Light emitting device package, method of manufacturing the same, backlight unit and display device including the same
Abstract:
A light emitting device package includes a package frame in which a recessed portion is defined in a center thereof, the package frame including, an interior wall surrounding the recessed portion, a step portion contacting the interior wall and a bottom surface of the recessed portion, a light source disposed inside the recessed portion and emitting first light, a substrate disposed on the light source, and fixed on an upper surface of the step portion and spaced apart from the light source, a light conversion layer disposed on the substrate and including quantum dots that absorbs the first light and emits second light having a different wavelength from the first light, and barrier layer at least covering the light conversion layer, where barrier layer includes a first inorganic barrier layer and a first organic barrier layer.
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