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公开(公告)号:US09862037B2
公开(公告)日:2018-01-09
申请号:US15065914
申请日:2016-03-10
Applicant: Infineon Technologies AG
Inventor: Ingo Muri , Alexander Binter , Bernhard Goller , Christian Grindling
IPC: B23C3/13 , B23Q3/08 , H01L21/683 , H01L21/67 , H01L21/304
CPC classification number: B23C3/13 , B23Q3/088 , H01L21/304 , H01L21/67092 , H01L21/6838 , H01L21/6875 , H01L21/68757 , Y10T279/11 , Y10T409/3042
Abstract: According to various embodiments, a workpiece planarization arrangement may include: a chuck including a support carrier; and a workpiece-support replaceably mounted on the support carrier; and a planarization tool configured to planarize the at least one portion of the workpiece-support and to planarize one or more workpieces on the at least one portion of the workpiece-support.
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公开(公告)号:US10199255B2
公开(公告)日:2019-02-05
申请号:US15446059
申请日:2017-03-01
Applicant: Infineon Technologies AG
Inventor: Ingo Muri , Alexander Binter , Bernhard Goller , Christian Grindling
IPC: H01L21/687 , H01L21/683 , B23C3/13 , B23Q3/08 , H01L21/67 , H01L21/304
Abstract: According to various embodiments, a workpiece planarization arrangement may include: a chuck including at least one portion configured to support one or more workpieces; and a planarization tool configured to planarize the at least one portion of the chuck and to planarize one or more workpieces on the at least one portion of the chuck; wherein the at least one portion of the chuck includes at least one of particles, pores and/or a polymer.
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