Invention Grant
- Patent Title: Semiconductor device structure and method for forming the same
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Application No.: US15475294Application Date: 2017-03-31
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Publication No.: US10164037B2Publication Date: 2018-12-25
- Inventor: Ker-Hsiao Huo , Kong-Beng Thei , Chih-Wen Albert Yao , Fu-Jier Fan , Chen-Liang Chu , Ta-Yuan Kung , Yi-Huan Chen , Yu-Bin Zhao , Ming-Ta Lei , Li-Hsuan Yeh
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/28 ; H01L29/40 ; H01L29/06 ; H01L29/08

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate having a top surface, a source region, and a drain region. The semiconductor device structure includes a gate structure over the top surface and extending into the semiconductor substrate. The gate structure in the semiconductor substrate is between the source region and the drain region and separates the source region from the drain region. The semiconductor device structure includes an isolation structure in the semiconductor substrate and surrounding the source region, the drain region, and the gate structure in the semiconductor substrate.
Public/Granted literature
- US20180286960A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2018-10-04
Information query
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