Invention Grant
- Patent Title: Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipment
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Application No.: US15452062Application Date: 2017-03-07
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Publication No.: US10233554B2Publication Date: 2019-03-19
- Inventor: Yogita Pareek , Laksheswar Kalita , Geetika Bajaj , Kevin A. Papke , Ankur Kadam , Bipin Thakur , Yixing Lin , Dmitry Lubomirsky , Prerna S. Goradia
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patteron + Sheridan LLP
- Main IPC: C25D3/44
- IPC: C25D3/44 ; C25D3/66 ; C25D5/18 ; C25D5/48 ; C25D5/50 ; C25D11/04 ; H01L21/67 ; C25D5/02
Abstract:
The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.
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