公开(公告)号：US09862037B2

公开(公告)日：2018-01-09

申请号：US15065914

申请日：2016-03-10

Applicant: Infineon Technologies AG

Inventor： Ingo Muri ,  Alexander Binter ,  Bernhard Goller ,  Christian Grindling

IPC: B23C3/13 ,  B23Q3/08 ,  H01L21/683 ,  H01L21/67 ,  H01L21/304

CPC classification number: B23C3/13 ,  B23Q3/088 ,  H01L21/304 ,  H01L21/67092 ,  H01L21/6838 ,  H01L21/6875 ,  H01L21/68757 ,  Y10T279/11 ,  Y10T409/3042

Abstract: According to various embodiments, a workpiece planarization arrangement may include: a chuck including a support carrier; and a workpiece-support replaceably mounted on the support carrier; and a planarization tool configured to planarize the at least one portion of the workpiece-support and to planarize one or more workpieces on the at least one portion of the workpiece-support.

公开(公告)号：US10199255B2

公开(公告)日：2019-02-05

申请号：US15446059

申请日：2017-03-01

Applicant: Infineon Technologies AG

Inventor： Ingo Muri ,  Alexander Binter ,  Bernhard Goller ,  Christian Grindling

IPC: H01L21/687 ,  H01L21/683 ,  B23C3/13 ,  B23Q3/08 ,  H01L21/67 ,  H01L21/304

Abstract: According to various embodiments, a workpiece planarization arrangement may include: a chuck including at least one portion configured to support one or more workpieces; and a planarization tool configured to planarize the at least one portion of the chuck and to planarize one or more workpieces on the at least one portion of the chuck; wherein the at least one portion of the chuck includes at least one of particles, pores and/or a polymer.