Invention Grant
- Patent Title: Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuck
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Application No.: US15446059Application Date: 2017-03-01
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Publication No.: US10199255B2Publication Date: 2019-02-05
- Inventor: Ingo Muri , Alexander Binter , Bernhard Goller , Christian Grindling
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologioes AG
- Current Assignee: Infineon Technologioes AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/683 ; B23C3/13 ; B23Q3/08 ; H01L21/67 ; H01L21/304
Abstract:
According to various embodiments, a workpiece planarization arrangement may include: a chuck including at least one portion configured to support one or more workpieces; and a planarization tool configured to planarize the at least one portion of the chuck and to planarize one or more workpieces on the at least one portion of the chuck; wherein the at least one portion of the chuck includes at least one of particles, pores and/or a polymer.
Public/Granted literature
Information query
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