Invention Grant
- Patent Title: Adhesive and method of encapsulating organic electronic device using the same
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Application No.: US14740006Application Date: 2015-06-15
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Publication No.: US10062855B2Publication Date: 2018-08-28
- Inventor: Hyun Jee Yoo , Yoon Gyung Cho , Suk Ky Chang , Jung Sup Shim , Suk Chin Lee , Kwang Jin Jeong
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2010-0108113 20101102; KR10-2011-0004054 20110114; KR10-2011-0113121 20111102
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L29/08 ; H01L51/00 ; H01L21/00 ; H01L51/52 ; H05B33/04 ; H01L51/56 ; C09J7/00 ; C09J163/00 ; H01L21/56 ; H01L23/28 ; H01L23/29 ; H01L23/00 ; C09J9/00 ; C09J11/04 ; C09J7/35 ; C09J7/10 ; C08K3/22 ; C08K3/34 ; C08K3/36 ; C08K3/16
Abstract:
An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.
Public/Granted literature
- US20150287940A1 ADHESIVE AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME Public/Granted day:2015-10-08
Information query
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