Hiromoto ,  GREINERT, Nils ,  SUZUKI, Teruaki

IPC: C09D11/037 ,  C08F2/00 ,  C09D11/101 ,  C09D11/38 ,  C09K11/02 ,  H01L33/00 ,  C08F2/48 ,  C08F2/50 ,  G02B6/005 ,  H01L33/504 ,  H01L33/507

Abstract: The present invention relates to a composition comprising at least one light emitting moiety.

公开(公告)号：WO2021198009A1

公开(公告)日：2021-10-07

申请号：PCT/EP2021/057713

申请日：2021-03-25

Applicant: PLESSEY SEMICONDUCTORS LIMITED

Inventor： WHITEMAN, John

IPC: H01L21/66 ,  H01L33/00 ,  H01L29/20 ,  H01L21/78 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/34 ,  H01L27/15 ,  H01L33/007 ,  H01L33/0093 ,  H01L33/0095 ,  H01L33/504 ,  H01L33/62

Abstract: A method of forming and testing a plurality of monolithic electronic devices is provided. As part of the method a monolithic device array comprising Group III-nitrides is formed on a sacrificial substrate. A test substrate comprising electrical contacts is aligned with electrical contacts of the monolithic device array and bonded to the monolithic device array via bonding dielectric layers. Power is supplied from the test substrate to test the monolithic devices of the monolithic device array. Portions of the sacrificial substrate are then selectively removed to separate each of the monolithic electronic devices, wherein a sacrificial dielectric layer is removed to separate each monolithic electronic device from the test substrate.

公开(公告)号：WO2022268700A1

公开(公告)日：2022-12-29

申请号：PCT/EP2022/066704

申请日：2022-06-20

Applicant: SIGNIFY HOLDING B.V.

Inventor： VAN BOMMEL, Ties

IPC: H01L25/075 ,  F21K9/64 ,  F21K9/65 ,  H01L33/50 ,  H01L33/54 ,  F21Y115/10 ,  F21K9/232 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2933/0091 ,  H01L33/504 ,  H01L33/507

Abstract: A LED filament (2,20) configured to provide LED filament light. The LED filament comprising an elongated carrier (7) extending in a lengthwise direction, said elongated carrier comprising a first major surface (7a). The LED filament further comprises a plurality of LEDs (8) arranged on said first major surface and configured to emit LED light, a first layer (9) free from a luminescent material encapsulating or covering said plurality of LEDs and at least partly encapsulating or covering said first major surface, said first elongated translucent layer having a width, W1, transverse to said lengthwise direction, and a second layer (10) comprising a luminescent material configured to partly convert said LED light, the second layer is arranged on an outer surface (9a) of said first layer, such that the second layer is contained within the width, W1, of the first layer.