- 专利标题： Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipment
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申请号： US15452062申请日： 2017-03-07
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公开(公告)号： US10233554B2公开(公告)日： 2019-03-19
- 发明人: Yogita Pareek , Laksheswar Kalita , Geetika Bajaj , Kevin A. Papke , Ankur Kadam , Bipin Thakur , Yixing Lin , Dmitry Lubomirsky , Prerna S. Goradia
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patteron + Sheridan LLP
- 主分类号： C25D3/44
- IPC分类号： C25D3/44 ; C25D3/66 ; C25D5/18 ; C25D5/48 ; C25D5/50 ; C25D11/04 ; H01L21/67 ; C25D5/02
摘要：
The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.
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