公开(公告)号：US10362684B1

公开(公告)日：2019-07-23

申请号：US16158239

申请日：2018-10-11

Applicant: National Chung-Shan Institute of Science and Technology

Inventor： Chia-Ting Lin ,  Jlin-Fuh Yau ,  Chung-Yen Lu ,  Yang-Kuo Kuo

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/02 ,  H05K3/24 ,  B32B18/00 ,  C04B41/45 ,  C04B41/51 ,  C04B41/88 ,  H05K3/12 ,  H05K1/03 ,  H05K3/34

Abstract: The present invention relates to a method for improving adhesion between ceramic and a thick film circuit. The method is particularly directed to accelerate the formation of a ceramic-metal eutectic phase between the ceramic carrier and the metal circuit by solid-phase diffusion bonding under a positive atmosphere. A metallic conductive slurry or its oxide slurry is printed on the surface of the ceramic carrier to form a circuit pattern by a thick film screen printing. The ceramic carrier is placed in an oven with temperature controlled by a program under a positive-pressure atmosphere of an inert gas including nitrogen, hydrogen or their mixtures. An eutectic phase is formed between the ceramic carrier and the metal circuit under a high temperature eutectic condition to increase the adhesion between the ceramic carrier and the thick film circuit.