公开(公告)号：US10079142B2

公开(公告)日：2018-09-18

申请号：US15165020

申请日：2016-05-26

Applicant: SEMES CO., LTD.

Inventor： Dae Min Kim ,  Sul Lee ,  Bok Kyu Lee ,  Jae Myoung Lee

IPC: H01L21/02 ,  B08B15/00 ,  C11D11/00 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/02052 ,  B08B2203/0229 ,  C11D11/0047 ,  H01L21/67051 ,  H01L21/6875

Abstract: An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.

公开(公告)号：US20230212044A1

公开(公告)日：2023-07-06

申请号：US18148168

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Bok Kyu Lee ,  Byung Woo Sim ,  Yong Sun Ko ,  Young Seop Choi ,  Myung A Jeon

IPC: C02F1/78

CPC classification number: C02F1/78 ,  C02F2201/005 ,  C02F2209/001 ,  C02F2209/02 ,  C02F2209/23

Abstract: Disclosed is a method of decomposing ozone in ozone water. According to the present invention, a temperature of ozone water is increased by mixing ozone water with heated water, and the ozone in the ozone water is decomposed into oxygen by the increase in the temperature.

公开(公告)号：US11923219B2

公开(公告)日：2024-03-05

申请号：US16912762

申请日：2020-06-26

Applicant: SEMES CO., LTD.

Inventor： Youngseop Choi ,  Young Hun Lee ,  Yong-Jun Seo ,  Bok Kyu Lee ,  Miso Park

IPC: H01L21/67 ,  B08B3/08 ,  B08B7/04 ,  B08B13/00

CPC classification number: H01L21/67248 ,  B08B3/08 ,  B08B7/04 ,  B08B13/00 ,  H01L21/67051 ,  H01L21/67103 ,  H01L21/6719

Abstract: The inventive concept relates to an apparatus for treating a substrate. In an embodiment, the apparatus includes a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state, a support unit that supports the substrate in the process space, a fluid supply unit that supplies the fluid into the process space, a filler member disposed to face the substrate placed on the support unit in the process space, and a measurement unit that measures a state in the process space, the measurement unit being provided in the filler member.

公开(公告)号：US09406501B2

公开(公告)日：2016-08-02

申请号：US13905634

申请日：2013-05-30

Applicant: Semes Co., Ltd.

Inventor： Yong Hee Lee ,  Bok Kyu Lee ,  Jongsu Choi

IPC: B08B3/00 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02041 ,  H01L21/02052 ,  H01L21/67051

Abstract: Provided are an apparatus and a method of cleaning a substrate. The apparatus includes a substrate supporting unit supporting a substrate, a container surrounding the substrate supporting unit and collecting an organic solvent scattered from the substrate, and a fluid supplying unit provided on one side of the container and spraying a liquid organic solvent with bubbles to the substrate. The fluid supplying unit includes a nozzle head ejecting the organic solvent to the substrate, an organic solvent supplying line supplying the organic solvent from an organic solvent storage tank to the nozzle head, and a bubble providing element provided on the organic solvent supplying line and providing bubbles to the liquid organic solvent.

Abstract translation: 提供一种清洗基板的装置和方法。 该装置包括支撑基板的基板支撑单元，围绕基板支撑单元并收集从基板散射的有机溶剂的容器以及设置在容器的一侧上的流体供给单元，并且向液体有机溶剂喷射气泡 基质。 流体供给单元包括将有机溶剂喷射到基板的喷嘴头，将有机溶剂从有机溶剂容器供给到喷嘴头的有机溶剂供给管线和设置在有机溶剂供给管线上的气泡供给元件， 气泡到液体有机溶剂。

公开(公告)号：US20240042493A1

公开(公告)日：2024-02-08

申请号：US18219588

申请日：2023-07-07

Applicant: SEMES CO., LTD.

Inventor： Myung A. JEON ,  Young Seop Choi ,  Young Jin Kim ,  Eun Hyeok Choi ,  Bok Kyu Lee ,  Je Myung Cha ,  Kyu Hwan Chang

IPC: B08B3/02 ,  B08B3/08

CPC classification number: B08B3/022 ,  B08B3/024 ,  B08B3/08

Abstract: A spray unit in which a plurality of nozzle heads are integrally coupled and a substrate treatment apparatus including the spray unit are provided. The substrate treatment apparatus includes: a substrate support unit supporting a substrate and including a spin head, which rotates the substrate; a treatment liquid retrieval unit retrieving substrate treatment liquids used in treating the substrate; and a spray unit including a plurality of nozzle heads and pipes, which are connected to the nozzle heads, and providing the substrate treatment liquids onto the substrate through the nozzle heads and the pipes, wherein the nozzle heads are moved at the same time.

公开(公告)号：US20140060575A1

公开(公告)日：2014-03-06

申请号：US14012523

申请日：2013-08-28

Applicant: SEMES CO. LTD

Inventor： Kang Suk Lee ,  Jae Myoung Lee ,  Bok Kyu Lee ,  Yong Hee Lee ,  Jin Bok Lee

IPC: H01L21/02

CPC classification number: H01L21/02057 ,  H01L21/67028 ,  H01L21/6715

Abstract: Provided is a substrate treating method. The substrate treating method may include treating a substrate by using a chemical solution; rinsing the substrate by using pure water after treating the substrate by using the chemical solution; and treating the substrate by using an organic solvent, wherein the substrate treating method further includes coating the substrate with a hydrophobic membrane between the treating of the chemical solution and the treating of the organic solvent.

Abstract translation: 提供了一种基板处理方法。 基板处理方法可以包括使用化学溶液处理基板; 通过使用化学溶液处理基材后，使用纯水冲洗基材; 以及使用有机溶剂处理所述基材，其中所述基材处理方法还包括在所述化学溶液的处理和所述有机溶剂的处理之间用疏水膜涂覆所述基材。