发明授权
- 专利标题： Method and apparatus for assembling and testing a multi-integrated circuit package
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申请号： US15360187申请日： 2016-11-23
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公开(公告)号： US10096502B2公开(公告)日： 2018-10-09
- 发明人: Gamal Refai-Ahmed , Suresh Ramalingam , Mohsen H. Mardi , Tien-Yu Lee , Ivor G. Barber , Cheang-Whang Chang , Jaspreet Singh Gandhi
- 申请人： Xilinx, Inc.
- 申请人地址： US CA San Jose
- 专利权人： XILINX, INC.
- 当前专利权人： XILINX, INC.
- 当前专利权人地址： US CA San Jose
- 代理商 Robert M. Brush
- 主分类号： B23P21/00
- IPC分类号： B23P21/00 ; H01L21/673 ; H01L21/67 ; H01L23/00 ; H01L23/31 ; H01L23/367 ; H01L21/48 ; H01L21/56
摘要：
An example clamping assembly tray for packaging a semiconductor device includes a frame having a bottom surface and side walls extending from the bottom surface that define a cavity; and a compressible member disposed on the bottom surface of the frame within the cavity, where a top portion of the compressible member provides a support surface for supporting the semiconductor device, the support surface being between the bottom surface and a top edge of the side walls.
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