Invention Grant
- Patent Title: Apparatus and method for treating substrate
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Application No.: US15165020Application Date: 2016-05-26
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Publication No.: US10079142B2Publication Date: 2018-09-18
- Inventor: Dae Min Kim , Sul Lee , Bok Kyu Lee , Jae Myoung Lee
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-Do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-Do
- Agency: Carter, DeLuca, Farrell & Schmidt, LLP
- Priority: KR10-2015-0076524 20150529
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B15/00 ; C11D11/00 ; H01L21/67 ; H01L21/687
Abstract:
An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.
Public/Granted literature
- US20160351385A1 APPARATUS AND METHOD FOR TREATING SUBSTRATE Public/Granted day:2016-12-01
Information query
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