Invention Grant
- Patent Title: Method for improving adhesion between ceramic carrier and thick film circuit
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Application No.: US16158239Application Date: 2018-10-11
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Publication No.: US10362684B1Publication Date: 2019-07-23
- Inventor: Chia-Ting Lin , Jlin-Fuh Yau , Chung-Yen Lu , Yang-Kuo Kuo
- Applicant: National Chung-Shan Institute of Science and Technology
- Applicant Address: TW Taoyuan
- Assignee: National Chung-Shan Institute of Science and Technology
- Current Assignee: National Chung-Shan Institute of Science and Technology
- Current Assignee Address: TW Taoyuan
- Agent Winston Hsu
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/09 ; H05K3/00 ; H05K3/02 ; H05K3/24 ; B32B18/00 ; C04B41/45 ; C04B41/51 ; C04B41/88 ; H05K3/12 ; H05K1/03 ; H05K3/34
Abstract:
The present invention relates to a method for improving adhesion between ceramic and a thick film circuit. The method is particularly directed to accelerate the formation of a ceramic-metal eutectic phase between the ceramic carrier and the metal circuit by solid-phase diffusion bonding under a positive atmosphere. A metallic conductive slurry or its oxide slurry is printed on the surface of the ceramic carrier to form a circuit pattern by a thick film screen printing. The ceramic carrier is placed in an oven with temperature controlled by a program under a positive-pressure atmosphere of an inert gas including nitrogen, hydrogen or their mixtures. An eutectic phase is formed between the ceramic carrier and the metal circuit under a high temperature eutectic condition to increase the adhesion between the ceramic carrier and the thick film circuit.
Information query
