Invention Grant
- Patent Title: Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist film
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Application No.: US13725483Application Date: 2012-12-21
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Publication No.: US10248019B2Publication Date: 2019-04-02
- Inventor: Shohei Kataoka , Kaoru Iwato , Kana Fujii , Sou Kamimura , Yuichiro Enomoto , Keita Kato , Shuhei Yamaguchi
- Applicant: FUJIFILM CORPORATION
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-145618 20100625; JP2010-286766 20101222
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C07C303/32 ; C07C309/04 ; C07C309/06 ; C07C309/07 ; C07C309/10 ; C07C309/12 ; C07C309/13 ; C07C309/14 ; C07D211/96 ; G03F7/039 ; G03F7/20 ; G03F7/32 ; G03F7/075 ; G03F7/11
Abstract:
A pattern forming, method, includes: (i) forming a film from an actinic ray-sensitive or radiation-sensitive resin composition that contains (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation and decomposing by an action of an acid to decrease a solubility of the compound (A) for an organic solvent; (ii) exposing the film; and (iii) performing development by using a developer containing an organic solvent.
Public/Granted literature
- US20130122427A1 PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM Public/Granted day:2013-05-16
Information query
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