Invention Grant
- Patent Title: Ebeam staggered beam aperture array
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Application No.: US15122620Application Date: 2014-12-19
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Publication No.: US10386722B2Publication Date: 2019-08-20
- Inventor: Yan A. Borodovsky , Donald W. Nelson , Mark C. Phillips
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2014/071659 WO 20141219
- International Announcement: WO2015/191104 WO 20151217
- Main IPC: G06F7/20
- IPC: G06F7/20 ; G03F9/00 ; H01J3/14 ; H01J37/04 ; H01J37/20 ; H01J37/30 ; H01J37/302 ; H01J37/317 ; H01L21/027 ; H01L21/311 ; G03F7/20 ; G21K5/10

Abstract:
Lithographic apparatuses suitable for, and methodologies involving, complementary e-beam lithography (CEBL) are described. In an example, a blanker aperture array (BAA) for an e-beam tool includes a first column of openings along a first direction and having a pitch. The BAA also includes a second column of openings along the first direction and staggered from the first column of openings. The second column of openings has the pitch. A scan direction of the BAA is along a second direction, orthogonal to the first direction.
Public/Granted literature
- US20170076906A1 EBEAM STAGGERED BEAM APERTURE ARRAY Public/Granted day:2017-03-16
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