Invention Grant
- Patent Title: Light emitting device package, method of manufacturing the same, backlight unit and display device including the same
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Application No.: US15863871Application Date: 2018-01-06
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Publication No.: US10326057B2Publication Date: 2019-06-18
- Inventor: Tae Hyung Kim , Chul Hee Yoo , Hyun A Kang , Jung Woo Lee , Jeong Hee Lee , Eun Joo Jang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Cantor Colburn LLP
- Priority: KR10-2017-0003130 20170109
- Main IPC: H01L29/18
- IPC: H01L29/18 ; H01L33/48 ; H01L33/50 ; H01L33/54 ; H01L33/44 ; H01L33/56 ; H01L33/60

Abstract:
A light emitting device package includes a package frame in which a recessed portion is defined in a center thereof, the package frame including, an interior wall surrounding the recessed portion, a step portion contacting the interior wall and a bottom surface of the recessed portion, a light source disposed inside the recessed portion and emitting first light, a substrate disposed on the light source, and fixed on an upper surface of the step portion and spaced apart from the light source, a light conversion layer disposed on the substrate and including quantum dots that absorbs the first light and emits second light having a different wavelength from the first light, and barrier layer at least covering the light conversion layer, where barrier layer includes a first inorganic barrier layer and a first organic barrier layer.
Public/Granted literature
Information query
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