Invention Grant
- Patent Title: Method of patterning a metal on a transparent conductor
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Application No.: US15318689Application Date: 2015-06-12
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Publication No.: US10237985B2Publication Date: 2019-03-19
- Inventor: Muthu Sebastian , Fong Liang Tan
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Jonathan L. Tolstedt
- International Application: PCT/US2015/035541 WO 20150612
- International Announcement: WO2015/200008 WO 20151230
- Main IPC: H05K3/46
- IPC: H05K3/46 ; G06F3/041 ; H01L31/18 ; C23C14/00 ; H05K3/16 ; H05K3/38 ; G06F3/044 ; C23C14/08 ; C23C14/14 ; C23C14/34 ; C23C18/16 ; C23C18/38 ; C23C18/42 ; C25D3/38 ; C25D3/46 ; C25D5/48 ; C25D5/54 ; G03F7/20 ; G03F7/40 ; H05K1/02 ; H05K1/09 ; H05K3/06 ; C25D7/00

Abstract:
The present disclosure provides a method to provide a conductive bus bar on a patterned transparent conductor, such as ITO traces used for touch screen manufacturing. The method can be a cheaper and a more convenient technique to pattern a conductive metal or metal alloy, such as copper, silver, or a copper/silver/titanium alloy, on ITO electrodes in a roll-to-roll process.
Public/Granted literature
- US20170135229A1 METHOD OF PATTERNING A METAL ON A TRANSPARENT CONDUCTOR Public/Granted day:2017-05-11
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